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Create the page "H01J37/30" on this wiki! See also the search results found.
- [[Category:H01J37/248]] [[Category:H01J37/305]]3 KB (380 words) - 05:31, 2 February 2024
- IPC Code(s): G11C16/04, G11C16/30, G11C16/20, G11C16/24 [[Category:G11C16/04]][[Category:G11C16/30]][[Category:G11C16/20]][[Category:G11C16/24]][[Category:sk hynix inc.]]12 KB (1,868 words) - 09:01, 30 January 2024
- [[Category:C23C14/30]] [[Category:H01J37/317]]4 KB (492 words) - 04:51, 12 January 2024
- [[Category:C30B29/30]] [[Category:H01J37/34]]4 KB (548 words) - 02:57, 16 April 2024
- ...l Corporation has filed patents in the areas of [[:Category:G06F9/30|G06F9/30]] (18 applications), [[:Category:H01L21/48|H01L21/48]] (14 applications), [ ...:Category:H03H9/13|H03H9/13]] (7 applications), [[:Category:H01G4/30|H01G4/30]] (7 applications), [[:Category:H03H9/54|H03H9/54]] (6 applications), [[:Ca27 KB (3,405 words) - 04:08, 4 December 2023
- ...:Category:H01J37/08|H01J37/08]] (4 applications), [[:Category:H01J37/32128|H01J37/32128]] (4 applications) ...egory:A61B5/378|A61B5/378]] (2 applications), [[:Category:A61K35/30|A61K35/30]] (2 applications), [[:Category:G16H50/20|G16H50/20]] (2 applications), [[:35 KB (4,354 words) - 01:42, 3 January 2024
- IPC Code(s): A47L9/14, A47L9/16, A47L9/28, A47L9/30, A47L5/18, A47L9/00 ...egory:A47L9/14]][[Category:A47L9/16]][[Category:A47L9/28]][[Category:A47L9/30]][[Category:A47L5/18]][[Category:A47L9/00]][[Category:samsung electronics c93 KB (13,664 words) - 08:59, 30 January 2024
- IPC Code(s): H01L21/3065, H01L23/522, H01L21/66, H01L21/67, H01J37/32, H01L21/306, H01L21/3213, H01L21/311 ...ategory:H01L23/522]][[Category:H01L21/66]][[Category:H01L21/67]][[Category:H01J37/32]][[Category:H01L21/306]][[Category:H01L21/3213]][[Category:H01L21/311]][99 KB (12,848 words) - 09:00, 30 January 2024
- ...ory:G10L15/063|G10L15/063]] (8 applications), [[:Category:G10L15/30|G10L15/30]] (8 applications), [[:Category:G10L15/02|G10L15/02]] (8 applications) [[:Category:NEC Corporation|NEC Corporation]]: 30 patent applications[[Category:NEC Corporation]]35 KB (4,315 words) - 17:46, 2 January 2024
- ...egory:H04W72/21|H04W72/21]] (4 applications), [[:Category:H04W76/30|H04W76/30]] (4 applications) [[:Category:Intel Corporation|Intel Corporation]]: 30 patent applications[[Category:Intel Corporation]]36 KB (4,390 words) - 15:28, 6 December 2023
- IPC Code(s): G11B9/02, H10B51/30 ...e or more stressed sidewall spacers.[[Category:G11B9/02]][[Category:H10B51/30]][[Category:taiwan semiconductor manufacturing co., ltd.]]94 KB (13,938 words) - 04:25, 2 February 2024
- ...egory:H02J50/12|H02J50/12]] (4 applications), [[:Category:B60L53/30|B60L53/30]] (4 applications), [[:Category:H02J50/80|H02J50/80]] (4 applications), [[: ...ed Materials, Inc. has filed patents in the areas of [[:Category:H01J37/32|H01J37/32]] (4 applications), [[:Category:B24B37/013|B24B37/013]] (4 applications)38 KB (4,677 words) - 01:14, 2 January 2024
- IPC Code(s): G11C11/22, H10B51/20, H10B51/30 ...tive voltage.[[Category:G11C11/22]][[Category:H10B51/20]][[Category:H10B51/30]][[Category:taiwan semiconductor manufacturing co., ltd.]]73 KB (10,746 words) - 00:59, 24 May 2024
- ...ation has filed patents in the areas of [[:Category:H10B43/27|H10B43/27]] (30 applications), [[:Category:G11C16/26|G11C16/26]] (18 applications), [[:Cate ...egory:H10K30/82|H10K30/82]] (2 applications), [[:Category:H10K30/30|H10K30/30]] (2 applications)49 KB (5,967 words) - 08:04, 22 March 2024
- IPC Code(s): G06F9/30, G06F3/06, G06F9/355, G06F9/38, G06F9/445, G06F12/02, G06F12/0811, G06F16/3 ...fied location in a specified number of at least one table.[[Category:G06F9/30]][[Category:G06F3/06]][[Category:G06F9/355]][[Category:G06F9/38]][[Category41 KB (6,181 words) - 08:29, 31 May 2024
- ...areas of [[:Category:H02S40/34|H02S40/34]] (2), [[:Category:E04D1/30|E04D1/30]] (2), [[:Category:H02S20/25|H02S20/25]] (2), [[:Category:H02S40/36|H02S40/ ..., [[:Category:G06N3/08|G06N3/08]] (2 applications), [[:Category:H01J37/244|H01J37/244]] (2 applications)48 KB (5,904 words) - 09:33, 12 April 2024
- IPC Code(s): C23C14/34, C23C14/08, H01J37/34 ...process is improved.[[Category:C23C14/34]][[Category:C23C14/08]][[Category:H01J37/34]][[Category:samsung display co., ltd.]]59 KB (9,418 words) - 03:04, 19 March 2024
- ...has applied for patents in the areas of [[:Category:H10B43/27|H10B43/27]] (30), [[:Category:G11C16/26|G11C16/26]] (18), [[:Category:H10B43/35|H10B43/35]] ..., H01L21/28, H01L29/51, H01L29/66, H01L29/78, H10B51/10, H10B51/20, H10B51/30109 KB (16,683 words) - 07:41, 22 March 2024
- IPC Code(s): G02B5/30, H10K59/80 ...ry refractive index of the second light compensation film.[[Category:G02B5/30]][[Category:H10K59/80]][[Category:samsung display co., ltd.]]77 KB (12,212 words) - 10:13, 30 January 2024
- IPC Code(s): H01L21/66, H01L21/02, H01J37/32, G03F7/00 ...ngle plasma etching.[[Category:H01L21/66]][[Category:H01L21/02]][[Category:H01J37/32]][[Category:G03F7/00]][[Category:taiwan semiconductor manufacturing co.,74 KB (10,922 words) - 10:13, 30 January 2024