18399220. ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
Contents
- 1 ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
Organization Name
Inventor(s)
Bernd Waidhas of Pettendorf (DE)
Andreas Wolter of Regensburg (DE)
Georg Seidemann of Landshut (DE)
Thomas Wagner of Regelsbach (DE)
ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18399220 titled 'ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
Simplified Explanation
The abstract describes an electronic package with multiple embedded dies and pads of different pitches, connected by a bridge die.
- The electronic package includes a mold layer with embedded dies and pads at different pitches.
- The first die has first and second pads at different pitches.
- The second die has third and fourth pads at different pitches.
- A bridge die electrically couples the second pads to the fourth pads.
Potential Applications
This technology could be applied in:
- Consumer electronics
- Automotive industry
- Telecommunications
Problems Solved
This technology helps in:
- Increasing integration density
- Improving electrical connections
- Enhancing overall performance
Benefits
The benefits of this technology include:
- Enhanced functionality
- Improved reliability
- Cost-effective manufacturing
Potential Commercial Applications
This technology could be commercially applied in:
- Mobile devices
- IoT devices
- Automotive electronics
Possible Prior Art
There is no prior art known at this time.
Unanswered Questions
How does the bridge die ensure proper electrical coupling between the different pads?
The bridge die likely contains conductive pathways that connect the second and fourth pads, ensuring proper electrical coupling.
What materials are typically used in the mold layer of electronic packages?
The mold layer is commonly made of epoxy resins or other thermosetting materials to provide insulation and protection for the embedded components.
Original Abstract Submitted
Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.
