18027072. FINGERPRINT SENSOR AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
FINGERPRINT SENSOR AND ELECTRONIC DEVICE
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
FINGERPRINT SENSOR AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18027072 titled 'FINGERPRINT SENSOR AND ELECTRONIC DEVICE
The patent application describes a fingerprint sensor with photosensitive devices, a light-emitting module, and a protective cover with conductive structures.
- The fingerprint sensor includes a substrate with photosensitive devices and a light-emitting module on one side.
- A protective cover is placed over the light-emitting module, featuring conductive structures connected to the module.
- Each conductive structure corresponds to a photosensitive device, overlapping on the substrate.
Potential Applications: - Biometric security systems - Access control devices - Mobile devices with fingerprint recognition
Problems Solved: - Enhances fingerprint sensor accuracy - Improves durability and protection of sensor components
Benefits: - Increased security through reliable fingerprint recognition - Enhanced user experience with fast and accurate authentication
Commercial Applications: Title: Advanced Fingerprint Sensor Technology for Enhanced Security Systems This technology can be utilized in various industries such as: - Smartphone manufacturers - Security system providers - Biometric authentication companies
Questions about Fingerprint Sensor Technology: 1. How does the conductive structure improve the functionality of the fingerprint sensor?
- The conductive structure enhances the electrical connection between the photosensitive devices and the light-emitting module, ensuring efficient operation.
2. What are the potential implications of this technology in the field of biometrics and security?
- This technology can revolutionize biometric security systems by providing a more reliable and secure method of authentication.
Original Abstract Submitted
Provided is a fingerprint sensor, including: a substrate; a plurality of photosensitive devices disposed on the substrate; a light-emitting module disposed on a side, distal to the substrate, of the plurality of photosensitive devices; and a protective cover disposed on a side, distal to the substrate, of the light-emitting module, wherein the protective cover is provided with a plurality of conductive structures electrically connected to the light-emitting module, the plurality of conductive structures being in one-to-one correspondence with the plurality of photosensitive devices, and an orthographic projection of each conductive structure onto the substrate at least partially being overlapped with an orthographic projection of the photosensitive device corresponding to the conductive structure onto the substrate.
- BOE TECHNOLOGY GROUP CO., LTD.
- Dexi Kong of Beijing (CN)
- Cheng Li of Beijing (CN)
- Lin Zhou of Beijing (CN)
- Zixiao Chen of Beijing (CN)
- Gen Huang of Beijing (CN)
- Shoujin Cai of Beijing (CN)
- Jie Zhang of Beijing (CN)
- Jin Cheng of Beijing (CN)
- Yingzi Wang of Beijing (CN)
- Caixia Zhang of Beijing (CN)
- Qian Tan of Beijing (CN)
- G06V40/13
- CPC G06V40/1318