BACKLIGHT MODULE AND DISPLAY DEVICE

Organization Name

Inventor(s)

BACKLIGHT MODULE AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18272567 titled 'BACKLIGHT MODULE AND DISPLAY DEVICE

The abstract describes a backlight module and a display device, with components including a backplane, a lamp board, a thermally conductive connecting layer, and a heat dissipation assembly.

The backplane has two surfaces, with the lamp board placed on the first surface.
A thermally conductive connecting layer is positioned between the lamp board and the backplane, connecting to the lamp board.
A heat dissipation assembly is located on the second surface of the backplane, passing through the backplane to connect to the thermally conductive connecting layer.

Key Features and Innovation:

Integration of a thermally conductive connecting layer for efficient heat dissipation.
Design that allows for effective cooling of the lamp board, enhancing overall performance.
Utilization of a heat dissipation assembly to manage heat generated by the lamp board.

Potential Applications:

LED displays
LCD monitors
Automotive displays

Problems Solved:

Overheating issues in backlight modules
Inefficient heat dissipation in display devices

Benefits:

Improved performance and longevity of display devices
Enhanced thermal management for better overall functionality

Commercial Applications:

Manufacturing of LED TVs
Production of computer monitors
Development of vehicle dashboard displays

Questions about the technology: 1. How does the thermally conductive connecting layer improve heat dissipation in the backlight module? 2. What are the specific advantages of using a heat dissipation assembly in this display device?

Frequently Updated Research: Ongoing studies on advanced heat dissipation techniques in display technology.

Original Abstract Submitted

A backlight module and a display device. The backlight module includes a backplane (), a lamp board (), a thermally conductive connecting layer (), and a heat dissipation assembly (), the backplane () has a first surface and a second surface, which are opposite each other; the lamp board () is arranged on the first surface of the backplane (); the thermally conductive connecting layer () is arranged between the lamp board () and the backplane (), and the thermally conductive connecting layer () is connected to the lamp board (); the heat dissipation assembly () is arranged on the second surface of the backplane (), and the heat dissipation assembly () passes through the backplane () and is then connected to the thermally conductive connecting layer ().