Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on April 18th, 2024
Samsung Electronics Co., Ltd.: 193 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H10B80/00 (18), H01L23/00 (17), H10B43/27 (15), H01L29/775 (14), H01L25/065 (13)
With keywords such as: device, layer, configured, semiconductor, including, based, substrate, portion, information, and structure in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Iksang KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinsun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A45C11/00, G06F1/16
Abstract: according to an embodiment of the disclosure, a support cover of an electronic device may include: a first main area; a second main connected to be rotatable relative to the first main area; a first sub area connected to be rotatable relative to the second main area; a second sub area a connected to be rotatable relative to the first sub area and having a length greater than a length of the first sub area in a first direction; at least one connector disposed on the second sub area and configured to be fixed to at least a part of the electronic device; and a first protrusion portion disposed adjacent to the first sub area and protruding from the second sub area.
20240122328.HAIR DRYER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hochae LEE of Suwon-si (KR) for samsung electronics co., ltd., Woojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinbaek KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeesu PARK of Suwon-si (KR) for samsung electronics co., ltd., Changhoon OH of Suwon-si (KR) for samsung electronics co., ltd., Kyungmok YOO of Suwon-si (KR) for samsung electronics co., ltd., Kwango CHO of Suwon-si (KR) for samsung electronics co., ltd., Joongkeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Qasim KHAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A45D20/50
Abstract: a hair dryer including a main body; a fan inside the main body to generate a flow of air; and a nozzle connected to the main body so that the air flows into the nozzle. the nozzle includes a nozzle body having an inner space, a nozzle partition wall inside the nozzle body dividing the inner space into first and second nozzle passages, a plurality of first nozzle holes formed in the nozzle body to communicate with the first nozzle passage, and a plurality of second nozzle holes formed in the nozzle body to communicate with the second nozzle passage. the nozzle is configured so that air flowing into the first nozzle passage is discharged through the first nozzle holes in a first direction, and air flowing into the second nozzle passage is discharged through the second nozzle holes in a second direction that is different from the first direction.
20240122420.CLEANER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Joongkeun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jinbaek KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L5/28, A47L9/00, A47L9/10, A47L9/16
Abstract: a cleaner including a body including a body exhaust vent; a filter installable inside the body; and a fan motor device including a rotatable impeller to generate a suction force inside the body, a motor to rotate the impeller, and a diffuser device including a radiating diffuser extending in a radial direction from a rotational axis of the impeller, and an axial diffuser extending from the radiating diffuser. the fan motor device is configured so that, with the filter installed inside the body, rotation of the impeller by the power provided by the motor causes air to pass through the fan motor device and be discharged from the impeller, and then guided by the radiating diffuser in the radial direction from the rotational axis of the impeller, and then guided by the axial diffuser to the filter to be filtered, and then discharged through the body exhaust vent.
Inventor(s): Heeyuel ROH of Suwon-si (KR) for samsung electronics co., ltd., Kookjeong SEO of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin JEON of Suwon-si (KR) for samsung electronics co., ltd., Haejin SONG of Suwon-si (KR) for samsung electronics co., ltd., Jaeeun HUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L15/48, A47L15/42, A47L15/46
Abstract: a dishwasher including a tub including an opening; a door configured to open and close the opening; a first blower positioned at a first side of the tub; and a second blower positioned at a second side of the tub; wherein the first blower is configured to, while the door is positioned to open the opening, discharge a portion of air inside of the tub through the opening to outside of the tub so as to lower humidity inside of the tub, and the second blower is configured to, while the door is positioned to open the opening, circulate air inside of the tub that is not discharged by the first blower.
Inventor(s): Joongwon NA of Suwon-si (KR) for samsung electronics co., ltd., Minsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Heemoon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Kookjeong SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L23/20, A47L23/18
Abstract: the present disclosure relates to a shoe care apparatus including: a main body, a care room provided in the main body configured to accommodate shoes, a machine room provided in the main body configured to accommodate a heat pump device including an evaporator and a condenser, a circulation flow path configured to communicate with the care room so that air discharged from the care room passes through the evaporator and the condenser and is supplied to the care room, a first blower fan disposed on the circulation flow path configured to blow air in the circulation flow path in a first direction so that the air in the circulation flow path passes through the machine room from the care room and circulates back to the care room, and a second blower fan disposed in the machine room configured to blow air in the machine room in a second direction so that the air in the machine room passes through the condenser.
Inventor(s): Mostafa EL-KHAMY of San Diego CA (US) for samsung electronics co., ltd., Khoung VO of Irvine CA (US) for samsung electronics co., ltd., Yoojin CHOI of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): A61B5/327, A61B5/024, A61B5/352, A61B5/361
Abstract: a system and a method are disclosed for afib detection using ecg signals generated from monitored ppg signals. a method includes receiving ppg signals of a user measured by a ppg sensor; translating the measured ppg signals into ecg signals using a dynamic model; analyzing the translated ecg signals using an afib detection model, which is trained on measured ecg signals for afib detection; and providing the analyzed afib detection results to the user.
Inventor(s): Hyunah KIM of Suwon-si (KR) for samsung electronics co., ltd., Seonuk NA of Suwon-si (KR) for samsung electronics co., ltd., Joonhyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeeyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngchal PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjoon SEO of Suwon-si (KR) for samsung electronics co., ltd., Youngtae SONG of Suwon-si (KR) for samsung electronics co., ltd., Kisup LEE of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungjune CHO of Suwon-si (KR) for samsung electronics co., ltd., Sungjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Younglae JO of Suwon-si (KR) for samsung electronics co., ltd., Wangbyung CHAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A62B18/00, A62B9/00, A62B18/10, A62B23/02
Abstract: a mask and a controlling method thereof are disclosed. the mask includes a fan that provides an air volume to an inside of the mask, a valve that discharges air from the mask, a pressure sensor, and a processor. the processor may control the pressure sensor to detect a maximum pressure value and a minimum pressure value inside the mask worn by a user. the processor may identify a time for a single breath based on a maximum pressure value and a minimum pressure value detected at the pressure sensor. the processor may identify a number of breaths based on the identified time for the single breath and a predetermined time. the processor may control the fan to provide an air volume set at a level corresponding to the identified number of breaths among a plurality of levels divided based on a predetermined number of breaths.
Inventor(s): Chiyoung AHN of Suwon-si (KR) for samsung electronics co., ltd., Joayoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Harkjoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B24/00, A61B5/11, A63B71/06
Abstract: an electronic device and/or a wearable device providing an exercise program, and/or a control method thereof are provided. the electronic device may include a communication module configured to communicate with the wearable device. the electronic device may include at least one processor. the processor may provide a first exercise program of a first exercise period according to an initial exercise intensity range to a user wearing the wearable device. the processor may measure a first posture score of the user while the user is performing the first exercise program. the processor may compare the first posture score to a posture boundary value. the processor may set a personal exercise intensity range of the user based on a result of the comparing. the processor may provide a second exercise program of a second exercise period according to the personal exercise intensity range.
Inventor(s): Youn Gon Oh of Suwon-si (KR) for samsung electronics co., ltd., Ji Hun Kim of Suwon-si (KR) for samsung electronics co., ltd., Sang Hyuk Park of Suwon-si (KR) for samsung electronics co., ltd., Young-Kyu Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65G1/06, B65G1/04, B65G49/06
Abstract: an inter-floor transport system includes a first interface unit at a first floor and configured to receive containers from a transport vehicle, and a car configured to receive containers from the first interface unit at the first floor and move containers to a second floor, where the car includes a cage, a storage unit in the cage and including a plurality of storage areas, and an arrangement unit in the cage, the arrangement unit being configured to receive containers from the first interface unit and store containers in respective storage areas of the plurality of storage areas of the storage unit.
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/12, H10K50/15, H10K50/16, H10K85/30
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/12, H10K50/15, H10K50/16, H10K85/30
Abstract:
m(l)(l) formula 1
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/12, H10K50/15, H10K50/16, H10K85/30
Abstract: wherein, mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/12, H10K50/15, H10K50/16, H10K85/30
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Juhee Moon of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/12, H10K50/15, H10K50/16, H10K85/30
Abstract: wherein xis c or n, xis c or n, at least one ris a c-calkyl group that is substituted with a fluorine, b1 is an integer from 1 to 6, b2 is an integer from 1 to 10, * and *′ each indicate a binding site to m, and the other substituent groups of formulae 1a and 1b are as described herein.
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract:
m(l)(l) formula 1
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract: wherein, in formula 1, mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Jongwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Jungok Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K85/30
Abstract: wherein, xis c or n, xis c or n, yis o, s, se, c(r)(r), or n(r), at least one ris a c-calkyl group that is substituted with a fluorine, b2 is an integer from 1 to 6, b11 is 1 or 2, b12 is an integer from 1 to 4, * and *′ each indicate a binding site to m, and the other substituent groups in formulae 1a and 1b are as described herein.
Inventor(s): Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si, (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si, (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si, (KR) for samsung electronics co., ltd., Chanjae AHN of Suwon-si (KR) for samsung electronics co., ltd., Jungha CHAE of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08F228/06, G03F7/038, G03F7/20
Abstract: provided are a polymer, a resist composition including the same, and a method of forming a pattern using the resist composition, the polymer including one or more of a first repeating unit represented by formula 1 and a second repeating unit represented by formula 2, and free of a repeating unit of which a structure changes by an acid:
Inventor(s): Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si, (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si, (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si, (KR) for samsung electronics co., ltd., Chanjae AHN of Suwon-si (KR) for samsung electronics co., ltd., Jungha CHAE of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08F228/06, G03F7/038, G03F7/20
Abstract:
Inventor(s): Minsang KIM of Suwon-si (KR) for samsung electronics co., ltd., Haengdeog KOH of Suwon-si, (KR) for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si, (KR) for samsung electronics co., ltd., Beomseok KIM of Suwon-si, (KR) for samsung electronics co., ltd., Chanjae AHN of Suwon-si (KR) for samsung electronics co., ltd., Jungha CHAE of Suwon-si (KR) for samsung electronics co., ltd., Sungwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C08F228/06, G03F7/038, G03F7/20
Abstract: in formulae and , rto r, b, x, rto r, b, and y are as described in the specification.
Inventor(s): Jong Hoon WON of Suwon-si (KR) for samsung electronics co., ltd., Deuk Kyu MOON of Suwon-si (KR) for samsung electronics co., ltd., Shang Hyeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Tae-Gon KIM of Suwon-si (KR) for samsung electronics co., ltd., Young Hoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Deuk Seok CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/02, C08K9/04, C09K11/08, C09K11/88, H01L25/075, H10K59/38
Abstract: a quantum dot, a quantum dot composite, a composition for preparing a quantum dot composite, a display panel including the quantum dot composite, and an electronic device including the display panel, wherein the quantum dot includes a core including a semiconductor nanocrystal including indium and phosphorus, a shell disposed on the core and including a semiconductor nanocrystal, and a compound represented by chemical formula 1 and a compound represented by chemical formula 2, both of which are present on the surface of the shell:
Inventor(s): Jong Hoon WON of Suwon-si (KR) for samsung electronics co., ltd., Deuk Kyu MOON of Suwon-si (KR) for samsung electronics co., ltd., Shang Hyeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Tae-Gon KIM of Suwon-si (KR) for samsung electronics co., ltd., Young Hoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Deuk Seok CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/02, C08K9/04, C09K11/08, C09K11/88, H01L25/075, H10K59/38
Abstract:
Inventor(s): Kyungrim KIM of Suwon-si (KR) for samsung electronics co., ltd., Dowon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunja KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngeun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/448, C23C16/455, C23C16/52
Abstract: a canister supplying a precursor to a processing chamber includes a body, a first valve introducing a carrier gas into the body, a second valve discharging a sublimated gas of a solid precursor into a processing chamber, a precursor accommodating tray accommodating the solid precursor, and at least one piezoelectric transducer at least one of vibrating the precursor accommodating tray or measuring a resonance frequency.
Inventor(s): Chan Kyu LIM of Suwon-si (KR) for samsung electronics co., ltd., Yoonbon Koo of Suwon-si (KR) for samsung electronics co., ltd., Hanhim Kang of Suwon-si (KR) for samsung electronics co., ltd., Suji Gim of Suwon-si (KR) for samsung electronics co., ltd., Jongkoo Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/455, C23C16/52, H10B41/27, H10B43/27
Abstract: the present disclosure provides methods and apparatuses for supplying a process gas in a semiconductor manufacturing process. in some embodiments, the method includes heating, using one or more heating devices of the semiconductor manufacturing apparatus, a gas tank and a gas line of the semiconductor manufacturing apparatus. the method further includes filling, through the gas line, the gas tank with a reaction gas. the method further includes changing, using the one or more heating devices, a temperature of the reaction gas in the gas tank. the method further includes supplying the reaction gas from the gas tank to a process chamber of the semiconductor manufacturing apparatus. the changing of the temperature of the reaction gas includes decomposing a portion of the reaction gas into one or more materials different from the reaction gas.
