18244739. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18244739 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract consists of a first package substrate with a redistribution structure, a second package substrate with a different redistribution structure, a semiconductor chip positioned between the two substrates and attached to the first substrate, and a fiducial mark on the second substrate that is separate from the redistribution structure.
- Explanation of the patent/innovation:
- The semiconductor package includes two package substrates with different redistribution structures to facilitate efficient electrical connections. - A semiconductor chip is placed between the substrates and attached to one of them for electronic functionality. - A fiducial mark on the second substrate aids in alignment and positioning during manufacturing processes.
Potential Applications
The technology described in this patent application could be applied in various industries such as: - Consumer electronics - Automotive - Telecommunications
Problems Solved
The semiconductor package addresses the following issues: - Improved electrical connections between components - Enhanced alignment and positioning accuracy during manufacturing
Benefits
The benefits of this technology include: - Increased reliability and performance of electronic devices - Streamlined manufacturing processes - Enhanced product quality and durability
Potential Commercial Applications
"Semiconductor Package with Dual Substrates and Fiducial Mark: Commercial Applications" This section could explore potential markets and industries where this technology could be utilized for commercial purposes.
Possible Prior Art
Any prior patents or technologies related to semiconductor packaging with dual substrates and fiducial marks could be discussed in this section.
Unanswered Questions
How does the fiducial mark improve manufacturing processes?
The fiducial mark on the second substrate is mentioned in the abstract, but the specific benefits or mechanisms of how it aids in manufacturing are not detailed.
What are the specific features of the redistribution structures on the package substrates?
The abstract mentions different redistribution structures on the two package substrates, but the unique characteristics or advantages of these structures are not elaborated upon.
Original Abstract Submitted
A semiconductor package includes: a first package substrate including a first redistribution structure; a second package substrate including a second redistribution structure; a semiconductor chip provided between the first package substrate and the second package substrate, and attached to the first package substrate; and a fiducial mark provided on the second package substrate and separated from the second redistribution structure in a plan view.
