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Create the page "H01L21/463" on this wiki! See also the search results found.
- [[Category:H01L21/463]]3 KB (471 words) - 06:03, 20 February 2024
- IPC Code(s): B24B49/00, H01L21/304, H01L21/67 ...the polishing pad.[[Category:B24B49/00]][[Category:H01L21/304]][[Category:H01L21/67]][[Category:taiwan semiconductor manufacturing company, ltd.]]83 KB (12,114 words) - 04:35, 20 February 2024
- ...8B1/00, B33Y10/00, B33Y30/00, B33Y70/00, B33Y80/00, H01L21/02, H01L21/288, H01L21/67 ...ategory:B33Y80/00]][[Category:H01L21/02]][[Category:H01L21/288]][[Category:H01L21/67]][[Category:texas instruments incorporated]]55 KB (8,096 words) - 08:52, 11 April 2024
- IPC Code(s): H01L21/768, H01L23/00, H01L23/48 ...a layer above the rear-side electrode and the insulating layer.[[Category:H01L21/768]][[Category:H01L23/00]][[Category:H01L23/48]][[Category:kabushiki kaish110 KB (16,569 words) - 07:41, 22 March 2024
- IPC Code(s): G03F7/20, G03F7/00, H01L21/66 ...lengths, respectively.[[Category:G03F7/20]][[Category:G03F7/00]][[Category:H01L21/66]][[Category:samsung electronics co., ltd.]]233 KB (35,896 words) - 02:47, 26 April 2024
- IPC Code(s): H01L21/768 ...d a second portion comprising tungsten, above the first portion.[[Category:H01L21/768]][[Category:qualcomm incorporated]]204 KB (30,965 words) - 07:40, 22 March 2024
- IPC Code(s): F16J15/02, H01J37/32, H01L21/683, H02N13/00 [[Category:F16J15/02]][[Category:H01J37/32]][[Category:H01L21/683]][[Category:H02N13/00]][[Category:Lam Research Corporation]]254 KB (36,510 words) - 03:59, 19 March 2024
- ...ode(s): B23K26/53, B23K26/40, B23K26/402, B28D5/00, H01L21/02, H01L21/304, H01L21/78 ...Category:B28D5/00]][[Category:H01L21/02]][[Category:H01L21/304]][[Category:H01L21/78]][[Category:Siltectra GmbH]]281 KB (40,348 words) - 07:08, 22 February 2024
- IPC Code(s): H01J37/32, H01L21/67, H01L21/687 [[Category:H01J37/32]][[Category:H01L21/67]][[Category:H01L21/687]][[Category:Lam Research Corporation]]313 KB (44,738 words) - 04:14, 2 February 2024