20240125034.CLOTHES TREATING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yurim PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihye LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongbin LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F37/30, D06F23/04, D06F37/20, D06F37/24, H02K7/116, H02K21/22, H02K49/10
Abstract: a clothes treating apparatus including a housing; a tub inside the housing; a drum configured to be rotated inside the tub; a spin-drying shaft connected to the drum; a motor assembly including a rotor configured to be rotated; a coupler: a first element; and a second element inside the coupler, wherein the coupler is positionable in a first position in which the coupler is coupled to the spin-drying shaft and the rotor, the coupler is positionable in a second position in which the coupler is coupled to the spin-drying shaft and disengaged from the rotor, and with the coupler being positioned in the second position, the first element and the second element are configured to interact to move the second element away from the first element and thereby move the coupler from the second position to the first position.
20240125036.WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hak Jae LEE of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeong Haeng LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/10, D06F29/00
Abstract: a washing machine comprises a housing, a drum rotatably disposed inside the housing, a driving shaft configured to transfer a rotational force from a driving motor of the washing machine to the drum, and a driving shaft flange configured to connect the driving shaft to the drum. the driving shaft flange comprises a first surface, a second surface substantially parallel to the first surface, wherein the first surface and the second surface are spaced apart from each other by a predetermined distance in the vertical direction, and an extension portion formed perpendicular to the first surface and the second surface and connecting the first surface to the second surface. an edge of the first surface and an edge of the second surface and an edge of the extension portion are substantially aligned in vertical direction of the drum.
20240125039.CLOTHES TREATING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junhong PARK of Suwon-si (KR) for samsung electronics co., ltd., Woojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinbaek KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihoon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F58/20, D06F25/00, D06F29/00, D06F37/30, D06F58/22, D06F58/24
Abstract: a clothes treating apparatus includes: a cabinet; a tub; a drum; a base forming an air flow path including an air inlet and an air outlet; a heat exchanger; a supply duct forming a first supply flow and a second supply flow path; a discharge duct forming a first discharge flow path and a second discharge flow path; a first damper configured to be movable to a first position of opening the first supply flow path and closing the second supply flow path or a second position of closing the first supply flow path and opening the second supply flow path; and a second damper configured to be movable to a third position of opening the first discharge flow path and closing the second discharge flow path or a fourth position of closing the first discharge flow path and opening the second discharge flow path.
Inventor(s): Jaehyoung SIM of Suwon-si (KR) for samsung electronics co., ltd., Kyunghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunggoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjoon SEO of Suwon-si (KR) for samsung electronics co., ltd., Eomji JANG of Suwon-si (KR) for samsung electronics co., ltd., Sungjune CHO of Suwon-si (KR) for samsung electronics co., ltd., Taesung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F3/147, B01D46/00, B01D46/42, B01D53/26, B01D53/88, F24F8/108, F24F12/00
Abstract: the present disclosure relates to a ventilation apparatus including a housing including: an intake flow path provided to draw outdoor air into an indoor space and an discharge flow path provided to discharge indoor air to the outside, a cover covering the housing, a total heat exchanger configured to exchange heat between air flowing in the intake flow path and air flowing in the discharge flow path, and a dehumidification unit including a heat exchanger provided on the intake flow path configured to remove moisture in the air flowing in the intake flow path and a drain tray configured to collect condensate generated from the heat exchanger, wherein the housing includes a first housing including a first hole asymmetrically formed on one surface of the housing with respect to a center line of the one surface extending in a long axis direction and a short axis direction of the one surface and configured to allow the drain tray and the total heat exchanger to be withdrawn from the outside of the housing, and a second housing coupled to the first housing in an up-down direction and including a second hole disposed on an other surface of the housing and having a shape corresponding to the first hole in the up-down direction, wherein the cover includes a first cover forming a lower portion of the cover and a second cover coupled to the first cover in the up-down direction and forming an upper portion of the cover, and wherein one of the first housing and the second housing is covered by the first cover, and an other one of the first housing and the second housing is covered by the second cover.
Inventor(s): Seulki MIN of Suwon-si (KR) for samsung electronics co., ltd., Heemoon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Gaeul CHO of Suwon-si (KR) for samsung electronics co., ltd., Kookjeong SEO of Suwon-si (KR) for samsung electronics co., ltd., Insub LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25B41/20, F25B5/02, F25B41/37
Abstract: a refrigerator includes: a compressor; a condenser; a hot pipe; at least one capillary tube; at least one evaporator; a valve device including: an input port connected to the condenser; a first port connected to one end of the hot pipe; a second port connected to an other end; and at least one output port connected to the at least one capillary tube; and a controller configured to: control the valve device to operate in the first mode by connecting one of the first port and the second port to the input port and connecting an other one to the output port; control the valve device to operate in the second mode, by closing one of the first port and the second port and connecting an other one to the output port; and control the valve device to operate in the third mode, by closing all the first port and the second port.
Inventor(s): Suhyeong LIM of Suwon-si (KR) for samsung electronics co., ltd., Joongkyung PARK of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/02, E05F11/00, F25D25/02
Abstract: provided is a refrigerator including a main body, a storage compartment provided inside the main body with a front side that is open, a drawer-type door slidably coupled to the main body to open and close the storage compartment, and including a door cap having a handle pocket, and a door opening device coupled to the door cap and configured to open the drawer-type door. the door opening device includes a handle lever rotatably coupled to the door cap. the door opening device includes a slider disposed at a rear of the handle lever to perform straight linear motion in an upper-to-lower direction by the handle lever. the door opening device includes a pusher coupled at a rear of the slider to perform straight linear motion in a front-to-rear direction, and, while the slider is moving upward, perform straight linear motion rearward to press the main body to open the drawer-type door.
20240125709.SEMICONDUCTOR MEASUREMENT APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Donggun Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaewon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo Ahn of Suwon-si (KR) for samsung electronics co., ltd., Juntaek Oh of Suwon-si (KR) for samsung electronics co., ltd., Eunsoo Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/88, G01N21/47, G01N21/55, G01N21/95
Abstract: a semiconductor measurement apparatus includes an illuminator configured to output light having a first wavelength band and light having a second wavelength band, different from the first wavelength band, a stage on which a test object is positioned, a camera configured to receive light reflected or scattered from the test object or transmitted through the test object, and a controller configured to control the illuminator and the camera, and to measure, based on information indicated by the light received by the camera, a plurality of structures included in the test object. the controller is configured to set an exposure time of the camera to a first exposure time while the illuminator outputs the light having the first wavelength band, and to set the exposure time of the camera to a second exposure time, different from the first exposure time, while the illuminator outputs the light having the second wavelength band.
Inventor(s): Cheongwon Lee of Suwon-si (KR) for samsung electronics co., ltd., Gyosoo Choo of Suwon-si (KR) for samsung electronics co., ltd., Youngwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/26
Abstract: an embodiment provides a test element group (teg) circuit, including: a first pad configured for a test voltage to be applied; an amplifier including a first input terminal connected to the first pad, a second input terminal connected to a first terminal of a test transistor, and an output terminal electrically connected to the second input terminal; a variable resistor including one terminal connected to the output terminal of the amplifier and the other terminal connected to the first terminal of the test transistor; and a gate driving circuit that supplies a gate voltage to a gate of the test transistor.
Inventor(s): Geonwoong JUNG of Suwon-si (KR) for samsung electronics co., ltd., Byonghyo SHIM of Seoul (KR) for samsung electronics co., ltd., Hyunsoo KIM of Seoul (KR) for samsung electronics co., ltd., Yongsuk BYUN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G01S5/02, H04B7/04
Abstract: the present disclosure relates to a method and device for communication by a base station in a wireless communication system supporting multiple reconfigurable intelligent surface (ris) devices. according to an embodiment a method for operating a base station, the method comprises selecting at least two reference reconfigurable intelligent surface (ris) devices for estimating a position of a user equipment (ue) from among a plurality of ris devices, estimating position information about the ue using the selected at least two reference ris devices, receiving an uplink pilot signal of the ue through the selected at least two reference ris devices; and estimating a multi-ris channel for the plurality of ris devices based on the uplink pilot signal of the ue and the estimated position information about the ue.
Inventor(s): Sunil KIM of Suwon-si (KR) for samsung electronics co., ltd., Junsuk RHO of Pohang-si (KR) for samsung electronics co., ltd., Younghwan YANG of Pohang-si (KR) for samsung electronics co., ltd., Junghyun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/481, G01S17/08, G02F1/21
Abstract: provided is a spatial light modulator configured to modulate light, the spatial light modulator including a first reflective layer, a resonance layer on the first reflective layer, and a second reflective layer on the resonance layer, the second reflective layer including a plurality of grating structures space apart from each other, wherein the plurality of grating structures include silicon (si) having an extinction coefficient k that is less than or equal to 1e-5 with respect to light in the predetermined wavelength band.
Inventor(s): Rebal Al Jurdi of Allen TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Jianyuan Yu of Blacksburg VA (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Kyu-Hui Han of Suwon-si (KR) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): G01S13/76
Abstract: an indoor positioning method includes scanning for registered wi-fi nodes with known coordinates to generate a list of the registered wi-fi nodes. the method also includes performing a ranging operation by (i) selecting nodes to range with from the list of the registered wi-fi nodes, and (ii) processing ranging responses from the selected nodes to generate a series of distance measurements. the method further includes obtaining a series of sensor readings generated by one or more inertial measurement units (imus) of a device. the method also includes estimating a position of the device based on the series of distance measurements and the series of sensor readings using first and second filtering operations that are performed in parallel.
Inventor(s): Jong-Sok KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungdo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seung Tae KHANG of Suwon-si (KR) for samsung electronics co., ltd., Jinyong JEON of Suwon-si (KR) for samsung electronics co., ltd., Young Rae CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S13/931, G06V10/82, G06V20/58
Abstract: a method and device for object recognition for information collected from a sensor of a moving object are disclosed. the method may include identifying a target with a confidence level of recognition accuracy less than a threshold, based on first sensing information collected from a moving object, obtaining second sensing information on the target from an interworking moving object, synchronizing the first sensing information and the second sensing information based on time information included in the first sensing information and time information included in the second sensing information, and training a neural network for estimating recognition information of the target from the first synchronized sensing information by using information on the target included in the second synchronized sensing information as ground truth data.
Inventor(s): Sungdo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seung Tae KHANG of Suwon-si (KR) for samsung electronics co., ltd., Jong-Sok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinyong JEON of Suwon-si (KR) for samsung electronics co., ltd., Young Rae CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S13/931, G01S7/35, G01S13/42, G01S13/58
Abstract: a method of predicting a movement of a cut-in object, including separating a doppler velocity corresponding to at least one wheel of the cut-in object from radar data based on a velocity of the cut-in object, determining a position of the at least one wheel of the cut-in object based on the doppler velocity, generating at least one of first movement information related to a horizontal movement of the cut-in object or second movement information related to a moving direction of the cut-in object based on the position of the at least one wheel, and determining a position of the cut-in object based on at least one of the first movement information or the second movement information.
Inventor(s): Jungpa SEO of Suwon-si (KR) for samsung electronics co., ltd., Min Heu of Suwon-si (KR) for samsung electronics co., ltd., Hwanseon Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B15/14, G02B3/04, G02B15/22, G02B27/64, H04N23/55, H04N23/68
Abstract: a lens assembly includes a plurality of lenses arranged from an object side to an image side on which an image plane is located, wherein the plurality of lenses include a first lens group that includes at least one lens having a positive refractive power, and is fixed to maintain a constant distance from the image plane during focusing, and a second lens group that includes a lens having at least one aspheric surface, and is configured to perform image plane alignment according to a change in an object distance of an object.
Inventor(s): Sungwoo JANG of Suwon-si (KR) for samsung electronics co., ltd., Sunpyo LEE of Suwon-si (KR) for samsung electronics co., ltd., Euihan JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/24, G03F7/20
Abstract: an extreme ultraviolet (euv) mask may include a substrate having a rectangular shape, a reflective layer on the substrate and having a rectangular shape smaller than the rectangular shape of the substrate, and an absorber layer on the reflective layer. the absorber layer may have a same shape as the rectangular shape of the reflective layer. the absorber layer may include a dummy hole pattern. the dummy hole pattern may be in a rectangular frame shape along an edge portion of the absorber layer and may include a plurality of dummy holes exposing the reflective layer.
Inventor(s): Jonghwan CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H04M1/02, H05K1/18
Abstract: an electronic device is provided. the electronic device includes a housing, a display, a middle plate, an adhesive layer, a support layer, and a coating layer. the housing includes a front plate facing a direction, a rear plate facing an opposite direction, and a lateral member surrounding a space between the front and rear plate. the display is configured to be seen through the front plate, and includes a first and second surface. the middle plate is disposed between the display and the rear plate, and includes a surface facing the display, and a recess. the adhesive layer is attached to the display, and the support layer is disposed between the adhesive layer and the middle plate. the coating layer is disposed between the support layer and the adhesive layer and is disposed in a first portion overlapped with the recess when viewed from the display.
Inventor(s): Jaeha PARK of Suwon-si (KR) for samsung electronics co., ltd., Changtaek KANG of Suwon-si (KR) for samsung electronics co., ltd., Jonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongkwan YANG of Suwon-si (KR) for samsung electronics co., ltd., Hochul HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyoungho BANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F3/16
Abstract: a wearable electronic device according to an embodiment may comprise a plurality of speakers, a plurality of vibration devices, and at least one processor. the at least one processor may be configured to identify a first object corresponding to a first sound and a position of the first object in a virtual space of vr content displayed through the display. the at least one processor may be configured to obtain a second sound corresponding to the movement of the first object based on the first sound and the position of the first object. the at least one processor may be configured to output the second sound through the plurality of speakers. the at least one processor may be configured to determine one or more vibration devices corresponding to the movement of the first object among the plurality of vibration devices. the at least one processor may be configured to control the one or more vibration devices to vibrate while the second sound is output through the plurality of speakers.
