18228807. METHOD OF INSPECTING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
METHOD OF INSPECTING SEMICONDUCTOR DEVICE
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METHOD OF INSPECTING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18228807 titled 'METHOD OF INSPECTING SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a method for inspecting a semiconductor device by scanning multiple circuit pattern layers, overlapping the images generated, counting defects, setting inspection areas based on defect coordinates, and storing these areas.
- Scanning multiple circuit pattern layers of a semiconductor device
- Generating images corresponding to each layer
- Overlapping images to count defects
- Setting inspection areas based on defect coordinates
- Storing main inspection areas with defect coordinates
Key Features and Innovation
- Scanning and analyzing multiple circuit pattern layers for defects
- Prioritizing inspection areas based on defect coordinates
- Efficiently storing and managing inspection data
Potential Applications
This technology can be used in semiconductor manufacturing processes to improve defect detection and quality control.
Problems Solved
- Enhances defect detection in semiconductor devices
- Streamlines inspection processes
- Improves overall quality control in semiconductor manufacturing
Benefits
- Increased accuracy in defect detection
- Faster inspection processes
- Enhanced quality control in semiconductor manufacturing
Commercial Applications
Semiconductor Manufacturing Industry
This technology can be utilized by semiconductor manufacturers to enhance quality control processes, leading to improved product quality and reliability.
Prior Art
Further research can be conducted in the field of semiconductor inspection methods to explore similar technologies and advancements.
Frequently Updated Research
There may be ongoing research in the semiconductor industry related to defect detection and inspection methods that could be relevant to this technology.
Questions about Semiconductor Device Inspection
How does this technology improve defect detection in semiconductor devices?
This technology improves defect detection by scanning multiple circuit pattern layers and prioritizing inspection areas based on defect coordinates, allowing for more efficient and accurate identification of defects.
What are the potential applications of this semiconductor device inspection method?
The potential applications of this technology include enhancing quality control processes in semiconductor manufacturing, leading to improved product quality and reliability.
Original Abstract Submitted
A method of inspecting a semiconductor device, includes: scanning a plurality of first circuit pattern layers of the semiconductor device and generating a plurality of first images respectively corresponding the plurality of first circuit pattern layers of the semiconductor device; overlapping the plurality of first images with each other and counting a plurality of first defects in the overlapped first images; setting main inspection areas with priority orders by using position coordinates of the counted first defects; and storing the main inspection areas with the position coordinates of the counted first defects.