18294099. CAMERA DEVICE AND OPTICAL INSTRUMENT simplified abstract (LG INNOTEK CO., LTD.)
CAMERA DEVICE AND OPTICAL INSTRUMENT
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CAMERA DEVICE AND OPTICAL INSTRUMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18294099 titled 'CAMERA DEVICE AND OPTICAL INSTRUMENT
The camera device described in the patent application consists of a moving unit and a fixed unit, with an image sensor positioned in a hole in the first board of the moving unit.
- Moving unit includes a first heat dissipation member, a first board with a hole for the image sensor, and an image sensor.
- Fixed unit includes a second board and a second heat dissipation member.
- Support member allows the moving unit to move relative to the fixed unit in a direction perpendicular to the optical-axis direction.
- Image sensor is coupled to the first heat dissipation member.
- Second heat dissipation member overlaps the first heat dissipation member in the optical-axis direction.
Potential Applications: - Surveillance cameras - Photography equipment - Video recording devices
Problems Solved: - Efficient heat dissipation for image sensors - Improved stability and movement capabilities in camera devices
Benefits: - Enhanced image quality due to improved heat management - Increased durability and longevity of camera devices
Commercial Applications: Title: Advanced Heat Dissipation Camera Technology for Enhanced Imaging This technology can be utilized in the development of high-quality surveillance cameras, professional photography equipment, and advanced video recording devices, catering to a wide range of industries such as security, photography, and entertainment.
Questions about the technology: 1. How does the heat dissipation system in this camera device improve image quality? 2. What are the potential cost implications of implementing this technology in commercial camera products?
Original Abstract Submitted
A camera device of the disclosure includes a moving unit, including a first heat dissipation member, a first board disposed on the first heat dissipation member and including a hole to expose a portion of the first heat dissipation member, and an image sensor disposed in the hole, a fixed unit, including a second board disposed so as to be spaced apart from the first heat dissipation member and a second heat dissipation member disposed on the second board, and a support member, configured to support the moving unit to move relative to the fixed unit in a direction perpendicular to an optical-axis direction. The image sensor is coupled to the first heat dissipation member, and the second heat dissipation member is disposed so as to be spaced apart from the first heat dissipation member and to overlap the first heat dissipation member in the optical-axis direction.