MULTIPLE TRANSCEIVER COOLING SYSTEM

Organization Name

Inventor(s)

MULTIPLE TRANSCEIVER COOLING SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 17994724 titled 'MULTIPLE TRANSCEIVER COOLING SYSTEM

Simplified Explanation

The abstract describes a multiple transceiver cooling system for networking devices, which includes transceiver device chassis and a heat dissipation device to manage heat generated by the transceiver devices.

The system includes a networking device and multiple transceiver device chassis positioned adjacent to each other.
Each transceiver device chassis is designed to receive a transceiver device.
A multiple transceiver heat dissipation device engages each transceiver device chassis to dissipate heat generated by the transceiver devices.
The heat is transferred to a heat dissipation element and dissipated effectively.

Potential Applications

The technology can be applied in data centers, telecommunications infrastructure, and networking equipment to ensure efficient cooling of transceiver devices.

Problems Solved

1. Overheating of transceiver devices in networking equipment. 2. Inadequate heat dissipation leading to performance issues.

Benefits

1. Improved reliability and longevity of networking devices. 2. Enhanced performance due to efficient heat management. 3. Reduced risk of damage from overheating.

Potential Commercial Applications

Optimizing cooling systems in networking equipment for improved performance and reliability.

Possible Prior Art

Prior art may include cooling systems for electronic devices, such as server racks and computer systems, that aim to dissipate heat effectively to prevent overheating.

Unanswered Questions

How does the system handle different heat levels from various transceiver devices?

The system is designed to handle heat generated by different transceiver devices, but the specific mechanisms for managing varying heat levels are not detailed in the abstract.

What materials are used in the heat dissipation element for effective heat dissipation?

The abstract does not specify the materials used in the heat dissipation element, which could impact the overall efficiency of the cooling system.

Original Abstract Submitted

A multiple transceiver cooling system includes a networking device, a plurality of transceiver device chassis that are included in the networking device, that are positioned adjacent each other, and that are each configured to receive a respective transceiver device, and a multiple transceiver heat dissipation device that engages each of the plurality of transceiver device chassis. With the multiple transceiver heat dissipation device engaging each of the plurality of transceiver device chassis, the multiple transceiver heat dissipation device may receive heat generated by respective transceiver devices located in the plurality of transceiver device chassis, transfer the heat to a heat dissipation element, and dissipate the heat using the heat dissipation element.