Inventor(s): Byeongwook YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/038, G06F3/041, G06V40/12, G06V40/13
Abstract: a method of controlling a wearable device worn on a finger of a user, includes: sensing a contact by a second finger of the user via an outer surface electrode located on an outer circumferential surface of the wearable device worn on a first finger of the user; based on the sensing of the contact, measuring an impedance between the outer surface electrode and an inner surface electrode that is in contact with the first finger of the user; identifying a type of the second finger based on the impedance; and controlling an operation of the wearable device based on the type of the second finger.
Inventor(s): Miyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngchan WOO of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0488, G06F3/01, G06F3/0481, G06F3/0484
Abstract: a device and method for recommending a custom function to the user in an electronic device. the electronic device may obtain information of a user gesture that repeatedly occurs based on interaction of the user detected by at least one sensor and determine one or more customized functions to be suggested to the user, among functions of the electronic device including a plurality of accessibility functions, in consideration of the information of the user gesture. the electronic device may execute a target customized function selected by the user from among the one or more customized functions.
Inventor(s): Junghoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyuntate Kim of Suwon-si (KR) for samsung electronics co., ltd., Hojin Ahn of Suwon-si (KR) for samsung electronics co., ltd., Jihun You of Suwon-si (KR) for samsung electronics co., ltd., Doogie Lee of Suwon-si (KR) for samsung electronics co., ltd., Yeni Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: a storage system includes a host device including a file system configured to set a plurality of block expiration times respectively corresponding to a plurality of data blocks included in a file, and a storage device configured to store data according to control of the host device. the storage device includes a nonvolatile memory device configured to store the plurality of data blocks provided from the host device, a storage timer configured to provide a count value by counting time, and a data deletion manager. the data deletion manager generates a data deletion information table including a plurality of block deletion times based on the plurality of block expiration times provided from the host device. the data deletion manager deletes each data block of the plurality of data blocks stored in the nonvolatile memory device based on the data deletion information table and the count value.
Inventor(s): Hyojin Ahn of Suwon-si (KR) for samsung electronics co., ltd., Seoyeong Lee of Suwon-si (KR) for samsung electronics co., ltd., Hoon Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G11C16/04, G11C16/08, G11C16/26
Abstract: in some embodiments, an operating method of a storage device includes obtaining a plurality of points by searching for a first valley point between threshold voltage distributions of selection memory cells coupled to a selection word line of a plurality of word lines; calculating, using a first function, a first voltage level that corresponds to a first reference count value; calculating, using a second function, a second voltage level that corresponds to the first reference count value; classifying the selection memory cells into a plurality of coupling patterns according to an aggressor cell group of each of adjacent memory cells coupled to at least one adjacent word line adjacent to the selection word line; and performing a read operation, based on the plurality of coupling patterns of the selection memory cells, the first voltage level, and the second voltage level.
Inventor(s): Daniel Lee Helmick of Broomfield CO (US) for samsung electronics co., ltd., Vipin Kumar Agrawal of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: provided is a method for communicating information, the method including determining, by a storage device, that a first region of a source storage includes a storage location including data to be copied from the source storage to a target storage, the first region having a size that is equal to a first granularity size, determining, by the storage device, that a second region within the first region includes the storage location, the second region having a size that is equal to a second granularity size that is less than the first granularity size, determining that the second region is associated with a threshold value, exiting a query pattern that includes the first granularity size and the second granularity size, and sending a results data structure indicating that the second region comprises the storage location.
Inventor(s): Saksham GOYAL of Bengaluru (IN) for samsung electronics co., ltd., Sourabh TIWARI of Bengaluru (IN) for samsung electronics co., ltd., Vinay Vasanth PATAGE of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F9/46
Abstract: methods for executing a user input in an iot environment by at least one iot device. the method may include receiving a user input from a user of the iot device to execute at least one task associated with the iot device. the method may include determining a multimodal context of the iot environment relevant to the at least one task associated with the iot device based on the received user input. the method may include retrieving multimodal data of the iot environment corresponding to the determined multimodal context. the method may include determining a task execution intensity for the task associated with the iot device based on the retrieved multimodal data. the method may include executing the task associated with the at least one iot device using the determined task execution intensity.
Inventor(s): Seunghan Lee of Suwon-si (KR) for samsung electronics co., ltd., Heon Jekal of Suwon-si (KR) for samsung electronics co., ltd., Hyunjoon Yoo of Suwon-si (KR) for samsung electronics co., ltd., Heeseok Eun of Suwon-si (KR) for samsung electronics co., ltd., Jinwook Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F11/14
Abstract: a storage system includes: an interconnector; a plurality of storage devices connected to the interconnector and configured to store data; a host device connected to the interconnector, and configured to: set a plurality of erasure coding schemes that are different from each other, and determine a target erasure coding scheme corresponding to original data to be stored in the plurality of storage devices among the plurality of erasure coding schemes, based on device characteristics of the plurality of storage devices or data characteristics of the original data; and an erasure coding controller configured to: divide the original data into a plurality of data blocks corresponding to the target erasure coding scheme, and generate one or more parity blocks corresponding to the target erasure coding scheme, by encoding the plurality of data blocks.
Inventor(s): Jaeho Cho of Suwon-si (KR) for samsung electronics co., ltd., Sunho Ki of Suwon-si (KR) for samsung electronics co., ltd., Wangseok Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/14, G06F13/42
Abstract: provided is a semiconductor device that includes a plurality of ports and a pcie controller. the pcie controller includes: a link training and status state machine (ltssm) configured to perform a link-up by configuring a plurality of lanes on the plurality of ports, and a memory storing a first preset as a reference value, the first preset being configured based on a successful link-up performed by the ltssm. the pcie controller is configured to perform a verification of a second preset that is configured by the ltssm based on the reference value, to determine whether the second preset is valid.
Inventor(s): Songyi HAN of Hwaseong-si (KR) for samsung electronics co., ltd., Hyunsun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F17/16, G06F18/213, G06N3/08
Abstract: a neural network apparatus for performing a matrix multiplication operation includes a memory having at least one program stored therein and a processor to perform one or more operations by executing the at least one program. the processor can determine whether to divide an initial weight in one of a column direction and a row direction according to whether a reshape operation and a transpose operation are performed before or after a matrix multiplication operation and generate division weights by dividing the initial weight by a head count in the determined direction. also, the processor can generate intermediate feature maps by performing a matrix multiplication operation between the input feature map and the division weights and generate a final feature map based on the intermediate feature maps.
Inventor(s): Intae JIN of Suwon-si (KR) for samsung electronics co., ltd., Wonsuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Juwoan YOO of Suwon-si (KR) for samsung electronics co., ltd., Dasom LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/32, G06F3/041, G06T7/70, G06T17/00, G06V40/16
Abstract: an electronic device is provided. the electronic device includes a display module, at least one camera disposed on the rear surface of the display module, memory for storing information related to user authentication, and a processor operatively connected to the display module, the at least one camera, and the memory. the processor is configured to executes a function for the user authentication, identify face position information of a user by using the at least one camera, identify coordinate information according to a user's touch input inputted through the display module, select the at least one camera based on the face position information and the coordinate information, obtain at least one image using the selected at least one camera, and perform the function for the user authentication based on the obtained at least one image.
Inventor(s): Krishnaditya KRISHNADITYA of Bengaluru (IN) for samsung electronics co., ltd., Rohini NOOKALA of Bangalore (IN) for samsung electronics co., ltd., Pinaki BHASKAR of Bangalore (IN) for samsung electronics co., ltd., Aniruddha BALA of Bengaluru (IN) for samsung electronics co., ltd., Ankit SHARMA of Bangalore (IN) for samsung electronics co., ltd., Vikram MUPPARTHI of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06F40/134
Abstract: a method and a system for classifying one or more hyperlinks in a document are provided. the method includes identifying the one or more hyperlinks in the document based on an analysis of text strings of the document. the method further includes analyzing surrounding text strings around each of the one or more hyperlinks and classifying, based on the analysis of the surrounding text strings around each of the one or more hyperlinks, the one or more hyperlinks into at least one category among a plurality of predetermined categories.
Inventor(s): Sunil Bharitkar of Stevenson Ranch CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F40/284, G06N3/0442
Abstract: one embodiment provides a computer-implemented method that includes utilizing text information obtained from a title of a media content item and a trainable model for improving accuracy for classification of the media content item. the trainable model is utilized using a sequence of text to numeric-vector embeddings for classification of the media content item. at least one of a word embedding model parameter or a latent semantic analysis dimension is jointly optimized using the text information, and a classifier model for maximizing accuracy of the classification of the media content item.
Inventor(s): Kyounghwan MOON of Suwon-si (KR) for samsung electronics co., ltd., Jungyeob CHAE of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/80, G06T5/50, G06T5/92, H04N25/61, H04N25/683
Abstract: an image processing system includes a memory configured to store a plurality of reference images used for image quality tuning, an image signal processor configured to receive a plurality of captured images corresponding to the plurality of reference images and configured to generate a plurality of corrected images by being configured to perform a corresponding image processing operation among a plurality of image processing operations, and a tuning module configured to set parameters of the plurality of image processing operations based on the plurality of corrected images and the plurality of reference images.
Inventor(s): Sungwook HWANG of Suwon-si (KR) for samsung electronics co., ltd., Tae Soo SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seulgi OK of Suwon-si (KR) for samsung electronics co., ltd., Kibum LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G01N23/2251, G06T7/70
Abstract: a defect detection device includes: a memory configured to store a layout image indicating a circuit pattern and indicating a dummy pattern; and a controller comprising an artificial neural network configured to learn the layout image, the controller being configured to: determine, based on an inspection image obtained by photographing an area including a defect on a wafer, whether the defect is in a first area in which the circuit pattern is positioned or in a second area in which the dummy pattern is positioned, by using the artificial neural network, and determine a type of the defect based on whether the defect is positioned is in the first area or in the second area.
20240127426.DEFECT DETECTING DEVICE AND METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungwook Hwang of Suwon-si (KR) for samsung electronics co., ltd., Tae Soo Shin of Suwon-si (KR) for samsung electronics co., ltd., Seulgi Ok of Suwon-si (KR) for samsung electronics co., ltd., Kibum Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T7/60, G06V10/141, G06V10/60
Abstract: a test device includes a memory and a controller. the memory stores reference data including a reference image obtained by photographing a reference pattern on a first semiconductor sample, a first height of the reference pattern, a first shadow length of the reference pattern, and a reference value that represents a correlation between the first height and the first shadow length. the controller receives an image obtained by photographing a pattern on a second semiconductor sample, measures a second shadow length of the pattern from the image, and calculates a second height of the pattern from the second shadow length based on the reference data.
Inventor(s): Ravi SHARMA of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/01, G06T19/20, G06V20/40
Abstract: a method for handling an event of a real environment in a virtual reality (vr) environment, includes: identifying an object, a user, and an event occurring in the real environment around a primary user wearing a vr module implemented by at least one hardware processor; determining a first set of parameters of the identified object and the user, and a second set of parameters of the event and an actor in the event, wherein the actor performs the event and is the user; analyzing the vr environment to determine a suitable part in the vr environment; creating an augmented reality (ar) of the actor; scaling, based on the first set of parameters and the second set of parameters, the ar; aligning the ar in relation to the real environment; and merging the aligned ar into the suitable part of the vr environment while maintaining a context of the vr environment.
Inventor(s): Minho HONG of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd., Saejung SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hoseon SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G10L15/22
Abstract: an electronic device is provided. the electronic device includes a microphone. the electronic device includes a communication circuit. the electronic device includes a processor. the processor is configured to identify a voice command indicating display through a display of a virtual device registered using a software application for controlling another device through the electronic device, based on a recognition of a voice signal obtained through the microphone. the processor is configured to identify, based on the voice command, whether a mixed reality (mr) device configured to display the virtual device is worn. the processor is configured to obtain, in response to identifying that the mr device is worn, an image to be displayed on the display of the virtual device displayed through the mr device, based on device information registered using the software application as associated with the virtual device. the processor is configured to transmit, through the communication circuit to the mr device, a signal for displaying the image on the display of the virtual device displayed through the mr device.
Inventor(s): Sungheon PARK of Suwon-si (KR) for samsung electronics co., ltd., Minjung SON of Suwon-si (KR) for samsung electronics co., ltd., Nahyup KANG of Suwon-si (KR) for samsung electronics co., ltd., Jiyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokhwan JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/46, G06T3/40, G06V10/70
Abstract: an electronic device, from point information and time information, extracts a plurality of pieces of feature data from a plurality of feature extraction models, obtains spacetime feature data based on interpolation of the pieces of feature data, and generate scene information on the target point at the target time instant from the spacetime feature data and a view direction based on the scene information estimation model.
