Ru Liner above a Barrier Layer

Organization Name

Applied Materials, Inc.

Inventor(s)

Zhaoxuan Wang of Sunnyvale CA (US)

Jianxin Lei of Fremont CA (US)

Wenting Hou of San Jose CA (US)

Sung-Kwan Kang of San Jose CA (US)

Anand Nilakantan Iyer of Fremont CA (US)

Ru Liner above a Barrier Layer - A simplified explanation of the abstract

This abstract first appeared for US patent application 17970872 titled 'Ru Liner above a Barrier Layer

Simplified Explanation: The patent application describes a method to create a layered substrate by depositing a diffusion barrier layer, an underlayer with a Group 6 metal, and a ruthenium layer on top.

The method involves depositing a diffusion barrier layer on the substrate.
An underlayer containing a Group 6 metal is then deposited on the barrier layer.
Finally, a ruthenium layer comprising ruthenium is deposited on the underlayer to create the layered substrate.

Key Features and Innovation:

Deposition of a diffusion barrier layer to enhance the substrate's properties.
Use of a Group 6 metal in the underlayer for specific characteristics.
Addition of a ruthenium layer for further functionality and performance.

Potential Applications: The technology can be applied in:

Semiconductor manufacturing
Thin film coatings
Electronic device production

Problems Solved:

Enhancing substrate durability
Improving substrate conductivity
Providing a stable base for additional layers

Benefits:

Increased substrate performance
Enhanced material properties
Improved overall product quality

Commercial Applications: Title: Advanced Layered Substrate Technology for Semiconductor Manufacturing This technology can be utilized in various commercial applications such as:

Integrated circuit production
Solar panel manufacturing
Optoelectronic device fabrication

Questions about Layered Substrate Technology: 1. How does the diffusion barrier layer contribute to the overall performance of the substrate? 2. What are the specific advantages of using a Group 6 metal in the underlayer?

Frequently Updated Research: Stay updated on the latest advancements in layered substrate technology to ensure optimal performance and efficiency in various industries.

Original Abstract Submitted

A method to produce a layered substrate, which includes the steps of depositing a diffusion barrier layer on the substrate; depositing an underlayer comprising a Group 6 metal on the barrier layer; and depositing a ruthenium layer comprising ruthenium on the underlayer, to produce the layered substrate. A layered substrate is also disclosed.