18257385. DISPLAY MODULE AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
DISPLAY MODULE AND DISPLAY DEVICE
Organization Name
BOE Technology Group Co., Ltd.
Inventor(s)
DISPLAY MODULE AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18257385 titled 'DISPLAY MODULE AND DISPLAY DEVICE
Simplified Explanation:
The patent application describes a display module that includes a display panel, bonding circuit boards, chip-on-films, and buffer devices. The bonding circuit boards have first differential lines, each consisting of a P-polarity and an N-polarity sub-line. The chip-on-films are connected to the first differential lines and the display panel. Buffer devices on the bonding circuit boards reduce signal reflection between the first differential lines and the chip-on-films.
- The display module includes a display panel, bonding circuit boards, chip-on-films, and buffer devices.
- The bonding circuit boards have first differential lines with P-polarity and N-polarity sub-lines.
- Chip-on-films are connected to the first differential lines and the display panel.
- Buffer devices on the bonding circuit boards reduce signal reflection between the first differential lines and the chip-on-films.
Potential Applications:
This technology can be used in various display applications such as TVs, monitors, smartphones, and tablets. It can also be applied in automotive displays, medical devices, and industrial equipment.
Problems Solved:
The technology addresses issues related to signal reflection in display modules, ensuring better signal quality and performance.
Benefits:
The technology improves signal transmission efficiency, reduces signal reflection, and enhances overall display performance. It also contributes to the reliability and longevity of display modules.
Commercial Applications:
The technology can be utilized in the manufacturing of consumer electronics, automotive displays, medical devices, and industrial equipment. It has the potential to improve the quality and reliability of displays in various commercial applications.
Prior Art:
Prior research in the field of display technology may include studies on signal transmission and reflection in display modules, as well as advancements in bonding circuit board design.
Frequently Updated Research:
Researchers may be exploring new materials and technologies to further enhance signal transmission and reduce signal reflection in display modules.
Questions about Display Module Technology: 1. How does the use of buffer devices improve signal quality in display modules? 2. What are the potential challenges in implementing this technology in different types of display devices?
Original Abstract Submitted
A display module includes a display panel, at least one bonding circuit board, a plurality of chip-on-films, and a plurality of buffer devices. The at least one bonding circuit board each include first differential lines, and a first differential line includes a P-polarity differential sub-line and an N-polarity differential sub-line. An end of a chip-on-film is connected to the first differential line, and the other end of the chip-on-film is connected to the display panel. The buffer devices are arranged on the bonding circuit board, a buffer device is connected to ends, proximate to the chip-on-film, of the P-polarity differential sub-line and the N-polarity differential sub-line, and the buffer device is configured to reduce signal reflection between the first differential line and the chip-on-film.