Inventor(s): Qingfeng LIU of San Diego CA (US) for samsung electronics co., ltd., Mostafa EL-KHAMY of San Diego CA (US) for samsung electronics co., ltd., Sukhwan LIM of Los Altos Hills CA (US) for samsung electronics co., ltd.
IPC Code(s): G06V10/94, G06V10/77, G06V10/80, G06V10/82
Abstract: a system and a method are disclosed for processing and combining feature maps using a hardware friendly multi-kernel convolution block (hfmcb). the method including splitting an input feature map into a plurality of feature maps, each of the plurality of feature maps having a reduced number of channels; processing each of the plurality of feature maps with a different series of kernels; and combining the processed plurality of feature maps.
Inventor(s): Seungyong SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jungmo Kang of Suwon-si (KR) for samsung electronics co., ltd., Changhoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongmin Jung of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/32
Abstract: a display device includes: light emitting diode (led) blocks connected in series; a driver integrated circuit which supplies a current to the led blocks and is connected in series to one of the led blocks; switching elements connected in parallel to the led blocks; and a controller for controlling on/off of the switching elements to adjust which led block to supply the current, over a time for implementing a unit frame.
Inventor(s): Junil PARK of Suwon-si (KR) for samsung electronics co., ltd., Sugyeung KANG of Suwon-si (KR) for samsung electronics co., ltd., Yongil Kwon of Suwon-si (KR) for samsung electronics co., ltd., Kang Joo KIM of Suwon-si (KR) for samsung electronics co., ltd., Alan Kyongho KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunkwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yong-Yun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jung-Pil LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunwook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/34, G09G5/00
Abstract: in a backlight apparatus, a master driving circuit generates a transmission frame including a training period including a clock training pattern and a data period including a plurality of data packets respectively corresponding to the plurality of blocks. a plurality of slave driving circuits correspond to the plurality of blocks, respectively, and are connected to the master driving circuit in a daisy chain structure. each slave driving circuit receives the transmission frame through the daisy chain structure, recovers a clock based on the clock training pattern, and drives the plurality of light emitting elements included in a corresponding block among the plurality of blocks based on its own data packet among a plurality of data packets.
Inventor(s): Yangsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Beakkwon SON of Suwon-si (KR) for samsung electronics co., ltd., Keunwon JANG of Suwon-si (KR) for samsung electronics co., ltd., Gangyoul KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10K11/178
Abstract: an electronic device is provided. the electronic device includes a microphone. the electronic device includes a speaker. the electronic device includes a communication circuit. the electronic device includes at least one processor. the at least one processor is configured to obtain a second signal based on decoding a first signal received through the communication circuit from an external electronic device. the at least one processor is configured to output a third signal through the speaker obtained based on executing decompression the second signal. the at least one processor is configured to compensate the second signal based on a difference between the second signal and the third signal representing a distortion of the third signal, in response to obtaining an input signal including the output third signal through the microphone. the at least one processor is configured to execute cancellation of an echo of the input signal based on the compensated second signal.
Inventor(s): Chanhee CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/01, G10L15/22
Abstract: an electronic device includes: a memory storing instructions; and a processor operatively connected to the memory and configured to execute the instructions to: perform a first analysis operation of confirming a recognition error for a voice based on an input time of the voice; determine whether to perform a second analysis operation of confirming the recognition error in response to a result of the first analysis operation; based on a determination to perform the second analysis operation, perform the second analysis operation based on a text corresponding to the voice; and provide a recognition result of the voice based on a result of the second analysis operation.
Inventor(s): Sichen JIN of Suwon-si (KR) for samsung electronics co., ltd., Kwangyoun KIM of Seoul (KR) for samsung electronics co., ltd., Sungsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Junmo PARK of Suwon-si (KR) for samsung electronics co., ltd., Dhairya SANDHYANA of Suwon-si (KR) for samsung electronics co., ltd., Changwoo HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/183, G06V10/20, G10L15/26, H04N21/488
Abstract: an electronic apparatus and a control method thereof are provided. the electronic apparatus includes a communication interface configured to receive content comprising image data and speech data; a memory configured to store a language contextual model trained with relevance between words; a display; and a processor configured to: extract an object and a character included in the image data, identify an object name of the object and the character, generate a bias keyword list comprising an image-related word that is associated with the image data, based on the identified object name and the identified character, convert the speech data to a text based on the bias keyword list and the language contextual model, and control the display to display the text that is converted from the speech data, as a caption.
Inventor(s): Prashant INBAVALUTHI of Noida (IN) for samsung electronics co., ltd., Vikas KAPUR of Noida (IN) for samsung electronics co., ltd., Ramakant SINGH of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L15/26
Abstract: the system includes a voice assistant receiving a voice command as input from user. the speech to text convertor converts the voice command into a text. a feature extractor extracts acoustic features from raw waveform of voice command and textual features from converted text for determining nearby context tokens. a multi modal unified attention sequence tagger determines a connection between the audio and the text based on an individual contextual embedding and a fused contextual embedding at context tokens level. it further tags replacement, cue and correction words sequentially based on determined connection between the audio and the text. an on-the-fly decoder decodes revised text on-the-fly based on tagged replacement, cue and correction words, to display the decoded revised text on user interface and sends the decoded revised text to nlp to generate a response corresponding to the input speech.
Inventor(s): Sunghan KIM of Suwon-si (KR) for samsung electronics co., ltd., Sol Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngbin Kim of Suwon-si (KR) for samsung electronics co., ltd., Jisu Son of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L25/78
Abstract: an electronic device includes a communication circuitry, a microphone, a speaker, a memory, and a processor. the processor may identify a first audio signal received through the microphone. the processor may perform, based on identifying that the first audio signal may include a speech for sequentially executing a plurality of functions, at least one first function from among the plurality of functions. the processor may perform, based on identifying that the first audio signal may include the speech, at least one second function from among the plurality of functions on an external electronic device through the communication circuitry, the at least one second function being different from the at least one first function. the processor may sequentially output, through the speaker, at least one second audio signal representing at least one result of performing the at least one first function and the at least one second function based on a sequence associated with the speech.
Inventor(s): Hyunwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyoungho BANG of Suwon-si (KR) for samsung electronics co., ltd., Hangil MOON of Suwon-si (KR) for samsung electronics co., ltd., Jaeha PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul YANG of Suwon-si (KR) for samsung electronics co., ltd., Seung HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L19/02, G10L19/032
Abstract: an electronic device includes a communication circuit, a speaker, and a processor. the processor is configured to identify a bitrate of a first audio bitstream received via the communication circuit from an external electronic device. the processor is configured to obtain, in response to the bitrate lower than a reference value, an audio signal by executing a bandwidth extension (bwe) for the first audio bitstream based on at least one coding parameter obtained from a second audio bitstream previously received via the communication circuit from the external electronic device before the first audio bitstream. the processor is configured to obtain, in response to the bitrate higher than or equal to the reference value, the audio signal for the first audio bitstream without executing the bwe. the processor is configured to output, based on the audio signal, audio via the speaker.
Inventor(s): Kyungrae KIM of Suwon-si (KR) for samsung electronics co., ltd., Woohyun NAM of Suwon-si (KR) for samsung electronics co., ltd., Jungkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Deokjun EOM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L25/57, G10L15/25, G10L25/30
Abstract: an electronic device for processing a video including an image signal and a mixed audio signal, includes: a memory configured to store at least one program for processing the video; and at least one processor configured to: generate, from the image signal and the mixed audio signal, audio-related information indicating a degree of overlap in a plurality of sound sources included in the mixed audio signal by using a first artificial intelligence (ai) model; and separate at least one of the plurality of sound sources included in the mixed audio signal from the mixed audio signal, by applying the audio-related information to a second ai model.
Inventor(s): Chulmin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L25/78, G10L25/72, H04R1/10
Abstract: a wireless audio device includes a memory including instructions; and a processor operatively connected to the memory and configured to execute the instructions to: detect an audio signal, determine, based on an analysis result of the audio signal, an operation mode of the wireless audio device to be one of a singing mode and a dialogue mode, and control an output signal of the wireless audio device according to the determined operation mode, wherein the dialogue mode is configured to output one or more ambient sounds included in the audio signal, and wherein the singing mode is configured to output one or more media sounds and the one or more ambient sounds included in the audio signal.
Inventor(s): Yeji Shin of Suwon-si (KR) for samsung electronics co., ltd., TAE-HONG KWON of Suwon-si (KR) for samsung electronics co., ltd., YOONJAE LEE of Suwon-si (KR) for samsung electronics co., ltd., Seokin Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C5/14, G11C16/12, G11C16/30
Abstract: disclosed is a charge pump of a flash memory, which includes a first stage pump that is connected between an output terminal and a first pump node, and a second stage pump that is connected between the first pump node and a second pump node. the first stage pump includes a first switch circuit that is connected between a power terminal and the first pump node and provides a power supply voltage to the first pump node in response to a first stage signal, in a normal operation, and a first pump circuit that generates a first pumping voltage by using a voltage of the first pump node in response to a first clock signal and provides the first pumping voltage to the output terminal. the first switch circuit blocks a current flow from the first pump node to the power terminal in a sudden power-off event.
Inventor(s): Jae-Sang Yun of Suwon-si (KR) for samsung electronics co., ltd., Kwang Soo Park of Suwon-si (KR) for samsung electronics co., ltd., Ji Woon Park of Suwon-si (KR) for samsung electronics co., ltd., Bong Gyu Kang of Suwon-si (KR) for samsung electronics co., ltd., Su-Jin Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10, G11C5/06, G11C5/14
Abstract: a storage device having a multi drop structure is provided. the storage device comprises a storage controller configured to output a data signal, a first non-volatile memory configured to receive the data signal, a first wiring electrically connected to the storage controller and configured to transfer the data signal, a first termination module including a first impedance element that electrically connects the first wiring to at least one of a power voltage or a ground voltage, a second wiring electrically connected to the first wiring and configured to transfer the data signal to the first non-volatile memory, and a third wiring electrically connected to the first wiring and configured to transfer the data signal to the first termination module.
Inventor(s): Donggun An of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeok Baek of Suwon-si (KR) for samsung electronics co., ltd., Sungyong Cho of Suwon-si (KR) for samsung electronics co., ltd., Moonchul Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/10
Abstract: a zq calibration circuit included in a semiconductor memory device includes a reference voltage selector configured to output a reference voltage selected from among a first reference voltage and a second reference voltage generated based on a first supply voltage and a second supply voltage, in response to a selection signal, a zq engine configured to generate a pull-up code and a pull-down code based on the selected reference voltage, and a loop selector configured to output the selection signal according to whether each of the pull-up code and the pull-down code is toggled. levels of the first and second reference voltages are different from each other, smaller than a level of the first supply voltage, and greater than a level of the second supply voltage.
Inventor(s): Kyo-Gil Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/406, G11C11/4078, G11C11/4096, G11C29/46
Abstract: a memory device includes a memory cell array having a plurality of word lines and a plurality of common source lines therein, which constitute a row. a refresh manager is provided, which is configured to perform a refresh operation for the memory cell array. the refresh manager is further configured to: (i) initialize a count for the row of the memory cell array, (ii) transmit a refresh command to the memory cell array, (iii) write first data into the row when the refresh operation for the memory cell array is a normal refresh operation, and (iv) write second data into a row associated with a word line adjacent to a word line in which row hammering has occurred, when the refresh operation for the memory cell array is not a normal refresh operation.
Inventor(s): Yeonwook JUNG of Suwon-si (KR) for samsung electronics co., ltd., Myeongwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongchul PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4093, G11C11/4094
Abstract: in a method of testing a nonvolatile memory device including a first semiconductor layer in which and a second semiconductor layer formed prior to the first semiconductor layer, circuit elements including a page buffer circuit and at least one driver spaced apart from the page buffer circuit are provided in the second semiconductor layer, an on-state of nonvolatile memory cells which are not connected to the page buffer circuit is mimicked by providing at least one discharging path between a sensing node and a plurality of discharge transistors of the at least one driver, a sensing and latching operation with the on-state being mimicked is performed in the page buffer circuit and whether the page buffer circuit operates normally is determined based on a result of the sensing and latching operation.
Inventor(s): Changho Kim of Suwon-si (KR) for samsung electronics co., ltd., Donghyeon Na of Suwon-si (KR) for samsung electronics co., ltd., Yoonbum Nam of Suwon-si (KR) for samsung electronics co., ltd., Seungbo Shim of Suwon-si (KR) for samsung electronics co., ltd., Kyungsun Kim of Suwon-si (KR) for samsung electronics co., ltd., Namkyun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/66
Abstract: a plasma control apparatus includes a first transmission line and a second transmission line transferring radio frequency (rf) power to a plasma chamber, a matcher disposed on the first transmission line a first plasma control circuit disposed on the first transmission line and configured to selectively and independently control harmonics of one or more of the at least two frequencies, a sensor configured to sense the harmonics of the plasma chamber, and an auxiliary rf power source disposed on the second transmission line and configured to generate auxiliary rf power to cancel out the harmonics sensed by the sensor, wherein, in a plan view, the first transmission line transfers the rf power adjacent to the center of the plasma chamber, and the second transmission line transfers the rf power and the auxiliary rf power and the auxiliary rf power adjacent to an edge of the plasma chamber.
