18370835. SYSTEMS AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES (Tokyo Electron Limited)
SYSTEMS AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Eric Chih-Fang Liu of Albany NY US
SYSTEMS AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES
This abstract first appeared for US patent application 18370835 titled 'SYSTEMS AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Original Abstract Submitted
A method for fabricating semiconductor devices includes forming an opening. The method includes forming a blanket layer along vertical sidewalls of the opening. The method includes etching through the first recess through a first source/drain structure of the first semiconductor channel. The method includes filling the first recess with a dielectric material. The method includes removing the blanket layer between the dielectric material and the sidewall, to define a second and third recess opposite the dielectric material. The method includes etching the surface of the semiconductor device to define a fourth recess above a second source/drain structure of the first semiconductor channel. The method includes extending the third and fourth recesses through the first and second source/drain structures of the first semiconductor channel, to a first and second source/drain structure of the second semiconductor channel.