CLEANING OPERATIONS BASED ON DEPOSITION THICKNESS

Organization Name

Applied Materials, Inc.

Inventor(s)

Victor Zamarian of Cupertino CA (US)

Mitesh Harshad Sanghvi of Dublin CA (US)

Venkatanarayana Shankaramurthy of San Jose CA (US)

Yuhyuk Cho of San Jose CA (US)

Deepesh Rai of Santa Clara CA (US)

CLEANING OPERATIONS BASED ON DEPOSITION THICKNESS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18093681 titled 'CLEANING OPERATIONS BASED ON DEPOSITION THICKNESS

The method described in the abstract involves identifying deposition thickness property data related to material deposited during substrate processing operations in a processing chamber. This data is used to determine cleaning operation parameters based on a variable clean time relationship of the process recipe. Subsequently, a cleaning operation is initiated in the processing chamber based on these parameters.

The method involves analyzing deposition thickness property data to optimize cleaning operations in a processing chamber.
Cleaning operation parameters are determined based on the relationship between the data and the process recipe's clean time.
The innovation aims to enhance the efficiency and effectiveness of cleaning processes in semiconductor manufacturing.
By utilizing deposition thickness property data, the method helps in maintaining the cleanliness and performance of processing chambers.
This technology can lead to improved yield and quality of semiconductor devices by ensuring proper cleaning procedures.

Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Cleanroom operations

Problems Solved: - Inefficient cleaning processes in processing chambers - Lack of optimization in cleaning operation parameters - Potential contamination issues in semiconductor manufacturing

Benefits: - Enhanced cleaning efficiency - Improved yield and quality of semiconductor devices - Cost savings through optimized cleaning procedures

Commercial Applications: Title: Semiconductor Manufacturing Cleaning Optimization Technology This technology can be utilized by semiconductor manufacturers to streamline cleaning processes, improve yield, and ensure the quality of their products. It has the potential to reduce operational costs and enhance overall efficiency in semiconductor fabrication facilities.

Questions about Semiconductor Manufacturing Cleaning Optimization Technology: 1. How does this technology impact the overall efficiency of semiconductor manufacturing processes? 2. What are the key benefits of using deposition thickness property data to optimize cleaning operations in processing chambers?

Original Abstract Submitted

A method includes identifying deposition thickness property data associated with an amount of material deposited via one or more substrate processing operations of a process recipe performed in a processing chamber. The method further includes determining, based on the deposition thickness property data and a variable clean time relationship of the process recipe, cleaning operation parameters. The method further includes causing, based on the cleaning operation parameters, a cleaning operation in the processing chamber.