Inventor(s): Hyunbae Kim of Suwon-si (KR) for samsung electronics co., ltd., Jihwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangki Nam of Suwon-si (KR) for samsung electronics co., ltd., Daeun Son of Suwon-si (KR) for samsung electronics co., ltd., Seungbo Shim of Suwon-si (KR) for samsung electronics co., ltd., Juho Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunhak Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
Abstract: a method of manufacturing a semiconductor device includes placing a wafer in a plasma chamber, the chamber including a first power generator configured to generate plasma ions in the chamber, and a second power generator configured to accelerate the plasma ions toward the wafer, generating a radio frequency (rf) signal having a repeated periodic sinusoidal waveform in an on state and a steady off state by the first power generator, and generating a direct current (dc) bias signal having a repeated periodic non-sinusoidal waveform in an on state and a steady off state by the second power generator. the rf signal and the dc bias signal are offset from each other. the method further includes performing a plasma process on a layer on the wafer, using the rf signal and dc bias signal.
Inventor(s): Hyeontae Kim of Suwon-si (KR) for samsung electronics co., ltd., Changho Kim of Suwon-si (KR) for samsung electronics co., ltd., Yoonbum Nam of Suwon-si (KR) for samsung electronics co., ltd., Seungbo Shim of Suwon-si (KR) for samsung electronics co., ltd., Minyoung Hur of Suwon-si (KR) for samsung electronics co., ltd., Kyungsun Kim of Suwon-si (KR) for samsung electronics co., ltd., Juneeok Leem of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
Abstract: the present disclosure provides plasma etching apparatuses and operating methods of the plasma etching apparatuses. in some embodiments, a plasma etching apparatus includes a processing chamber, a plasma source generator, a bias generator, and an acoustic wave generator. the processing chamber is configured to receive etching gas, and to etch a wafer using plasma that has been formed according to a plasma source pulse and a bias pulse. the a plasma source generator is configured to generate the plasma source pulse. the bias generator is configured to generate the bias pulse. the acoustic wave generator is configured to generate an acoustic wave having a wavefront with a first direction parallel to the wafer and to control a density of a reactive gas of the plasma.
Inventor(s): Inoue NAOKI of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Tsunehiro NISHI of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/033, H01L21/027, H01L21/311
Abstract: a method of manufacturing a semiconductor device includes sequentially disposing a hard mask layer, an organic layer, and a metal-containing photoresist layer on a substrate, patterning the metal-containing photoresist layer to form a first mask pattern exposing a first region of the organic layer, implanting ions into the first region of the organic layer exposed by the first mask pattern, removing the first mask pattern and a second region of the organic layer that is not ion-implanted to form a second mask pattern exposing a partial region of the hard mask layer, and removing the partial region of the hard mask layer exposed by the second mask pattern to form a third mask pattern.
20240128097.CHIP EJECTOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeok KIM of Suwon-si (KR) for samsung electronics co., ltd., Cheolan KWON of Suwon-si (KR) for samsung electronics co., ltd., Jongkeun MOK of Suwon-si (KR) for samsung electronics co., ltd., Sangho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sodam JUNG of Suwon-si (KR) for samsung electronics co., ltd., Kiwook HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67
Abstract: a chip ejector may include an ejector body and a pushing mechanism, the ejector body may include first vacuum holes, an opening and at least one second vacuum hole, the first vacuum holes may fix a film having at least one semiconductor chip using a vacuum, the opening may be formed under the semiconductor chip, the second vacuum hole may be arranged around the opening to provide a portion of the film under an edge portion of a lower surface of the semiconductor chip with the vacuum, the pushing mechanism may be lifted in the ejector body through the opening to lift up the semiconductor chip and the film, thus, a sufficiently strong downward force may be applied to the portion of the film under the edge portion of the lower surface of the semiconductor chip to readily delaminate the semiconductor chip having a thin thickness from the film.
Inventor(s): Young Hun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, B65G47/90, H01L21/683
Abstract: a semiconductor manufacturing equipment includes: a first clamp fixing a dicing tape, on which a plurality of divided dies are disposed, and configured to ascend and descend; and a first expander adjacent to the first clamp and including a body, a first protrusion connected to the body, and a second protrusion connected to the body and spaced apart from the first protrusion, wherein, when no pressure is exerted on the first protrusion and the second protrusion, the first protrusion and the second protrusion protrude from the body, and wherein, when a pressure is exerted on the first protrusion and the second protrusion, the first protrusion and the second protrusion descend into the body depending on a magnitude of the pressure exerted on the first protrusion and the second protrusion.
Inventor(s): SUNGHO JANG of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., HYUNGJIN KIM of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., MINHWAN SEO of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., AKINORI OKUBO of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., SANGMIN LEE of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., SINYONG LEE of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., WONDON JOO of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd., SANGJOON HONG of SUWON-SI, GYEONGGI-DO (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, G01B11/06
Abstract: an apparatus monitoring semiconductor manufacturing equipment includes; an optical detector, a light generator generating light along a first optical path towards a semiconductor substrate, wherein upon irradiating the semiconductor substrate, the light becomes reflected light along a second optical path away from the semiconductor substrate and towards the optical detector, a first grating reticle between the light generator and the semiconductor substrate and including first slits having a first pitch and second slits having a second pitch different from the first pitch, a second grating reticle between the semiconductor substrate and the optical detector and including third slits having a third pitch different from the first pitch and the second pitch, wherein the optical detector determines a positional attribute of the semiconductor substrate in relation to a first pattern and a second pattern, the first pattern corresponds to a first portion of light/reflected light sequentially passing through the first slits and the third slits, and the second pattern corresponds to a second portion of light/reflected light sequentially passing through the second slits and the third slits.
Inventor(s): Sang Lyong Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67
Abstract: a load port module includes: a mounting table configured to receive a container, wherein the container is configured to receive a substrate therein; a door opener is configured to open and close a door of the container; an image generator is on the door opener, and the image generator is configured to generate a first image of the substrate at a first angle with respect to the substrate, and a second image of the substrate at a second angle with respect to the substrate different from the first angle; and a controller is configured to determine warpage of the substrate based on the first image and to determine alignment of the substrate based on the second image.
Inventor(s): Taegeon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/673, B65D43/02, B65D51/24
Abstract: a cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. the card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first bracket and having second and third accommodation guides, the second accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the third accommodation guide extending in the second horizontal direction, and a third bracket spaced apart from the first and second brackets, and having fourth and fifth accommodation guides, the fourth accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the fifth accommodation guide extending in the second horizontal direction to face the third accommodation guide.
20240128107.MODULE TRAY FOR SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taegeon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/673
Abstract: a module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.
Inventor(s): Ji Hun Kim of Suwon-si (KR) for samsung electronics co., ltd., Youn Gon Oh of Suwon-si (KR) for samsung electronics co., ltd., Woo-Ram Moon of Suwon-si (KR) for samsung electronics co., ltd., Sang Hyuk Park of Suwon-si (KR) for samsung electronics co., ltd., Jong Hun Lee of Suwon-si (KR) for samsung electronics co., ltd., Kyu-Sik Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/677, H01L21/67, H01L21/687
Abstract: an apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.
20240128135.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): GYOSOO CHOO of Suwon-si (KR) for samsung electronics co., ltd., DAESEOK BYEON of Suwon-si (KR) for samsung electronics co., ltd., WOOSUNG YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L23/00, H01L23/544, H01L25/065
Abstract: a semiconductor device with a structure in which a plurality of chips are stacked includes: a chip area; a scribe lane at a circumference of the chip area; a dam structure that separates the chip area and the scribe lane; a detection wire that extends from the chip area to the scribe lane by passing through the dam structure; and a detection circuit in the chip area that is electrically connected to the detection wire and is configured to detect a defect in the scribe lane.
Inventor(s): HYEONSEOK LEE of SUWON-SI (KR) for samsung electronics co., ltd., DONGKYU KIM of SUWON-SI (KR) for samsung electronics co., ltd., HYEONJEONG HWANG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L21/306, H01L21/308, H01L21/48, H01L21/56, H01L23/00, H01L23/31, H01L23/373, H01L23/498, H01L25/065, H01L25/10, H10B80/00
Abstract: a semiconductor package includes a redistribution substrate, a sub-package disposed on the redistribution substrate, a semiconductor chip disposed on the redistribution substrate, a heat dissipation structure disposed on the redistribution substrate and surrounding the sub-package and the semiconductor chip, and an encapsulant. the redistribution substrate includes a redistribution structure. the semiconductor chip is positioned side-by-side with the sub-package. the encapsulant encapsulates the sub-package, the semiconductor chip, and the heat dissipation structure.
Inventor(s): Minjun Bae of Suwon-si (KR) for samsung electronics co., ltd., Eungkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongyoun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/373, H01L21/56, H01L23/00, H01L23/31, H01L23/367, H01L23/498, H01L25/065, H10B80/00
Abstract: provided is a semiconductor package comprising a redistribution structure including a redistribution pattern and a redistribution insulation layer covering the redistribution pattern, a semiconductor chip disposed on the redistribution structure and having an active surface and an inactive surface opposite to the active surface, a molding layer disposed on the redistribution structure and covering at least a portion of the semiconductor chip, and a silicon heat dissipation structure disposed on the semiconductor chip, wherein the silicon heat dissipation structure is bonded to the semiconductor chip through silicon (si)-to-si direct bonding.
Inventor(s): Minjae JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jaehee CHO of Suwon-si (KR) for samsung electronics co., ltd., Geonwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Jungho DO of Suwon-si (KR) for samsung electronics co., ltd., Jisu YU of Suwon-si (KR) for samsung electronics co., ltd., Hyeongyu YOU of Suwon-si (KR) for samsung electronics co., ltd., Seungyoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L21/8238, H01L27/092, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
Abstract: an integrated circuit including a standard cell including: a metal layer including a pattern extending in a first horizontal direction and a plurality of tracks spaced apart from one another in a second horizontal direction, wherein the plurality of tracks include a plurality of cell tracks and one power distribution network (pdn) track, wherein cell patterns are formed on the plurality of cell tracks, and a pdn pattern or a routing pattern is formed on the one power distribution network (pdn) track, wherein a first pattern is spaced apart from a cell boundary of the standard cell by a first length and is formed on a first cell track among the plurality of cell tracks, and wherein a second pattern is spaced apart from a cell boundary of the standard cell by a second length and is formed on a second cell track among the plurality of cell tracks.
20240128161.INTEGRATED CIRCUIT DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungmoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangcheol Na of Suwon-si (KR) for samsung electronics co., ltd., Sora You of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Minchan Gwak of Suwon-si (KR) for samsung electronics co., ltd., Youngwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinkyu Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungmin Cha of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L27/092, H01L29/06, H01L29/417, H01L29/423, H01L29/49, H01L29/775, H01L29/786
Abstract: provided is an integrated circuit device including a substrate, a plurality of semiconductor patterns on a first surface of the substrate, a gate electrode extending in a first direction and surrounding the semiconductor patterns, a source/drain region disposed on one side of the gate electrode, a vertical power wiring layer extending in a second direction, a liner structure including a first liner and a second liner, the first liner disposed on a lower portion of a sidewall of the vertical power wiring layer and including a first insulating material, and the second liner disposed on an upper portion of the sidewall of the vertical power wiring layer and including a second insulating material, a first contact disposed on the source/drain region and the vertical power wiring layer, and a back wiring structure disposed on a second surface of the substrate and electrically connected to the vertical power wiring layer.
Inventor(s): Youngrok Park of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung Tang of Suwon-si (KR) for samsung electronics co., ltd., Taehyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangshin Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, G06F30/392, G06F30/394, H01L23/528
Abstract: an integrated circuit may include a bit cell array including a plurality of bit cells and a peripheral region including a peripheral circuit. the peripheral region may include a plurality of devices over a substrate, at least one pattern configured to provide a first voltage to at least one of the plurality of devices, at least one power line extending under the substrate, and at least one first via passing through the substrate in a vertical direction in the peripheral region and electrically connecting the at least one pattern to the at least one power line.
Inventor(s): Junwoo Myung of Suwon-si (KR) for samsung electronics co., ltd., Gun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/60, H01L23/00, H01L23/14, H01L23/485, H01L23/532
Abstract: a method of manufacturing a semiconductor package includes applying a cutter to a boundary between a main portion of a second metal layer and an edge portion of the second metal layer that surrounds the main portion, the second metal layer being on an upper surface of a first metal layer disposed on an upper surface of a carrier substrate, peeling the edge portion of the second metal layer from the first metal layer, forming a cover insulating layer on an upper surface of the main portion of the second metal layer, and disposing a semiconductor chip on an upper surface of the cover insulating layer.
20240128172.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Inwon O of Suwon-si (KR) for samsung electronics co., ltd., Jaesun Kim of Suwon-si (KR) for samsung electronics co., ltd., Yunseok Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498
Abstract: a semiconductor package includes a package substrate including a ball pad with first and second pads, a wiring line extending between the first and second pads, and a solder mask layer including a first opening exposing a portion of the first pad and a second opening exposing a portion of the second pad, and a semiconductor chip on an upper surface of the package substrate, and a connection bump on a lower surface of the ball pad and connected to the first and second pads. the connection bump covers a lower surface and a first side surface of the first pad exposed through the first opening, a lower surface and side surfaces of a region of the solder mask layer covering the wiring line, and a lower surface and a first side surface of the second pad exposed through the second opening.
