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  • 18502777. PHOTO-DETECTION APPARATUS AND PHOTO-DETECTION SYSTEM simplified abstract (CANON KABUSHIKI KAISHA)
    [[Category:H01L31/107]] [[Category:G01S17/10]]
    3 KB (351 words) - 05:28, 4 March 2024
  • 20240048093. PHOTOVOLTAIC MODULE WITH A CROSS RAIL ASSEMBY simplified abstract (Maxeon Solar Pte. Ltd.)
    [[Category:H02S30/10]] [[Category:H01L31/048]]
    4 KB (588 words) - 03:49, 9 February 2024
  • Patent Applications Report for 10th Nov 2023
    ...06V10/82|G06V10/82]] (10 applications), [[:Category:H04W48/18|H04W48/18]] (10 applications) ...78|H01L29/78]] (14 applications), [[:Category:H01L29/66795|H01L29/66795]] (10 applications), [[:Category:H01L29/66545|H01L29/66545]] (8 applications), [[
    28 KB (3,504 words) - 04:04, 4 December 2023
  • AR/VR/XR patent applications on May 16th, 2024
    IPC Code(s): G16H40/20, G06F16/901, G06Q10/0631, G06Q10/0639, G06Q10/10, G06Q50/04, G06V20/20, G16H70/40, H04N7/14 ...F16/901]][[Category:G06Q10/0631]][[Category:G06Q10/0639]][[Category:G06Q10/10]][[Category:G06Q50/04]][[Category:G06V20/20]][[Category:G16H70/40]][[Catego
    22 KB (3,269 words) - 02:46, 23 May 2024
  • Patent Applications Report for 12th May 2023
    ...has applied for patents in the areas of [[:Category:H04W76/14|H04W76/14]] (10), [[:Category:H04W72/23|H04W72/23]] (8), [[:Category:H04W4/08|H04W4/08]] (8 ...:H01L23/00|H01L23/00]] (15 applications), [[:Category:G06F1/16|G06F1/16]] (10 applications)
    36 KB (4,424 words) - 02:20, 3 January 2024
  • Patent Applications Report for 5th Jan 2024
    ...has applied for patents in the areas of [[:Category:H04W24/10|H04W24/10]] (10), [[:Category:G06F3/01|G06F3/01]] (9), [[:Category:G06F3/0482|G06F3/0482]] ...3/498|H01L23/498]] (10 applications), [[:Category:H01L29/775|H01L29/775]] (10 applications), [[:Category:H01L24/16|H01L24/16]] (8 applications), [[:Categ
    38 KB (4,598 words) - 11:03, 5 January 2024
  • TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. patent applications on February 8th, 2024
    ...s applied for patents in the areas of [[:Category:G02F1/1368|G02F1/1368]] (10), [[:Category:G09G3/20|G09G3/20]] (8), [[:Category:G09G3/36|G09G3/36]] (7), IPC Code(s): H01L31/113, H01L31/0392, H01L31/0224
    36 KB (5,438 words) - 04:09, 9 February 2024
  • Patent Applications Report for 2nd Feb 2024
    ...[[:Category:G06F9/48|G06F9/48]] (10), [[:Category:G06F9/4881|G06F9/4881]] (10), [[:Category:G06F9/544|G06F9/544]] (7), [[:Category:G06T5/20|G06T5/20]] (6 Number of patent applications containing 'Cloud Computing' or its variations: 10
    46 KB (5,621 words) - 06:41, 2 February 2024
  • Cisco Technology, Inc. patent applications on February 1st, 2024
    ...] (6), [[:Category:H04L45/02|H04L45/02]] (5), [[:Category:H04L67/10|H04L67/10]] (4), [[:Category:H04L45/302|H04L45/302]] (4), [[:Category:H04L41/22|H04L4 IPC Code(s): H01L31/105, H01L31/028
    41 KB (6,277 words) - 04:27, 2 February 2024
  • Patent Applications Report for 24th Nov 2023
    .... has applied for patents in the areas of [[:Category:G06T7/70|G06T7/70]] (10), [[:Category:G06T19/20|G06T19/20]] (8), [[:Category:G06T19/00|G06T19/00]] ...td. has filed patents in the areas of [[:Category:H01L29/775|H01L29/775]] (10 applications), [[:Category:H10B41/27|H10B41/27]] (7 applications), [[:Categ
    36 KB (4,390 words) - 15:28, 6 December 2023
  • Patent Applications Report for 23rd Jun 2023
