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18198506. SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

From WikiPatents

SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Daehyuk Son of Suwon-si (KR)

Sungchan Kang of Suwon-si (KR)

Seogwoo Hong of Suwon-si (KR)

SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18198506 titled 'SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE

  • Simplified Explanation:

This semiconductor device includes a cooling channel with an ultrasonic vibrator to prevent vapor stagnation and film generation in the semiconductor chip.

  • Key Features and Innovation:

- Semiconductor chip with integrated circuit - Cooling channel for coolant flow - Ultrasonic vibrator in the cooling channel - Vibration of coolant to prevent vapor issues

  • Potential Applications:

- Cooling of semiconductor chips in electronic devices - Preventing overheating in high-performance computing systems - Enhancing the efficiency of cooling systems in various applications

  • Problems Solved:

- Stagnation of vapors in semiconductor chips - Generation of vapor film affecting performance - Overheating issues in electronic devices

  • Benefits:

- Improved cooling efficiency - Enhanced performance of semiconductor devices - Extended lifespan of electronic components

  • Commercial Applications:

- Data centers - High-performance computing systems - Automotive electronics

  • Questions about Semiconductor Cooling Device:

1. How does the ultrasonic vibrator prevent vapor stagnation in the cooling channel? 2. What are the potential long-term benefits of using this technology in electronic devices?

  • Frequently Updated Research:

- Ongoing studies on the impact of ultrasonic vibration on coolant flow in semiconductor devices.


Original Abstract Submitted

A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel formed in the semiconductor chip and providing a moving path for a coolant. An ultrasonic vibrator may be arranged in the cooling channel. The ultrasonic vibrator may vibrate the coolant. By doing so, the stagnation of vapors and/or generation of a vapor film may be reduced or prevented.

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