Inventor(s): Ji-Yong Park of Suwon-si (KR) for samsung electronics co., ltd., Jong Bo Shim of Suwon-si (KR) for samsung electronics co., ltd., Dae Hun Lee of Suwon-si (KR) for samsung electronics co., ltd., Choong Bin Yim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/56, H01L23/00, H01L23/12, H01L23/31, H01L23/367, H01L25/065
Abstract: a semiconductor package includes a first package substrate having a first region and a second region, which do not overlap each other, a first connection element having a first height on the first region, a first semiconductor chip having a second height connected to the first connection element, a second connection element having a third height on the second region, a third connection element having a fourth height on the second connection element and electrically connected to the second connection element, a second package on the third connection element, the second package including a second package substrate and a second semiconductor chip, and a first mold layer covering at least a portion of the first semiconductor chip, covering at least a portion of the second connection element, covering the first package substrate, exposing upper surfaces of the first semiconductor chip and the second connection element, and having a fifth height.
20240128174.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Choongbin Yim of Suwon-si (KR) for samsung electronics co., ltd., Gitae Park of Suwon-si (KR) for samsung electronics co., ltd., Jongbo Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/367
Abstract: a semiconductor package is provided including: a redistribution substrate having an upper surface and a lower surface, opposite to each other, and including redistribution layers; a semiconductor chip disposed on the upper surface of the redistribution substrate and electrically connected to the redistribution layers; an upper encapsulant encapsulating at least a portion of the semiconductor chip and disposed on the upper surface of the redistribution substrate; a passive component disposed on the lower surface of the redistribution substrate and electrically connected to the redistribution layer; a lower encapsulant encapsulating at least a portion of the passive component and disposed on the lower surface of the redistribution substrate, and having a plurality of openings exposing lowermost redistribution layers among the redistribution layers; and a plurality of bumps respectively disposed within the plurality of openings, the bumps respectively including a first portion in contact with the lowermost redistribution layers and a second portion extending from the first portion and protruding partially downwardly of the plurality of openings.
Inventor(s): Hyungsun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/31
Abstract: a semiconductor package includes: a semiconductor chip having chip pads disposed on a first surface thereof; a redistribution wiring layer formed on the first surface, wherein the redistribution wiring layer includes an insulating layer, redistribution wirings, a protective layer, and an under bump metallurgy (ubm) pad of ubm pads, wherein the insulating layer is formed on the first surface, wherein the redistribution wirings are provided on the insulating layer and are electrically connected to the chip pads, wherein the protective layer is provided on the insulating layer and has an opening that exposes at least a portion of a first redistribution wiring of the redistribution wirings, and wherein the under bump metallurgy (ubm) pad is provided on the at least a portion of the first redistribution wiring that is exposed by the opening; and conductive bumps disposed on the ubm pads of the redistribution wiring layer.
20240128176.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SEOK GEUN AHN of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/10
Abstract: a semiconductor package includes; a semiconductor substrate including a device region and an edge region, a first redistribution layer on a lower surface of the semiconductor substrate, a second redistribution layer on an upper surface of the semiconductor substrate, through vias vertically penetrating the semiconductor substrate in the edge region to electrically connect the first redistribution layer and the second redistribution layer, and a circuit layer between the lower surface of the semiconductor substrate and the first redistribution layer. the circuit layer may include; a circuit element on the lower surface of the semiconductor substrate, a circuit wiring pattern electrically connected to the circuit element and the first redistribution layer, and a device interlayer dielectric layer substantially encompassing the circuit element and the circuit wiring pattern, wherein the circuit element and the circuit wiring pattern are disposed in the device region and not in the edge region.
Inventor(s): Seunghwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongkwan Lee of Suwon-si (KR) for samsung electronics co., ltd., Gyuhyeong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungjoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Junwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Taejun Jeon of Suwon-si (KR) for samsung electronics co., ltd., Junhyeung Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/48, H01L21/56, H01L23/00, H01L23/31
Abstract: a semiconductor package includes a lower substrate including a lower interconnection layer; an upper substrate on the lower substrate, a recessed surface having a step difference, and an upper interconnection layer having a through-hole extending from the recessed surface to the first surface of the upper substrate and electrically connected to the lower interconnection layer; semiconductor chip between the recessed surface of the upper substrate and the lower substrate and including connection pads electrically connected to the lower interconnection layer; interconnect structure between the second surface of the upper substrate and the lower substrate and electrically connecting the lower interconnection layer to the upper interconnection layer; and an insulating member including a first portion covering at least a portion of the semiconductor chip and interconnect structure, a second portion extending from the first portion into the through-hole, and a third portion covering at least a portion of the first surface.
20240128195.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangwoong Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L25/00, H01L25/065, H01L25/18, H10B80/00
Abstract: a semiconductor package includes a first redistribution structure, a first semiconductor chip disposed on an upper surface of the first redistribution structure, an encapsulant disposed between the first redistribution structure and the first semiconductor chip, a plurality of first conductive posts electrically connecting the first redistribution structure and the first semiconductor chip with each other, and penetrating through the encapsulant in a first direction, a heat dissipation member having at least a portion that overlaps the first semiconductor chip in a second direction that is perpendicular to the first direction, and a second semiconductor chip disposed between the first redistribution structure and the heat dissipation member, and encapsulated by the encapsulant. the first semiconductor chip overlaps the plurality of first conductive posts in the first direction. the first semiconductor chip does not overlap the second semiconductor chip in the first direction.
Inventor(s): Minsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Seongyo Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangsick Park of Suwon-si (KR) for samsung electronics co., ltd., Soyoun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065
Abstract: according to embodiments of the present disclosure, a semiconductor package is provided. the semiconductor package includes a substrate including a first surface and a second surface opposite to the first surface; and a plurality of lower pads on the second surface at different intervals. the semiconductor package further includes: a plurality of bumps attached to the plurality of lower pads; a first non-conductive film on the second surface of the substrate; and a second non-conductive film on the first non-conductive film. a plurality of regions are defined in the semiconductor package according to a separation distance between the plurality of bumps, such that each region of the plurality of regions includes respective bumps, from among the plurality of bumps, that have a respective separation distance between neighboring ones of the respective bumps within the region. a sum of thicknesses of the first and second non-conductive films is constant.
Inventor(s): Hajung Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/498, H01L25/065, H10B80/00
Abstract: a semiconductor package is provided. the semiconductor package includes a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, a front connection pad disposed on a lower surface of the plurality of second semiconductor chips, a rear connection pad attached on an upper surface of the first semiconductor chip and the second semiconductor chips, a chip connection terminal disposed between the front connection pad and the rear connection pad, and an insulating adhesive layer disposed between the first semiconductor chip and a lowermost second semiconductor chip and between two adjacent second semiconductor chips, the insulating adhesive layer including a first material layer covering a sidewall of the chip connection terminal and having first viscosity and a second material layer disposed to surround the first material layer in a plan view and have second viscosity which is greater than the first viscosity.
20240128229.SOLDER REFLOW APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byungkeun Kang of Suwon-si (KR) for samsung electronics co., ltd., Chaein Moon of Suwon-si (KR) for samsung electronics co., ltd., Youngja Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngmin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00
Abstract: a solder reflow apparatus may include a reflow chamber, a heater and a stage. the reflow chamber may be configured to receive a heat transfer fluid. the heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. the heater may be configured to heat the heat transfer fluid in the reflow chamber. the stage may be in the reflow chamber to support the substrate. the stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.
Inventor(s): Sinyeop LEE of Suwon-si (KR) for samsung electronics co., ltd., Taegyu KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaeseon HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, B23K26/03, B23K26/06, B23K26/0622, B23K26/12, H01L25/065, H01L25/18, H10B80/00
Abstract: a soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result. a soldering method includes calculating power of the light pulse based on a time width of the light pulse, measuring a temperature of the electronic device, and predicting a final rise temperature of the electronic device, based on the calculated power, a weight of the electronic device, the measured temperature, the quantity of exposures of the light pulse, and the irradiation period.
20240128234.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JUNGPIL LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H10B80/00
Abstract: a semiconductor package includes semiconductor structures stacked in a stepwise manner. each of the semiconductor structures may include a lower structure, an upper structure on the lower structure, and an insulating layer provided on a bottom surface of the upper structure to be in contact with at least a portion of side surfaces of the lower structure. an area of the lower structure may be smaller than an area of the upper structure, when viewed in a plan view, and a side surface of the insulating layer may be vertically aligned to a side surface of the upper structure.
Inventor(s): Hyoeun Kim of Suwon-si (KR) for samsung electronics co., ltd., Dohyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Sunkyoung Seo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L21/66, H01L23/00
Abstract: a semiconductor package includes a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. the first semiconductor chip includes a first wiring layer on a first substrate, and a first passivation layer on the first wiring layer and that exposes at least portions of first bonding pads and a first test pad that are on the second wiring layer. the second semiconductor chip includes a second wiring layer on a second substrate and a second passivation layer on the second wiring layer and that exposes at least portions of third bonding pads and second test pad that are provided on the second wiring layer. the first bonding pads and respective ones of the third bonding pads are directly bonded to each other. the first passivation layer and the second passivation layer are directly bonded to each other.
20240128239.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Solji SONG of Suwon-si (KR) for samsung electronics co., ltd., Junyun KWEON of Suwon-si (KR) for samsung electronics co., ltd., Byeongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jumyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongjoon OH of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul JUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyunsu HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/48, H01L23/498
Abstract: a semiconductor package includes a connection structure, a via protection layer on the connection structure, a first semiconductor chip on the via protection layer and including a first substrate having a first active face and a first inactive face opposite to each other a through-silicon via (tsv) configured to electrically connect the first semiconductor chip to the connection structure, and a second semiconductor chip on the first semiconductor chip and electrically connected to the first semiconductor chip. the second semiconductor chip includes a second substrate having a second active face and a second inactive face opposite to each other. the package includes a conductive post configured to electrically connect the second semiconductor chip and the connection structure with each other, and a molding layer filling a space between an upper surface of the connection structure and the second semiconductor chip, and the molding layer encloses the conductive post.
Inventor(s): Dalhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Byounggon KANG of Suwon-si (KR) for samsung electronics co., ltd., Wookyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Changbeom KIM of Suwon-si (KR) for samsung electronics co., ltd., Minjung PARK of Suwon-si (KR) for samsung electronics co., ltd., Taejun YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H03K19/20
Abstract: an integrated circuit includes a plurality of cells in a series of rows, wherein a first cell of the plurality of cells includes a plurality of logic circuits, each logic circuit of the plurality of logic circuits configured to independently generate an output bit signal according to input bit signals, a first input pin group including at least one input pin commonly connected to the plurality of logic circuits, a second input pin group including at least one input pin commonly connected to two or more logic circuits among the plurality of logic circuits, and a third input pin group including at least one input pin respectively connected exclusively to at least one of the plurality of logic circuits.
20240128264.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ji Min Yu of Suwon-si (KR) for samsung electronics co., ltd., Heon Jong Shin of Suwon-si (KR) for samsung electronics co., ltd., Doo Hyun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/088, H01L21/8234, H01L29/06, H01L29/423, H01L29/66, H01L29/775
Abstract: a semiconductor device includes a substrate, first and second active patterns extending in a first horizontal direction on the substrate, first and second gate electrodes extending in a second horizontal direction on the first and second active patterns, respectively, a first trench extending in the second horizontal direction between the first and second gate electrodes and separating the first and second active patterns, at least part of the first trench is in the substrate, an active cut extending along sidewalls and a bottom surface of the first trench and contacting each of the first and second active patterns, a second trench on the active cut in the first trench, and a flowable material layer in at least part of the second trench, the flowable material layer including a flowable insulating material and not being in contact with each of the substrate and the first and second active patterns.
20240128268.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Krishna Kumar BHUWALKA of Suwon-si (KR) for samsung electronics co., ltd., Kyoung Min CHOI of Seoul (KR) for samsung electronics co., ltd., Takeshi OKAGAKI of Hwaseong-si (KR) for samsung electronics co., ltd., Dong Won KIM of Seongnam-si (KR) for samsung electronics co., ltd., Jong Chol KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L29/06, H01L29/10, H01L29/423, H01L29/78, H01L29/786
Abstract: a semiconductor device includes channel layers on a substrate, the channel layers being spaced apart from each other, and having first side surfaces and second side surfaces opposing each other in a first direction, a gate electrode surrounding the channel layers and having a first end portion and a second end portion, opposing each other in the first direction, and a source/drain layer on a first side of the gate electrode and in contact with the channel layers, a portion of the source/drain layer protruding further than the first end portion of the gate electrode in the first direction, wherein a first distance from the first end portion of the gate electrode to the first side surfaces of the channel layers is shorter than a second distance from the second end portion of the gate electrode to the second side surfaces of the channel layers.
