18319349. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Joon Seuk Lee of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18319349 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application includes a substrate with chip areas and a scribe lane area between them, a first stack in the scribe lane area consisting of alternating first material layers and second material layers, and alignment keys within the first stack with protrusion parts on the upper surface.
- The semiconductor device features a unique first stack design with alternating material layers for improved performance.
- The alignment keys with protrusion parts aid in precise alignment and assembly of the semiconductor device.
- The scribe lane area allows for efficient separation of individual chips on the substrate during manufacturing.
- The innovative design of the first stack contributes to the overall reliability and functionality of the semiconductor device.
- The alignment keys play a crucial role in ensuring accurate positioning of components within the semiconductor device.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit production
Problems Solved: - Improved alignment and assembly processes in semiconductor devices - Enhanced reliability and performance of semiconductor components
Benefits: - Increased efficiency in semiconductor manufacturing - Higher precision and accuracy in component alignment - Improved overall functionality and reliability of semiconductor devices
Commercial Applications: Title: Advanced Semiconductor Device Manufacturing Technology This technology can be utilized in the production of various semiconductor devices, leading to more efficient manufacturing processes and higher quality end products. The market implications include increased competitiveness in the electronics industry and potential cost savings for manufacturers.
Questions about Semiconductor Device Manufacturing Technology: 1. How does the design of the first stack contribute to the performance of the semiconductor device? The alternating material layers in the first stack enhance the functionality and reliability of the semiconductor device by providing a unique structure for improved performance.
2. What role do the alignment keys play in the assembly process of the semiconductor device? The alignment keys with protrusion parts ensure precise alignment and positioning of components within the semiconductor device, leading to accurate assembly and improved overall functionality.
Original Abstract Submitted
A semiconductor device may include a substrate including chip areas and a scribe lane area that is disposed between the chip areas, a first stack disposed in the scribe lane area and including first material layers and second material layers that are alternately stacked, and alignment keys disposed within the first stack including first protrusion parts that protrude from an upper surface of the first stack, respectively.
