US Patent Application 17929842. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE simplified abstract
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
Organization Name
CHANGXIN MEMORY TECHNOLOGIES, INC.
Inventor(s)
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17929842 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
Simplified Explanation
The present disclosure is about a method of manufacturing a semiconductor structure and the structure itself.
- The method involves providing a base and forming active layers and sacrificial layers on the base.
- The active layers are arranged in groups with a specific distance between them.
- Isolation layers are then formed, which penetrate through all the active and sacrificial layers, dividing the active layers into multiple structures.
- In the word line region, some of the isolation and sacrificial layers are removed.
Original Abstract Submitted
Embodiments of the present disclosure relate to the field of semiconductors, and provide a method of manufacturing a semiconductor structure and a semiconductor structure. The manufacturing method includes: providing a base, and forming active layers and sacrificial layers on the base, wherein two adjacent ones of the active layers constitute an active group, there is a first distance between the active layers in the active group, there is a second distance between adjacent ones of active groups, and the first distance is greater than the second distance; forming isolation layers, wherein each isolation layer penetrates through all the active layers and all the sacrificial layers, and the isolation layers divide each of the active layers into a plurality of active structures; removing a part of the isolation layers in the word line region and a part of the sacrificial layers located in the word line region.