20240128287.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanghyuck Moon of Suwon-si (KR) for samsung electronics co., ltd., Jueun Park of Suwon-si (KR) for samsung electronics co., ltd., Hyuncheol Kim of Suwon-si (KR) for samsung electronics co., ltd., Jungbin Yun of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Taesub Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor including a substrate, at least one transfer gate on a top surface of the substrate, a floating diffusion region located in the substrate and disposed apart from the at least one transfer gate in a first direction, the first direction being parallel to the top surface of the substrate, an intrinsic semiconductor region located in the substrate and disposed between the at least one transfer gate and the floating diffusion region in the first direction, and a photoelectric conversion region located in the substrate and disposed apart from the floating diffusion region in a second direction, wherein the second direction is perpendicular to the first direction, and wherein the intrinsic semiconductor region is an undoped region.
20240128290.DEPTH SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seung Hyun LEE of SUWON-SI (KR) for samsung electronics co., ltd., Young Chan KIM of SUWON-SI (KR) for samsung electronics co., ltd., Young Gu JIN of SUWON-SI (KR) for samsung electronics co., ltd., Young Sun OH of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G01S7/481
Abstract: a depth sensor includes a substrate that includes a first face and a second face opposite to each other in a first direction; a photoelectric conversion element disposed in the substrate; and first and second taps connected to the photoelectric conversion element. each of the first and second taps includes: a floating diffusion area disposed in the substrate; a transfer transistor connected to the floating diffusion area; a photo transistor connected to the photoelectric conversion element; a tap transfer transistor connected to the photo transistor; and a storage transistor connected to the tap transfer transistor and the transfer transistor. the storage transistor includes a storage gate electrode. the storage gate electrode includes a first extension and a second extension that extend from the first face of the substrate toward the second face, and the first extension and the second extension are spaced apart from each other in a second direction.
Inventor(s): Yun Ki LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Jong Hoon PARK of Hwaseong-si (KR) for samsung electronics co., ltd., Jun Sung PARK of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H10K59/13
Abstract: in some example embodiments, a back side illumination (bsi) image sensor may include a pixel configured to generate electrical signals in response to light incident on a back side of a substrate. in some example embodiments, the pixel includes, a photodiode, a device isolation film adjacent to the photodiode, a dark current suppression layer above the photodiode, a light shield grid above the photodiode and including an opening area of 1 to 15% of an area of the pixel, a light shielding filter layer above the light shield grid, a planarization layer above the light shielding filter layer, a lens above the planarization layer, and/or an anti-reflective film between the photodiode and the lens.
Inventor(s): Seung Jin KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Sung Soo YIM of Hwasung-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/38, H10B12/00
Abstract: a method of manufacturing a semiconductor device includes sequentially stacking a mold layer and a supporter layer on a substrate, forming a plurality of capacitor holes passing through the mold layer and supporter layer, forming a plurality of lower electrodes filling the capacitor holes, forming a supporter mask pattern having a plurality of mask holes on the supporter layer and the lower electrodes, and forming a plurality of supporter holes by patterning the supporter layer. each of the plurality of lower electrodes has a pillar shape, and each of the mask holes is between four adjacent lower electrodes and has a circular shape.
20240128319.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Wandon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeseoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunbae LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeonghyuk YIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L27/092, H01L29/417, H01L29/423, H01L29/49, H01L29/51, H01L29/775, H01L29/786
Abstract: an integrated circuit device includes a first conductive pattern on a substrate, a second conductive pattern surrounding at least a portion of the first conductive pattern and covering a lower portion of a sidewall of the first conductive pattern, an upper insulating structure on the first conductive pattern and the second conductive pattern, and an upper conductive pattern extending in a vertical direction through the upper insulating structure. the upper conductive pattern includes a main plug portion overlapping the first conductive pattern and the second conductive pattern in the vertical direction, and a vertical extension portion extending from a local region of the main plug portion toward the substrate, the vertical extension portion covering an upper portion of the sidewall of the first conductive pattern and overlapping the second conductive pattern in the vertical direction.
Inventor(s): Jongryeol Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jungtaek Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L21/02, H01L29/06, H01L29/161, H01L29/423, H01L29/66, H01L29/775
Abstract: a semiconductor device includes an active region including a first portion and a second portion; an isolation region on a side surface of the active region; a plurality of active layers stacked and spaced apart from each other in a vertical direction on the first portion of the active region; an epitaxial structure disposed on the second portion of the active region, connected to the plurality of active layers, and overlapping the isolation region in the vertical direction; a gate structure extending by intersecting the active region and surrounding each of the plurality of active layers; and a gate spacer on a side surface of the gate structure. the epitaxial structure includes a blocking layer and a source/drain structure on the blocking layer. the blocking layer includes a plurality of active blocking portions contacting the plurality of active layers, respectively, and at least one first bent portion bent and extending from at least one of the plurality of active blocking portions and contacting the gate spacer.
Inventor(s): Joonyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/40
Abstract: an integrated circuit device includes a substrate having an active area therein, a bit line on the substrate, and a direct contact, which extends between the active area and the bit line and electrically couples the bit line to a portion of the active area. a spacer structure is also provided, which extends on sidewalls of the bit line and on sidewalls of the direct contact. afield passivation layer is provided, which extends between the sidewalls of the direct contact and the spacer structure. the spacer structure and the field passivation layer may include different materials, and the field passivation layer may directly contact the sidewalls of the direct contact. the field passivation layer can include nonstoichiometric silicon oxide sio, where 0.04≤x≤0.4, and may have a thickness of less than about 25 Å.
20240128332.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sang Shin JANG of Suwon-si (KR) for samsung electronics co., ltd., Jong Min BAEK of Suwon-si (KR) for samsung electronics co., ltd., Sun Ki MIN of Suwon-si (KR) for samsung electronics co., ltd., Na rae OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/48, H01L23/522, H01L27/088, H01L29/06, H01L29/423, H01L29/775
Abstract: a semiconductor device comprising: a lower insulating layer; a field insulating layer on the lower insulating layer; an upper insulating layer on the field insulating layer; a first through via in the upper insulating layer; a second through via in the field insulating layer; and a third through via in the lower insulating layer, wherein the second through via is connected to the first and third through vias, and wherein a width of a top surface of the second through via is greater than a width of a bottom surface of the first through via, a width of a bottom surface of the second through via is greater than a width of a top surface of the third through via, and a width of a middle portion of the second through via is greater than the widths of the top surface and the bottom surface of the second through via.
20240128335.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junggun YOU of Suwon-si (KR) for samsung electronics co., ltd., Junki PARK of Suwon-si (KR) for samsung electronics co., ltd., Sunghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Wandon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sughyun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Hyunbae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
Abstract: a semiconductor device includes an active region on a substrate, a plurality of channel layers spaced apart from each other, a gate structure on the substrate, a source/drain region on at least one side of the gate structure, and a contact plug connected to the source/drain region. the contact plug includes a metal-semiconductor compound layer and a barrier layer on the metal-semiconductor compound layer. the contact plug includes a first inclined surface and a second inclined surface positioned where the metal-semiconductor compound layer and the barrier layer directly contact each other. the barrier layer includes first and second ends protruding towards the gate structure. the first and second ends are positioned at a level higher than an upper surface of an uppermost channel layer. an uppermost portion of the metal-semiconductor compound layer is positioned at a level higher than an upper surface of the source/drain region.
20240128347.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Nam Gyu CHO of Seoul (KR) for samsung electronics co., ltd., Rak Hwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeok-Jun SON of Seoul (KR) for samsung electronics co., ltd., Do Sun LEE of Suwon-si (KR) for samsung electronics co., ltd., Won Keun CHUNG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/49, H01L21/28, H01L21/311, H01L29/06, H01L29/423, H01L29/66, H01L29/786
Abstract: a semiconductor device and a method of fabricating a semiconductor device, the device including a fin-type pattern extending in a first direction; a gate electrode extending in a second direction over the fin-type pattern, the second direction being different from the first direction; spacers on sidewalls of the gate electrode; a capping structure on the gate electrode and the spacers, the capping structure including a first capping pattern and a second capping pattern, the second capping pattern being on the first capping pattern; and an interlayer insulating film surrounding sidewalls of each of the spacers and sidewalls of the capping structure, the interlayer insulating film being in contact with the first capping pattern.
20240128354.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jisoo Park of Suwon-si (KR) for samsung electronics co., ltd., Byungju Kang of Suwon-si (KR) for samsung electronics co., ltd., Junghan Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaehyoung Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L23/48
Abstract: in a method of manufacturing a semiconductor device, an alignment key is formed through a portion of a substrate including first and second surfaces opposite to each other, which is adjacent to the second surface of the substrate. a transistor including a gate structure and a source/drain layer is formed on the second surface of the substrate. a portion of the substrate adjacent to the first surface of the substrate is removed to expose the alignment key. a contact plug is formed through a portion of the substrate adjacent to the first surface of the substrate to be electrically connected to the source/drain layer. a power rail is formed on the first surface of the substrate to be electrically connected to the contact plug.
Inventor(s): Yongmin KWON of Suwon-si (KR) for samsung electronics co., ltd., Donggun LEE of Suwon-si (KR) for samsung electronics co., ltd., Punjae CHOI of Suwon-si (KR) for samsung electronics co., ltd., Youngjin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/08, H01L33/06, H01L33/10, H01L33/38
Abstract: a light-emitting device include an emission layer configured to emit white light, and a reflective layer at least partially surrounding side surfaces of the emission layer, where the emission layer includes a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer on the first conductivity-type semiconductor layer, a first active layer between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, the first active layer configured to emit blue light, and a second active layer between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, the second active layer configured to emit yellow light.
Inventor(s): Donggyu MINN of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngchang YOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Daehyun KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyuhwan AN of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H01P1/22, H03H11/28, H03H11/40
Abstract: the present disclosure relates to a 5th generation (5g) or pre-5g communication system for supporting a higher data transmission rate than a 4th generation (4g) communication system such as long-term evolution (lte). the present disclosure provides a device for variable signal attenuation equipped in a stack-up structure inside an rfic. the device for signal attenuation comprises: a first transmission line positioned on a first layer inside the rfic; a second transmission line positioned on a second layer, which is adjacent to the first layer, and electromagnetically coupled to the first transmission line; and a control unit. the first transmission line comprises an impedance control unit on one side. the control unit can variably control the impedance control unit.
Inventor(s): Hyunyoung ROH of Suwon-si (KR) for samsung electronics co., ltd., Hongchul PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q3/12, H01Q1/24
Abstract: an electronic device is provided. the electronic device includes a housing, a support plate comprising a body, a first support substantially protruding from the body in a first direction, and a second support spaced apart from the first support and substantially protruding from the body in the first direction, the support plate disposed in the housing, a flexible printed circuit board comprising a first part, at least a portion of which is disposed between the first support and the second support, and a second part extending from the first part disposed on the body of the support plate such that the first part is vertically disposed with respect to the second part, wherein at least one first conductive member is disposed at the first part, and at least one second conductive member is disposed at the second part.
Inventor(s): Joon YOO of Suwon-si (KR) for samsung electronics co., ltd., Hanseok MUN of Suwon-si (KR) for samsung electronics co., ltd., Jaeryong HAN of Suwon-si (KR) for samsung electronics co., ltd., Jaejin OH of Suwon-si (KR) for samsung electronics co., ltd., Jangwon HUR of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01R4/34, H04M1/02
Abstract: disclosed is an electronic device according to various embodiments. the electronic device includes: a housing including a metal portion and a polymer portion, a substrate disposed in the housing, a connector disposed in the housing and that electrically connecting the metal portion and the substrate, and a screw fastening the metal portion of the housing and the connector and passing through the connector and at least a portion of the metal portion. the connector includes: a base portion seated on the metal portion and through which the screw passes, a movable portion at least partially facing the base portion and through which the screw passes, a bending portion connecting one side of the base portion and the movable portion, and a connecting portion extending from an opposite side of the base portion and connected to the substrate.
Inventor(s): Bonkil KOO of Suwon-si (KR) for samsung electronics co., ltd., Byoungsoo KO of Suwon-si (KR) for samsung electronics co., ltd., Hongseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungchul LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02K1/276, H02K21/16
Abstract: an interior permanent magnet synchronous motor including a stator including a plurality of teeth, and coils wound around the plurality of teeth; and a rotor configured to be rotatable in a hollow region of the stator. the rotor includes a plurality of permanent magnets in the rotor, and a slit which is arranged within a polar arc angle � (t=360�/p, where p represents a number of poles of the rotor) and toward a lead side of the polar arc angle �, and arranged to be inclined in an opposite direction of a rotation direction of the rotor.
Inventor(s): Min Sang PARK of Yongin-si (KR) for samsung electronics co., ltd., Kyungrae KIM of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M1/00, H02M3/158
Abstract: a method of measuring a load current provided to a load of a switching converter includes obtaining a first reference voltage defining a peak of an inductor current passing through an inductor of the switching converter, generating a pulse based on the first reference voltage and an on-time of at least one power switch of the switching converter, generating an output signal by filtering the pulse, and setting a second mode from a first mode when a value of the load current is less than a first threshold value based on the output signal. the generating of the pulse further includes generating the pulse having a width extended in proportion to the on-time in the second mode.