    ...30/10]] (2), [[:Category:H02S20/25|H02S20/25]] (2), [[:Category:H01L31/049|H01L31/049]] (2), [[:Category:H02S40/36|H02S40/36]] (2), [[:Category:G06F17/16|G06 [[:Category:NVIDIA Corporation|NVIDIA Corporation]]: 10 patent applications[[Category:NVIDIA Corporation]]
    36 KB (4,442 words) - 02:33, 5 January 2024
  • Patent Applications Report for 6th Jan 2023
    [[:Category:NVIDIA Corporation|NVIDIA Corporation]]: 10 patent applications[[Category:NVIDIA Corporation]] IPC Code(s): G16B20/00, G16B30/10
    38 KB (4,652 words) - 00:59, 2 January 2024
  • Patent Applications Report for 10th Feb 2023
    ...applied for patents in the areas of [[:Category:G06F3/04817|G06F3/04817]] (10), [[:Category:G06F3/01|G06F3/01]] (7), [[:Category:G06F9/451|G06F9/451]] (7 ...:H04M1/02|H04M1/02]] (10 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications)
    39 KB (4,888 words) - 04:21, 2 January 2024
  • Patent Applications Report for 16th Feb 2024
    ...:Category:H04L5/0051|H04L5/0051]] (13), [[:Category:H04W72/12|H04W72/12]] (10), [[:Category:H04W72/1273|H04W72/1273]] (8) ...tegory:H04L5/14|H04L5/14]] (20 applications), [[:Category:H04W24/10|H04W24/10]] (16 applications), [[:Category:H04W72/12|H04W72/12]] (16 applications)
    46 KB (5,662 words) - 06:55, 21 February 2024
  • Patent Applications Report for 8th Mar 2024
    ...tegory:H04L5/00|H04L5/00]] (22 applications), [[:Category:H04W24/10|H04W24/10]] (12 applications), [[:Category:H04L5/14|H04L5/14]] (9 applications), [[:C ...0/658|H01M10/658]] (16 applications), [[:Category:H01M50/566|H01M50/566]] (10 applications)
    46 KB (5,670 words) - 04:12, 19 March 2024
  • Patent Applications Report for 3rd Feb 2023
    ...s applied for patents in the areas of [[:Category:G06F3/0482|G06F3/0482]] (10), [[:Category:H04L5/00|H04L5/00]] (7), [[:Category:H04W36/14|H04W36/14]] (6 ...LTD. has filed patents in the areas of [[:Category:H04W24/10|H04W24/10]] (10 applications), [[:Category:H04W24/08|H04W24/08]] (8 applications), [[:Categ
    39 KB (4,880 words) - 03:14, 2 January 2024
  • NEC Corporation patent applications on February 29th, 2024
    IPC Code(s): G06Q10/06, G06Q10/10, G06V40/16 ...h information identifying the user.[[Category:G06Q10/06]][[Category:G06Q10/10]][[Category:G06V40/16]][[Category:nec corporation]]
    57 KB (8,554 words) - 04:59, 4 March 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
    ...[[:Category:H01L23/31|H01L23/31]] (10), [[:Category:H01L21/78|H01L21/78]] (10), [[:Category:H01L23/522|H01L23/522]] (9) ...ging from 25 atomic % to 60 atomic %, z is a nitrogen content ranging from 10 atomic % to 20 atomic %, and a sum of x, y, and z is 100 atomic %.[[Categor
    94 KB (13,938 words) - 04:25, 2 February 2024
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
    IPC Code(s): H01L23/10, H01L23/00, H01L23/36, H01L23/42, H01L25/00, H01L25/18 ...ce material different from the elastic adhesive material.[[Category:H01L23/10]][[Category:H01L23/00]][[Category:H01L23/36]][[Category:H01L23/42]][[Catego
    105 KB (15,276 words) - 04:53, 11 April 2024
  • CANON KABUSHIKI KAISHA patent applications on February 29th, 2024
    ...:Category:H04N19/70|H04N19/70]] (10), [[:Category:H04N19/176|H04N19/176]] (10), [[:Category:G06T7/73|G06T7/73]] (9) IPC Code(s): G06V40/10, G03B13/36, G06F3/04842, G06T7/20, G06T7/62
    108 KB (16,553 words) - 04:58, 4 March 2024

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