Pages that link to "US Patent Application 18214742. CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract"

← US Patent Application 18214742. CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract

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The following pages link to US Patent Application 18214742. CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract:

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Intel Corporation patent applications published on October 26th, 2023 ‎ (← links)

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