18188627. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
JAE CHOON Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18188627 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes:
- Lower structure
- First semiconductor chip with a hot spot
- Second semiconductor chip spaced apart from the first chip
- Connection chip connecting the first and second chips
- Hot spot vertically overlapping the connection chip
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- Potential Applications
- Consumer electronics
- Automotive industry
- Telecommunications
- Problems Solved
- Improved heat dissipation
- Enhanced performance
- Increased reliability
- Benefits
- Better thermal management
- Higher efficiency
- Extended lifespan of semiconductor chips
Original Abstract Submitted
A semiconductor package may include a lower structure, a first semiconductor chip on the lower structure, the first semiconductor chip including a hot spot, a second semiconductor chip horizontally spaced apart from the first semiconductor chip on the lower structure, and a connection chip in the lower structure and connecting the first and second semiconductor chips to each other. The hot spot may vertically overlap the connection chip.