17837052. SEMICONDUCTOR STRUCTURE HAVING TAPERED BIT LINE simplified abstract (NANYA TECHNOLOGY CORPORATION)
SEMICONDUCTOR STRUCTURE HAVING TAPERED BIT LINE
Organization Name
Inventor(s)
PEI-ROU Jiang of TAINAN CITY (TW)
CHAO-WEN Lay of NEW TAIPEI CITY (TW)
SEMICONDUCTOR STRUCTURE HAVING TAPERED BIT LINE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17837052 titled 'SEMICONDUCTOR STRUCTURE HAVING TAPERED BIT LINE
Simplified Explanation
The present disclosure describes a semiconductor structure with a tapered bit line configuration. The structure includes a substrate, a bit line structure with a cylindrical portion and a step portion, a polysilicon layer, and a landing pad.
- The semiconductor structure has a tapered bit line configuration.
- The bit line structure consists of a cylindrical portion and a step portion.
- The polysilicon layer is located over the substrate and surrounds the bit line structure.
- The landing pad is positioned over the polysilicon layer and the step portion.
Potential Applications
This technology can be applied in various semiconductor devices and integrated circuits, including:
- Memory devices
- Logic devices
- Microprocessors
- Storage devices
Problems Solved
The semiconductor structure with a tapered bit line configuration addresses the following issues:
- Improves the performance and efficiency of semiconductor devices.
- Reduces signal interference and noise.
- Enhances the reliability and functionality of integrated circuits.
Benefits
The use of a tapered bit line configuration in the semiconductor structure offers several advantages:
- Increased speed and performance of semiconductor devices.
- Improved signal integrity and reduced noise.
- Enhanced reliability and functionality of integrated circuits.
- Enables higher density and smaller form factor of devices.
Original Abstract Submitted
The present disclosure provides a semiconductor structure having a bit line with a tapered configuration. The semiconductor structure includes: a substrate; a bit line structure, disposed over the substrate, wherein the bit line structure includes a cylindrical portion and a step portion above the cylindrical portion; a polysilicon layer, disposed over the substrate and around the bit line structure; and a landing pad, disposed over the polysilicon layer and the step portion.