US Patent Application 17825695. RADIATION HARDENED SEMICONDUCTOR DEVICES AND PACKAGING simplified abstract
Contents
RADIATION HARDENED SEMICONDUCTOR DEVICES AND PACKAGING
Organization Name
Inventor(s)
Chong Leong Gan of Taichung (TW)
RADIATION HARDENED SEMICONDUCTOR DEVICES AND PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 17825695 titled 'RADIATION HARDENED SEMICONDUCTOR DEVICES AND PACKAGING
Simplified Explanation
- This patent application is about radiation hard semiconductor devices and packaging. - The semiconductor device assembly includes a substrate, a semiconductor die stack, and an ionizing radiation shield. - The ionizing radiation shield is made of silicon carbide (SiC). - The semiconductor die stack and the ionizing radiation shield are partially encapsulated by an encapsulant. - The purpose of this invention is to protect the semiconductor devices from ionizing radiation. - The use of silicon carbide as the material for the ionizing radiation shield enhances the radiation resistance of the semiconductor device assembly.
Original Abstract Submitted
Radiation hard semiconductor devices and packaging are disclosed. A semiconductor device assembly includes a substrate, a semiconductor die stack electrically coupled to the substrate, and an ionizing radiation shield disposed over a top die of the semiconductor die stack, wherein the ionizing radiation shield comprises silicon carbide (SiC). The semiconductor device assembly further includes an encapsulant at least partially encapsulating the semiconductor die stack and the ionizing radiation shield.
