18377280. CHIP PACKAGE WITH A THERMAL CARRIER (Advanced Micro Devices, Inc.)
CHIP PACKAGE WITH A THERMAL CARRIER
Organization Name
Inventor(s)
Hemanth Kumar Dhavaleswarapu of Austin TX US
Chandra Sekhar Mandalapu of Lehi UT US
Sriram Chandrasekaran of Austin TX US
CHIP PACKAGE WITH A THERMAL CARRIER
This abstract first appeared for US patent application 18377280 titled 'CHIP PACKAGE WITH A THERMAL CARRIER
Original Abstract Submitted
A chip package and method for fabricating the same are provided that include a IC dies bonded to a thermal carrier having a plurality of metallic pillars. In one example, a chip package includes an interconnect routing structure and a first die disposed on a first surface of the interconnect routing structure. The first die has a circuitry connected to a circuitry of the interconnect routing structure. The chip package also includes a second die at least partially disposed over the first die. The second die has a circuitry connected to the circuitry of the first die. A thermal carrier is bonded on the second die. At least one of the thermal carrier, the first die, or the second die includes a plurality of metallic pillars configured to transfer heat, wherein the plurality of metallic pillars are electrically floating.