18028299. ARRAY SUBSTRATE AND ELECTRONIC APPARATUS (BOE TECHNOLOGY GROUP CO., LTD.)

ARRAY SUBSTRATE AND ELECTRONIC APPARATUS

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Hai Tang of Beijing (CN)

Ping Kang of Beijing (CN)

Chaoren Lv of Beijing (CN)

Kangli Wang of Beijing (CN)

Liang Gao of Beijing (CN)

ARRAY SUBSTRATE AND ELECTRONIC APPARATUS

This abstract first appeared for US patent application 18028299 titled 'ARRAY SUBSTRATE AND ELECTRONIC APPARATUS

Original Abstract Submitted

Provided are an array substrate and an electronic apparatus. The array substrate includes: a base substrate; a first conductive layer on the base substrate, where the first conductive layer includes a plurality of pads, each pad includes a first metal layer, a material of the first metal layer includes Cu, a content of the Cu is greater than or equal to 99%, and a thickness of the first metal layer is greater than 2 μm; and an electronic element disposed on a side of the first conductive layer facing away from the base substrate, where the electronic element includes an electronic element body and a plurality of pins disposed on a side of the electronic element body facing the base substrate, and the pins are connected with the pads.