18197998. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
Organization Name
Inventor(s)
Hyeonjeong Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18197998 titled 'SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
Simplified Explanation
The present disclosure provides semiconductor packages with a heat dissipation structure, including a package substrate, a stacked chip with a lower chip and an upper chip, a memory chip, and an encapsulant. A dummy silicon chip is in contact with the upper chip on the lower chip.
- Package includes a package substrate, stacked chip, memory chip, and encapsulant.
- Stacked chip consists of a lower chip and an upper chip.
- Memory chip is adjacent to the stacked chip on the package substrate.
- Encapsulant encapsulates at least a portion of the stacked chip and memory chip.
- Upper surface of the upper chip is exposed from the encapsulant.
- Dummy silicon chip is in contact with the upper chip on the lower chip.
Potential Applications
The technology could be applied in:
- High-performance computing systems
- Data centers
- Automotive electronics
Problems Solved
The technology helps in:
- Improving heat dissipation in semiconductor packages
- Enhancing the performance and reliability of electronic devices
Benefits
The benefits of this technology include:
- Efficient heat dissipation
- Increased longevity of electronic components
- Improved overall performance of electronic devices
Potential Commercial Applications
The technology could find commercial applications in:
- Semiconductor manufacturing companies
- Electronics industry suppliers
- Research and development organizations
Possible Prior Art
One possible prior art could be the use of heat sinks in semiconductor packages to dissipate heat effectively.
Unanswered Questions
How does this technology compare to traditional heat dissipation methods in semiconductor packages?
This technology offers improved heat dissipation compared to traditional methods by incorporating a dummy silicon chip for better thermal management.
What impact does the heat dissipation structure have on the overall size and weight of the semiconductor package?
The heat dissipation structure may increase the overall size of the semiconductor package but could potentially reduce the weight by optimizing thermal management.
Original Abstract Submitted
The present disclosure provides semiconductor packages including a heat dissipation structure. In some embodiments, the semiconductor package includes a package substrate, a stacked chip disposed on the package substrate and including a lower chip and an upper chip, a memory chip disposed on the package substrate adjacent to the stacked chip, and an encapsulant encapsulating at least a portion of the stacked chip and the memory chip on the package substrate. An upper surface of the upper chip is exposed from the encapsulant. A dummy silicon chip is in contact with the upper chip on the lower chip.
