16627202. POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS simplified abstract (Dow Global Technologies LLC)
POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS
Organization Name
Inventor(s)
Jeffrey M. Cogen of Flemington NJ (US)
Timothy J. Person of Pottstown PA (US)
POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 16627202 titled 'POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS
The present disclosure pertains to an encapsulant film created from a curable composition containing a polyolefin polymer, an organic peroxide, a silane coupling agent, and a co-agent comprising a monocyclic organosiloxane of formula (I).
- The encapsulant film is made from a unique curable composition that includes specific ingredients to enhance its properties.
- The use of a polyolefin polymer provides flexibility and durability to the film.
- The organic peroxide acts as a curing agent, allowing the film to harden and form a protective barrier.
- The silane coupling agent improves adhesion between the film and other surfaces.
- The co-agent, a monocyclic organosiloxane, further enhances the film's performance and characteristics.
Potential Applications: - This technology can be used in the manufacturing of electronic components for insulation and protection. - It can also be applied in the packaging industry for sealing and preserving goods. - The encapsulant film may find use in the construction sector for waterproofing and sealing purposes.
Problems Solved: - Provides a solution for creating a durable and flexible encapsulant film. - Enhances adhesion and performance of the film in various applications. - Offers a reliable method for protecting surfaces from environmental factors.
Benefits: - Improved durability and flexibility of the encapsulant film. - Enhanced adhesion and performance in different environments. - Cost-effective solution for encapsulation and protection needs.
Commercial Applications: "Encapsulant Film Technology for Enhanced Protection and Insulation in Electronics and Packaging Industries"
Questions about Encapsulant Film Technology: 1. How does the use of a polyolefin polymer benefit the encapsulant film? 2. What role does the organic peroxide play in the curing process of the film?
Original Abstract Submitted
The present disclosure relates to an encapsulant film made from a curable composition comprising: (A) a polyolefin polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a monocyclic organosiloxane of formula (I).
- Dow Global Technologies LLC
- Yunfeng Yang of Shanghai (CN)
- Chao He of Shanghai (CN)
- Weiming Ma of Shanghai (CN)
- Hongyu Chen of Shanghai (CN)
- Yabin Sun of Shanghai (CN)
- Kainan Zhang of Shanghai (CN)
- Jeffrey M. Cogen of Flemington NJ (US)
- Timothy J. Person of Pottstown PA (US)
- Yuyan Li of Shanghai (CN)
- Hong Yang of Shanghai (CN)
- C08K5/5425
- C08K5/14
- C08K5/549
- H01L31/048
- CPC C08K5/5425