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- 06:04, 26 April 2024 18381710. INFORMATION PROCESSING APPARATUS simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [3,117 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:04, 26 April 2024 18397891. MULTI-CHIP PACKAGING simplified abstract (Intel Corporation) (hist) [3,783 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:04, 26 April 2024 17970531. DIGITAL KEY PROFILE HIERARCHY simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [3,397 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:04, 26 April 2024 18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation) (hist) [3,365 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:04, 26 April 2024 17970162. SYSTEM AND METHOD TO INFER THOUGHTS AND A PROCESS THROUGH WHICH A HUMAN GENERATED LABELS FOR A CODING SCHEME simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [4,752 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:04, 26 April 2024 18399178. LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL simplified abstract (Intel Corporation) (hist) [3,193 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation) (hist) [4,382 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18242730. INFORMATION PROCESSING DEVICE, VEHICLE, INFORMATION PROCESSING METHOD, AND RECORDING MEDIUM ON WHICH A PROGRAM IS RECORDED simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [3,805 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18399220. ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract (Intel Corporation) (hist) [3,270 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18446547. SYSTEM, CONTROL DEVICE, AND CONTROL METHOD simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [4,386 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18397915. HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract (Intel Corporation) (hist) [3,744 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18465983. REMOTE OPERATION CONTROL METHOD, REMOTE OPERATION SYSTEM, AND MOVING BODY simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [3,571 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation) (hist) [3,370 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18047033. PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract (Intel Corporation) (hist) [4,569 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18467486. PARKING ASSIST APPARATUS simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [4,538 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18397906. NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract (Intel Corporation) (hist) [3,774 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18482319. VEHICLE OBJECT DETECTION SYSTEM AND METHOD FOR DETECTING A TARGET OBJECT IN A DETECTION AREA LOCATED BEHIND AND LATERAL OF A SUBJECT VEHICLE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [3,982 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18399205. MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCHITECTURE WITH INKJET BARRIER MATERIAL FOR CONTROLLING BONDLINE THICKNESS AND POP ADHESIVE KEEP OUT ZONE simplified abstract (Intel Corporation) (hist) [5,614 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18046601. CHIRAL SENSING WITH HARMONIC GENERATION FROM A METASURFACE FABRICATED ON A SOI WAFER simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA) (hist) [3,884 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:03, 26 April 2024 18392368. EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING simplified abstract (Intel Corporation) (hist) [3,954 bytes] Wikipatents (talk | contribs) (Creating a new page)