18376271. OPTICAL DEVICE ASSEMBLY AND METHOD OF MANUFACTURING SAME (HUAWEI TECHNOLOGIES CO., LTD.)
OPTICAL DEVICE ASSEMBLY AND METHOD OF MANUFACTURING SAME
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OPTICAL DEVICE ASSEMBLY AND METHOD OF MANUFACTURING SAME
This abstract first appeared for US patent application 18376271 titled 'OPTICAL DEVICE ASSEMBLY AND METHOD OF MANUFACTURING SAME
Original Abstract Submitted
An optical device (OD), a semiconductor wafer structure (SWS) and a method of making the same are provided. The OD has a first semiconductor member (FSM), a second semiconductor member (SSM) and an OD mount. The OD mount has an optical component whose function is to receive an optical beam (OB) from a source and provide the OB to a destination. A portion of the OD mount is held in a cavity defined by the FSM and the SSM. The OD mount is fixedly secured to the FSM and to the SSM. The FSM and the SSM are also fixedly secured to each other. The OD may be integrated in opto-electrical device. Having the support portion of the OD mount held in place in the cavity minimizes movement of OD mount during operation of the OE device, thereby minimizing movement of the optical beam. The SWS comprises multiples instances of the OD. Manufacturing the SWS is achieved using passive optical alignment.