FAN-OUT SEMICONDUCTOR PACKAGES

Organization Name

Inventor(s)

FAN-OUT SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18151731 titled 'FAN-OUT SEMICONDUCTOR PACKAGES

Simplified Explanation

The abstract describes a fan-out semiconductor package that includes a frame substrate with a through hole, a semiconductor chip placed in the through hole, an encapsulation layer on the chip's side surfaces, and a guard ring on the chip's passivation layer and edge portion.

The semiconductor chip is placed within a through hole in a frame substrate.
The chip includes a chip body, a chip pad, and a passivation layer.
An encapsulation layer is applied to the side surfaces of the chip within the through hole.
A guard ring is formed on the passivation layer and the edge portion of the chip body.

Potential Applications

This technology can be applied in various electronic devices that require compact and efficient semiconductor packaging.
It can be used in smartphones, tablets, laptops, and other portable electronic devices.
It can also be utilized in automotive electronics, medical devices, and industrial equipment.

Problems Solved

The fan-out semiconductor package solves the problem of limited space in electronic devices by providing a compact packaging solution.
It addresses the need for efficient heat dissipation and protection of the semiconductor chip.
The guard ring helps to prevent damage to the chip and enhance its reliability.

Benefits

The fan-out semiconductor package offers a smaller form factor compared to traditional packaging methods.
It provides improved thermal management, ensuring the chip operates at optimal temperatures.
The encapsulation layer and guard ring offer enhanced protection against environmental factors and mechanical stress.
The technology enables higher integration density and improved electrical performance.

Original Abstract Submitted

A fan-out semiconductor package includes a frame substrate having a through hole therein, a semiconductor chip in the through hole, wherein the semiconductor chip includes a chip body, a chip pad on a surface of the chip body and a passivation layer on the chip body and on the chip pad, an encapsulation layer on side surfaces of the semiconductor chip within the through hole, and a guard ring on the passivation layer and on an edge portion of the chip body.