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18059263. PROCESSING EQUIPMENT AND ITS SUPPORTING STRUCTURE simplified abstract (INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE)

From WikiPatents

PROCESSING EQUIPMENT AND ITS SUPPORTING STRUCTURE

Organization Name

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor(s)

You-Syun Lyu of Hsinchu (TW)

Jia-Jyun Shen of Hsinchu (TW)

Yung-Chi Chang of Hsinchu (TW)

PROCESSING EQUIPMENT AND ITS SUPPORTING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18059263 titled 'PROCESSING EQUIPMENT AND ITS SUPPORTING STRUCTURE

Simplified Explanation

The patent application describes a processing equipment that includes a carrier structure with at least one guide pin arranged in a ring center area of a ring body of a frame. A wire-supply device disposed on the ring body can supply wires to the center structure, allowing the wires to be woven around the guide pin and formed on the carrier structure to create an exposed area around the guide pin.

  • The equipment includes a carrier structure with a guide pin in the center area of a ring body.
  • A wire-supply device on the ring body supplies wires to the center structure.
  • Wires are woven around the guide pin and formed on the carrier structure to create an exposed area.

Potential Applications

This technology could be used in the manufacturing of electronic components, sensors, or any other devices that require precise wire weaving and forming processes.

Problems Solved

1. Precise wire weaving and forming processes can be challenging and time-consuming without the use of specialized equipment. 2. Ensuring that wires are properly positioned and secured during the manufacturing process can be difficult without the aid of a guide pin.

Benefits

1. Increased efficiency in wire weaving and forming processes. 2. Improved accuracy and precision in the placement of wires. 3. Enhanced reliability of the final product due to consistent wire positioning.

Potential Commercial Applications

Optimizing Wire Weaving and Forming Processes for Electronic Component Manufacturing

Possible Prior Art

There may be existing patents or technologies related to wire weaving and forming processes in the manufacturing industry.

Unanswered Questions

== How does this technology compare to traditional wire weaving and forming methods? This article does not provide a direct comparison between this technology and traditional wire weaving and forming methods.

== What materials are compatible with this processing equipment? The article does not specify the types of materials that can be used with this processing equipment.


Original Abstract Submitted

A processing equipment is provided, in which a carrier structure with at least one guide pin is arranged in a ring center area of a ring body of a frame, and a wire-supply device disposed on the ring body can supply wires to the center structure, so the wires can be woven around the guide pin and formed on the carrier structure so that the wire covers the carrier structure to form an exposed area around the guide pin.

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