SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18337040 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

A semiconductor device includes a bridge carrier, a first die, a second die, a first encapsulant, a cap carrier, a third die, and a second encapsulant. The bridge carrier includes a carrier substrate and a bridge redistribution structure disposed on the carrier substrate. The first die and the second die are disposed side by side on the bridge carrier. The bridge redistribution structure electrically connects the first die and the second die. The first encapsulant laterally encapsulates the first die and the second die. The cap carrier is disposed over the first die and the second die. The third die is located between the first die and the cap carrier. The second encapsulant laterally encapsulates the third die.