PLATING PROCESS METHOD

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Inventor(s)

PLATING PROCESS METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 17910977 titled 'PLATING PROCESS METHOD

Simplified Explanation: The patent application presents a technique to prevent the decline in plating quality of a substrate due to the accumulation of gas bubbles on the lower surface of a membrane.

Key Features and Innovation:

Technique to suppress deterioration of plating quality caused by gas bubbles.
Focus on preventing accumulation of bubbles on the lower surface of a membrane.

Potential Applications: This technology can be applied in industries that require high-quality plating processes, such as electronics manufacturing, automotive, and aerospace.

Problems Solved:

Prevents deterioration of plating quality.
Addresses issues caused by gas bubbles accumulating on the lower surface of a membrane.

Benefits:

Improved plating quality.
Enhanced efficiency in plating processes.
Reduction in defects and rework.

Commercial Applications: The technology can be utilized in plating facilities, metal finishing industries, and any manufacturing processes that involve plating for commercial applications.

Questions about the Technology: 1. How does this technique compare to existing methods for preventing gas bubble accumulation in plating processes? 2. What specific industries can benefit the most from this innovation?

Frequently Updated Research: Stay updated on advancements in plating technologies, membrane materials, and gas bubble prevention techniques to enhance the effectiveness of this innovation.

Original Abstract Submitted

Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane.