18333000. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Pil Hoon Jung of Icheon-si (KR)
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18333000 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
The abstract describes a manufacturing method for a semiconductor device involving the formation of a stack with alternating first and second material layers, the creation of an inorganic material-containing polymer mask with a stepped structure on the stack, and the formation of a second stepped structure in the stack by etching using the polymer mask as a barrier.
- Formation of a stack with alternating first and second material layers
- Creation of an inorganic material-containing polymer mask with a stepped structure
- Etching of the stack to form a second stepped structure using the polymer mask as a barrier
Potential Applications: - Semiconductor manufacturing - Electronics industry - Nanotechnology research
Problems Solved: - Improved precision in semiconductor device manufacturing - Enhanced control over etching processes - Increased efficiency in stack formation
Benefits: - Higher quality semiconductor devices - Cost-effective manufacturing process - Enhanced performance and reliability of electronic components
Commercial Applications: Title: Advanced Semiconductor Manufacturing Method This technology can be utilized in the production of various semiconductor devices, such as microprocessors, memory chips, and sensors. It has the potential to revolutionize the semiconductor industry by offering a more efficient and precise manufacturing process.
Questions about the technology: 1. How does this manufacturing method compare to traditional semiconductor fabrication techniques? 2. What are the potential scalability challenges of implementing this method in mass production?
Frequently Updated Research: Researchers are continually exploring new materials and techniques to further enhance the efficiency and precision of semiconductor device manufacturing. Stay updated on the latest advancements in this field to leverage cutting-edge technologies for your applications.
Original Abstract Submitted
A manufacturing method of a semiconductor device may include: forming a stack including first material layers and second material layers that are alternately stacked; forming, on the stack, an inorganic material-containing polymer mask including a first stepped structure; and forming a second stepped structure in the stack by etching the stack using the polymer mask as an etching barrier.
