18090254. BACKSIDE INTERFACE FOR CHIPLET ARCHITECTURE MIXING simplified abstract (Advanced Micro Devices, Inc.)
BACKSIDE INTERFACE FOR CHIPLET ARCHITECTURE MIXING
Organization Name
Inventor(s)
Gabriel Hsiuwei Loh of Bellevue WA (US)
Todd David Basso of Boxborough MA (US)
BACKSIDE INTERFACE FOR CHIPLET ARCHITECTURE MIXING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18090254 titled 'BACKSIDE INTERFACE FOR CHIPLET ARCHITECTURE MIXING
The disclosed semiconductor package includes a first chiplet area for receiving a first chiplet, a second chiplet area for receiving a second chiplet, and a host die coupled to the first and second chiplet areas. The semiconductor package also includes an interconnect directly coupling the first chiplet area to the second chiplet area.
- The semiconductor package features separate areas for different chiplets, allowing for efficient organization and connectivity.
- The interconnect directly linking the chiplet areas streamlines communication between the components.
- This design enhances the overall performance and functionality of the semiconductor package.
- The innovation offers a compact and effective solution for integrating multiple chiplets within a single package.
- Various methods, systems, and computer-readable media are also disclosed in the patent application.
Potential Applications: This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and efficient semiconductor packaging.
Problems Solved: The semiconductor package addresses the need for improved connectivity and organization of chiplets within a single package, enhancing overall performance and functionality.
Benefits: - Enhanced communication between chiplets - Efficient organization of components - Compact design for space-saving applications
Commercial Applications: The semiconductor package can be utilized in the production of advanced electronic devices, improving their performance and functionality in a compact form factor.
Questions about Semiconductor Package: 1. How does the direct interconnect between chiplet areas benefit the overall performance of the semiconductor package? 2. What are the potential market implications of this innovative semiconductor packaging technology?
Original Abstract Submitted
The disclosed semiconductor package includes a first chiplet area for receiving a first chiplet, a second chiplet area for receiving a second chiplet, and a host die coupled to the first and second chiplet areas. The semiconductor package also includes an interconnect directly coupling the first chiplet area to the second chiplet area. Various other methods, systems, and computer-readable media are also disclosed.