18098791. DRY ETCH OF BORON-CONTAINING MATERIAL simplified abstract (Applied Materials, Inc.)
DRY ETCH OF BORON-CONTAINING MATERIAL
Organization Name
Inventor(s)
Yeonju Kwak of Sunnyvale CA (US)
Jeong Hwan Kim of San Jose CA (US)
Srinivas Guggilla of San Jose CA (US)
DRY ETCH OF BORON-CONTAINING MATERIAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18098791 titled 'DRY ETCH OF BORON-CONTAINING MATERIAL
The patent application describes a method of semiconductor processing involving the use of a fluorine-containing precursor in a processing chamber.
- Providing a fluorine-containing precursor to a processing region of a semiconductor processing chamber
- Housing a substrate within the processing region, with a boron-containing material overlying a carbon-containing material
- Generating plasma effluents of the fluorine-containing precursor
- Contacting the substrate with the plasma effluents to remove the boron-containing material
Potential Applications: - Semiconductor manufacturing - Electronics industry - Research and development in materials science
Problems Solved: - Efficient removal of boron-containing materials from substrates - Enhanced semiconductor processing techniques
Benefits: - Improved efficiency in semiconductor processing - Enhanced quality of semiconductor materials - Potential cost savings in manufacturing processes
Commercial Applications: - Advanced semiconductor fabrication processes - Production of high-performance electronic devices - Development of cutting-edge semiconductor technologies
Questions about Semiconductor Processing: 1. How does the use of a fluorine-containing precursor improve the efficiency of semiconductor processing?
- The fluorine-containing precursor helps in the removal of boron-containing materials from substrates, leading to enhanced processing results.
2. What are the potential long-term implications of this semiconductor processing method in the electronics industry?
- This method could lead to the development of more advanced and efficient electronic devices, impacting various sectors of the electronics industry.
Original Abstract Submitted
Exemplary methods of semiconductor processing may include providing a fluorine-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. The substrate may include a boron-containing material overlying a carbon-containing material. The methods may include generating plasma effluents of the fluorine-containing precursor. The methods may include contacting the substrate with the plasma effluents of the fluorine-containing precursor. The methods may include removing the boron-containing material from the substrate.