18218794. Finger Electrostatic Chuck for High Resistance Substrate Chucking (Applied Materials, Inc.)
Finger Electrostatic Chuck for High Resistance Substrate Chucking
Organization Name
Inventor(s)
Mukund Sundararajan of Bangalore (IN)
Cheng-Hsiung Matthew Tsai of Cupertino CA (US)
Ananthkrishna Jupudi of Singapore (SG)
Ross Marshall of Campbell CA (US)
Finger Electrostatic Chuck for High Resistance Substrate Chucking
This abstract first appeared for US patent application 18218794 titled 'Finger Electrostatic Chuck for High Resistance Substrate Chucking
Original Abstract Submitted
Embodiments of bipolar electrostatic chucks are provided herein. In some embodiments, a bipolar electrostatic chuck, includes: the electrostatic chuck; and a plurality of electrodes disposed in the electrostatic chuck, wherein the plurality of electrodes include a positive electrode arranged in a first pattern comprising a plurality of first arcuate bands coupled together via first connection fingers that extend radially therebetween and a negative electrode arranged in a second pattern comprising a plurality of second arcuate bands coupled together via second connection fingers that extend radially therebetween, wherein the plurality of first arcuate bands are arranged in an alternating pattern with the plurality of second arcuate bands, wherein there is a gap between the first pattern and the second pattern.