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- 03:57, 26 April 2024 Panasonic intellectual property management co., ltd. (20240128413). WAVELENGTH CONVERTER AND LIGHT EMITTING DEVICE PROVIDED THEREWITH simplified abstract (hist) [3,617 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Intel corporation (20240136326). NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract (hist) [5,594 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Panasonic intellectual property management co., ltd. (20240128031). ELECTROCHEMICAL CAPACITOR simplified abstract (hist) [2,916 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Intel corporation (20240136323). MICROELECTRONIC ASSEMBLIES simplified abstract (hist) [3,277 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Panasonic intellectual property management co., ltd. (20240128030). LITHIUM-ION CAPACITOR simplified abstract (hist) [4,007 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Intel corporation (20240136292). MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (hist) [3,000 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Panasonic intellectual property management co., ltd. (20240128029). SOLID ELECTROLYTIC CAPACITOR AND MANUFACTURING METHOD THEREFOR simplified abstract (hist) [3,790 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Intel corporation (20240136279). INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract (hist) [3,961 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Panasonic intellectual property management co., ltd. (20240128026). SOLID-ELECTROLYTE CAPACITOR AND METHOD FOR MANUFACTURING SAME simplified abstract (hist) [4,223 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Intel corporation (20240136278). STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (hist) [3,727 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Panasonic intellectual property management co., ltd. (20240127998). MAGNETIC MATERIAL, POWDER MAGNETIC CORE, INDUCTOR, AND METHOD OF MANUFACTURING POWDER MAGNETIC CORE simplified abstract (hist) [3,549 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Intel corporation (20240136277). TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR AND METHODS OF FABRICATION simplified abstract (hist) [4,328 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:57, 26 April 2024 Panasonic intellectual property management co., ltd. (20240127574). IMAGING SYSTEM, METHOD USED IN IMAGING SYSTEM, AND STORAGE MEDIUM STORING COMPUTER PROGRAM USED IN IMAGING SYSTEM simplified abstract (hist) [3,927 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:56, 26 April 2024 Intel corporation (20240136269). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract (hist) [4,031 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:56, 26 April 2024 Panasonic intellectual property management co., ltd. (20240126935). DATA PROCESSING SYSTEM, DATA PROCESSING METHOD, PROGRAM, AND DATA PROCESSING INTEGRATION SYSTEM simplified abstract (hist) [4,301 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:56, 26 April 2024 Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (hist) [4,995 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:56, 26 April 2024 Panasonic intellectual property management co., ltd. (20240126635). INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM STORING PROGRAM simplified abstract (hist) [4,492 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:56, 26 April 2024 Intel corporation (20240136243). COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract (hist) [4,578 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:56, 26 April 2024 Panasonic intellectual property management co., ltd. (20240126300). INFORMATION OUTPUT METHOD, MOBILE OBJECT CONTROL SYSTEM, AND RECORDING MEDIUM simplified abstract (hist) [2,990 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 03:56, 26 April 2024 Intel corporation (20240135750). INITIALIZER FOR CIRCLE DISTRIBUTION FOR IMAGE AND VIDEO COMPRESSION AND POSTURE DETECTION simplified abstract (hist) [4,858 bytes] Wikipatents (talk | contribs) (Creating a new page)