18289065. Pouch Molding Apparatus and Method simplified abstract (LG ENERGY SOLUTION, LTD.)
Pouch Molding Apparatus and Method
Organization Name
Inventor(s)
Dong Hyeuk Park of Daejeon (KR)
Pouch Molding Apparatus and Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 18289065 titled 'Pouch Molding Apparatus and Method
Simplified Explanation: The patent application describes a pouch molding apparatus and method that deforms a pouch to increase its capacity, improving the pouch molding process.
- The apparatus includes a die with a die groove and a punch with pressing parts.
- The punch is inserted into the die groove along with a pouch film to mold the pouch.
- Pressing parts on the punch press the pouch film towards the inner surface of the die groove.
Key Features and Innovation:
- Deforming pouch to increase capacity
- Die groove and punch design
- Pressing parts for molding process
Potential Applications: The technology can be used in manufacturing processes that involve pouch molding, such as packaging and food industries.
Problems Solved:
- Limited capacity of pouches
- Inefficient pouch molding process
Benefits:
- Increased pouch capacity
- Improved pouch molding efficiency
Commercial Applications: Potential commercial applications include packaging production lines and food processing facilities.
Prior Art: Readers can explore prior art related to pouch molding techniques and apparatus in the packaging and manufacturing industries.
Frequently Updated Research: Stay updated on advancements in pouch molding technology and related manufacturing processes.
Questions about Pouch Molding Technology: 1. How does the pouch molding apparatus improve the capacity of pouches? 2. What are the key components of the pouch molding apparatus and method?
Original Abstract Submitted
A pouch molding apparatus and method involves deforming a pouch so that a larger amount of clearance is secured to increase the capacity of the pouch, thereby improving the pouch molding process to increase the depth and capacity of a pouch cup part. The pouch molding apparatus includes a die and a punch. The die has a die groove recessed therein in a shape configured to mold a pouch. The punch is disposed above the die groove, wherein the punch includes a body part configured to be inserted into the die groove together with a pouch film disposed between the die and the punch, and pressing parts are provided on opposite sides of the body part to press the pouch film toward an inner surface of the die groove.