BALUN STRUCTURE AND ELECTRONIC DEVICE

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Haocheng Jia of Beijing (CN)

Yi Ding of Beijing (CN)

Hao Guo of Beijing (CN)

Yan Lu of Beijing (CN)

Xiaobo Wang of Beijing (CN)

Weisi Zhou of Beijing (CN)

Wenxue Ma of Beijing (CN)

Jing Wang of Beijing (CN)

Chuncheng Che of Beijing (CN)

BALUN STRUCTURE AND ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18017674 titled 'BALUN STRUCTURE AND ELECTRONIC DEVICE

The abstract describes a balun structure consisting of a first dielectric layer, a second dielectric layer, a ground electrode, an unbalance electrode, and a balance electrode. The layers are stacked with the ground electrode having a coupling hole extending through it. The unbalance electrode is on one side of the first dielectric layer, while the balance electrode is on one side of the second dielectric layer.

The balun structure includes a first dielectric layer, a second dielectric layer, a ground electrode, an unbalance electrode, and a balance electrode.
The ground electrode features a coupling hole that extends through it, allowing for signal transmission.
The unbalance electrode is located on one side of the first dielectric layer, while the balance electrode is on one side of the second dielectric layer.
The layers are stacked in a specific sequence to optimize signal transmission and balance.
The design of the balun structure aims to improve the performance of electronic devices by providing efficient signal conversion and transmission.

Potential Applications: - Telecommunications equipment - Antenna systems - RF transceivers - Wireless communication devices

Problems Solved: - Signal imbalance in electronic circuits - Inefficient signal transmission - Interference in communication systems

Benefits: - Improved signal conversion - Enhanced signal transmission efficiency - Reduced interference in electronic devices

Commercial Applications: Title: Enhanced Balun Structure for Improved Signal Transmission in Telecommunications Equipment This technology can be utilized in various commercial applications such as telecommunications equipment, antenna systems, RF transceivers, and wireless communication devices. The enhanced balun structure offers improved signal conversion and transmission efficiency, making it a valuable component in electronic devices.

Questions about Balun Structure: 1. How does the coupling hole in the ground electrode contribute to signal transmission efficiency? The coupling hole in the ground electrode allows for improved signal transmission by providing a direct path for signals to pass through the balun structure, reducing interference and signal loss.

2. What are the key differences between the unbalance electrode and the balance electrode in the balun structure? The unbalance electrode is located on one side of the first dielectric layer, while the balance electrode is on one side of the second dielectric layer. Their positioning helps in achieving signal balance and efficient transmission.

Original Abstract Submitted

Provided is a balun structure, including: a first dielectric layer, a second dielectric layer, a ground electrode, an unbalance electrode, and a balance electrode. The first dielectric layer, the ground electrode, the second dielectric layer are successively stacked, and the ground electrode has a coupling hole therein. The coupling hole extends from a surface facing the first dielectric layer to a surface facing the second dielectric layer. The unbalance electrode is disposed on a first side of the first dielectric layer, wherein the first side of the first dielectric layer is a side, distal from the ground electrode, of the first dielectric layer. The balance electrode is disposed on a first side of the second dielectric layer, wherein the first side of the second dielectric layer is a side, distal from the ground electrode, of the second dielectric layer.