17802400. PLATING APPARATUS AND SUBSTRATE CLEANING METHOD simplified abstract (EBARA CORPORATION)
PLATING APPARATUS AND SUBSTRATE CLEANING METHOD
Organization Name
Inventor(s)
Kentaro Yamamoto of Tokyo (JP)
PLATING APPARATUS AND SUBSTRATE CLEANING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17802400 titled 'PLATING APPARATUS AND SUBSTRATE CLEANING METHOD
Simplified Explanation:
The patent application describes a plating module that includes a tank for a plating solution, a holder for a substrate to be plated, an elevating mechanism, a cover member with an opening/closing mechanism, a substrate cleaning member, and a driving mechanism.
Key Features and Innovation:
- Plating tank for solution
- Substrate holder for plating
- Elevating mechanism
- Cover member with opening/closing mechanism
- Substrate cleaning member
- Driving mechanism for movement
Potential Applications:
This technology can be used in industries that require precise and efficient plating processes, such as electronics manufacturing, automotive, and aerospace.
Problems Solved:
The technology addresses the need for a controlled and automated plating process that ensures uniform and high-quality plating results.
Benefits:
The benefits of this technology include improved plating efficiency, reduced manual labor, enhanced plating quality, and increased productivity.
Commercial Applications:
The technology can be commercially applied in manufacturing plants, research facilities, and other industrial settings to streamline the plating process and improve overall production efficiency.
Prior Art:
Prior art related to this technology may include patents or research papers on automated plating systems, substrate cleaning methods, and elevating mechanisms in industrial equipment.
Frequently Updated Research:
Researchers are continually exploring new materials and methods to enhance plating processes, improve substrate adhesion, and optimize plating solutions for various applications.
Questions about Plating Module: 1. What are the key components of the plating module described in the patent application? 2. How does the substrate cleaning member contribute to the overall plating process efficiency?
Original Abstract Submitted
A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.