Inventor(s): Hyuk Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M7/539, H01J37/24, H02M1/088, H02M7/48
Abstract: a power generator with partial sinusoidal waveform includes a resonance module circuit and a pulse module circuit. the resonance module circuit includes a plurality of resonance control switches, and generates a first output voltage by selectively turning on and off the plurality of resonance control switches based on a plurality of resonance control signals. the pulse module circuit includes a plurality of pulse control switches, and generates a second output voltage by selectively turning on and off the plurality of pulse control switches based on a plurality of pulse control signals. the power generator generates a bias power based on the plurality of resonance control signals, the plurality of pulse control signals, the first output voltage and the second output voltage. the bias power has a non-sinusoidal voltage waveform during an entire time interval and a sinusoidal voltage waveform during a partial time interval.
Inventor(s): Jehoon KIM of Suwon-si (KR) for samsung electronics co., ltd., DONGHO SHIN of Suwon-si (KR) for samsung electronics co., ltd., JUNG-JUNE PARK of Suwon-si (KR) for samsung electronics co., ltd., HYUNSUK KANG of Suwon-si (KR) for samsung electronics co., ltd., CHIWEON YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/30, H03F3/45
Abstract: a differential signaling circuit is provided. the differential signaling circuit includes: a differential amplifier configured to generate differential signals; a first signal path circuit; a second signal path circuit; a phase control circuit configured to receive the differential signals having a common phase, output dc signals having a common level in a first operating period, and transmit the differential signals to the first signal path circuit and the second signal path circuit, respectively, in a second operating period; and a duty ratio correction circuit connected between the first signal path circuit and the second signal path circuit, and configured to control duty ratios of the differential signals to be equal to each other in the second operating period.
20240128952.LOW POWER FLIP-FLOP_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byounggon Kang of Suwon-si (KR) for samsung electronics co., ltd., Dalhee Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/012, G01R31/3185, H03K3/037, H03K19/20
Abstract: a low power flip-flop includes a master section including a multiplexer, a first and-or-inverter (aoi) gate circuit, a second aoi gate circuit, and a first inverter circuit and configured to receive a data input signal, a scan input signal, a scan enable signal, and an inverted scan enable signal, and output a second internal signal and a third internal signal, a slave section including a third aoi gate circuit, a fourth aoi gate circuit, and a second inverter circuit, and configured to receive the second and third internal signals to output an output signal, and a third inverter circuit configured to generate the inverted scan enable signal. the first to fourth aoi gate circuits are configured to receive a clock signal.
Inventor(s): Bohwan Jun of Suwon-si (KR) for samsung electronics co., ltd., Daeyeol Yang of Suwon-si (KR) for samsung electronics co., ltd., Hongrak Son of Suwon-si (KR) for samsung electronics co., ltd., Geunyeong Yu of Suwon-si (KR) for samsung electronics co., ltd., Youngjun Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M13/11, H03M13/00
Abstract: a decoding device and a decoding method which relate to: receiving a codeword; estimating a number of errors included in the received codeword; and decoding the codeword based on the estimated number of errors using at least one of a first parity check matrix and a second parity check matrix, wherein the first parity check matrix corresponds to a first low-density parity check (ldpc) code, and the second parity check matrix corresponds to a second ldpc code, and wherein the first parity check matrix is based on a first code type, and the second parity check matrix is based on a second code type different from the first code type.
Inventor(s): YongSung KIL of Suwon-si (KR) for samsung electronics co., ltd., Soonyoung Kang of Suwon-si (KR) for samsung electronics co., ltd., Hong Rak Son of Suwon-si (KR) for samsung electronics co., ltd., Kangseok Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M13/11, G06F11/10
Abstract: disclosed is a storage device which includes a nonvolatile memory device, and a memory controller that performs a read operation on the nonvolatile memory device and performs an error correction operation on data read in the read operation. in the error correction operation, the memory controller estimates an error rate of the read data, and determines whether to perform a read retry operation based on the estimated error rate.
Inventor(s): Janghyun NAM of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/00
Abstract: an electronic device includes a wireless communication circuit for a wireless lan, a first frontend module connected to the wireless communication circuit, a second frontend module connected to the wireless communication circuit, a first antenna connected to the first frontend module, a second antenna connected to the second frontend module, a third antenna connected to the second frontend module, and a processor. the processor is configured to provide a first signal in 5 ghz band or 6 ghz band to the first frontend module. the processor is configured to set a first operation mode of the first operation mode for transmitting a signal related to wireless lan, and a second operation mode, and the processor is configured to set to provide a second signal in the 5 ghz band or the 6 ghz band to the second frontend module while the first signal is provided to the first frontend module.
Inventor(s): Junho Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaein Kim of Suwon-si (KR) for samsung electronics co., ltd., Huiwon Je of Suwon-si (KR) for samsung electronics co., ltd., Hyunseung Joo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/0456, H04B17/391, H04L5/00, H04L25/02
Abstract: an operating method of a wireless communication device includes receiving a reference signal from a base station, estimating a first channel between the wireless communication device and the base station based on the reference signal, extracting, based on a first artificial intelligence model trained to reduce a difference between the first channel estimated by the wireless communication device and a second channel estimated by the base station, a feature including grouped attributes from the first channel, quantizing the grouped attributes using a codebook that is based on a second artificial intelligence model and by generating one or more indices of the codebook for each group of the attributes, and transmitting, to the base station, a bitstream including combination information of the indices of the codebook.
Inventor(s): Ju Wang of Brossard (CA) for samsung electronics co., ltd., Xue Liu of Montreal (CA) for samsung electronics co., ltd., Gregory Lewis Dudek of Westmount (CA) for samsung electronics co., ltd.
IPC Code(s): H04B17/318, H04W72/00
Abstract: the present disclosure provides methods, apparatuses, and computer-readable mediums for performing ultra-wideband (uwb) remote control. in some embodiments, the method includes broadcasting an initial control request. the method further includes receiving, from one or more remote devices, at least one reply message comprising identification information and power spectrum information. the method further includes estimating, for each of the one or more remote devices, an angle indicating a pointing direction to that remote device relative to the remote control device. the method further includes determining a selected remote device that is being pointed at by the remote control device. the method further includes sending, to the one or more remote devices, a control signal comprising the identification information of the selected remote device and a control message indicating an action to be performed by the selected remote device.
Inventor(s): Yinan QI of Staines (GB) for samsung electronics co., ltd.
IPC Code(s): H04L5/00
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services.
Inventor(s): Yunguk LEE of Suwon-si (KR) for samsung electronics co., ltd., Inseong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaewon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yongwook PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L7/00, H04B1/04, H04B1/16, H04B17/318
Abstract: an electronic device is provided. the electronic device includes a speaker, a communication module for supporting bluetooth communication, one or more processors and, memory storing one or more programs including computer-executable instructions that, when executed by the one or more processors, cause the electronic device to identify the received signal strength indication (rssi) of a bluetooth communication signal received from an external electronic device via the communication module, during executing a first function using the speaker, identify whether a second function using the speaker is executed together with the first function, control a frequency value of a driving clock of the one or more processor based on the rssi and the first function and the second function being executed together, adjust the driving clock of the one or more processor to the first frequency value when the rssi is included in a first range indicating a weak electric field, and adjust the driving clock to a second frequency value that is lower than the first frequency value when the rssi is included in a second range indicating a strong electric field.
Inventor(s): Bongsung SEO of Suwon-si (KR) for samsung electronics co., ltd., Kwangsoon KIM of Seoul (KR) for samsung electronics co., ltd., Jonghyun KIM of Seoul (KR) for samsung electronics co., ltd., Kwanghoon LEE of Seoul (KR) for samsung electronics co., ltd., Euiwhan JIN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04L7/00, H04B17/29, H04B17/336
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate than 4g communication systems such as lte systems. a method performed by a user equipment (ue) in a wireless communication system may comprise receiving a signal, converting the signal into a digital signal, receiving, from a base station, transmission spectrum information for the ue and information for a time window, estimating a timing skew and a reception signal-to-noise ratio (snr) of the digital signal based on the information for the time window and the transmission spectrum information, and compensating for a distortion of the digital signal based on the estimated timing skew and the reception snr.
Inventor(s): Andrey KIM of Suwon-si (KR) for samsung electronics co., ltd., Yongwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Maksim DERIABIN of Suwon-si (KR) for samsung electronics co., ltd., Jieun EOM of Suwon-si (KR) for samsung electronics co., ltd., Rakyong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/00, H04L9/06
Abstract: an apparatus with a homomorphic encryption operation includes: one or more processors configured to: generate a modified vector by preprocessing vector components of an operand ciphertext of a blind rotation operation based on an order of a polynomial of an output ciphertext of the blind rotation operation and a modulus of the operand ciphertext; and generate a homomorphic encryption operation result by performing the blind rotation operation based on a public key for performing the blind rotation operation and the modified vector.
Inventor(s): Jaechan LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaegeun SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L12/28, H04W76/10
Abstract: a method, for outputting information related to a second home appliance. the method includes: obtaining group information for grouping the first home appliance and the second home appliance by assigning the first home appliance as an assistant device and assigning the second home appliance as an actually used device; activating a group mode for operating the first home appliance as an assistant device of the second home appliance, based on the group information; controlling a communication interface to receive information related to operations of the second home appliance from the second home appliance assigned as the actually used device, through a communication channel established based on communication connection information of the second home appliance, the communication channel to connect to the second home appliance; and outputting the information related to the operations of the second home appliance through a first user interface, while the group mode is activated.
Inventor(s): Joonsik JUN of Suwon-si (KR) for samsung electronics co., ltd., Heungryong Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L12/28, H04W4/02, H04W4/80
Abstract: a method of controlling a home appliance includes receiving a distance measurement request signal from a user equipment; transmitting, based on the received distance measurement request signal, an ultra-wideband (uwb) communication module activation signal to the user equipment and a second home appliance that includes a uwb antenna; receiving, from the second home appliance, a location measurement value of the user equipment measured with respect to the second home appliance, the location measurement value being based on a uwb signal between the user equipment and the second home appliance; determining location information about the user equipment, based on the location measurement value of the user equipment; receiving, from a first home appliance that does not include a uwb antenna, information about the first home appliance; and registering the first home appliance in the server device, based on the received information about the first home appliance and the location information about the user equipment.
Inventor(s): Taejun KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L12/28, G06F3/16, H04B17/318, H04M1/72412, H04W4/02
Abstract: provided is a home appliance control device including: a communication interface; and at least one processor configured to transmit, based on a message output standby request being received from a mobile device, the message output standby request to at least one home appliance via the communication interface, determine whether a user exists within a first distance from at least one of the at least one home appliance, and control, based on determining that the user exists within the first distance from a first home appliance from among the at least one home appliance, the first home appliance to output a message corresponding to the message output standby request.
Inventor(s): Seungbo YOO of Suwon-si (KR) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L41/0668, H04L67/10, H04W28/02
Abstract: a method of a central unit—control plane (cu-cp) included in a base station in a wireless communication system and an apparatus therefor are provided. the method includes identifying information on a radio link of at least one cell associated with the base station, transmitting, to a central unit—user plane (cu-up), information indicating downlink transmission stop or resume of the cu-up included in the base station based on the information on the radio link, and transmitting, to a distributed unit (du), information indicating downlink transmission stop or resume of the du based on the information on the radio link. the method relates to converging a 4th-generation (4g) or a 5th-generation (5g) communication system for supporting higher data rates beyond a 4g system with a technology for internet of things (iot), and may be applied to intelligent services based on the 5g communication technology and the iot-related technology.
Inventor(s): Daniel Lee HELMICK of Broomfield CO (US) for samsung electronics co., ltd., Jisoo KIM of Seongnam-si (KR) for samsung electronics co., ltd., Sang Young YE of Osan-Si (KR) for samsung electronics co., ltd., Eric HIBBARD of Sunnyvale CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L9/40
Abstract: an apparatus may include a device including a first controller, and a second controller, wherein the device may be configured to receive, using the first controller, data, apply, to the data, a first protection scheme, and send, from the device, using the second controller, the data having a second protection scheme. the first protection scheme and the second protection scheme may be the same. the second controller may be configured to apply, to the data, the second protection scheme. the first protection scheme may include a first salt, and the second protection scheme may include a second salt. the first salt may be determined by the device, and the second salt may be determined by a user. the method may further include applying, at the device, to controller state information for the first controller, a third protection scheme to generate controller state information having the third protection scheme.
Inventor(s): Kyounglim BAEK of Suwon-si (KR) for samsung electronics co., ltd., Joohyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/40
Abstract: a remote authorization method and an electronic device for performing the method are provided. the remote authorization method includes the steps of identifying information of a target device connected to a network, transmitting a request for remote login to the target device to an account server, in response to the remote login request, receiving, from the account server, a remote login code for identifying the remote login request and a remote login method determined according to the information of the target device, requesting a terminal authorization code from the target device by using the remote login code, receiving an input of the terminal authorization code, which is output by the target device according to the remote login method, from a user, transmitting the terminal authorization code to the account server, and receiving a login key for remote login of the target device from the account server, and transmitting the login key to the target device.
Inventor(s): Sang Young YE of Osan-si (KR) for samsung electronics co., ltd., Daniel Lee HELMICK of Broomfield (CO) for samsung electronics co., ltd., Chun-Chu Chen-Jhy Archie WU of San Carlos CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L9/40
Abstract: an apparatus may include a device comprising a controller configured to perform, using a first namespace identifier, a first access of a namespace of the device, wherein the device may be configured to perform, using a second namespace identifier, a second access of the namespace of the device, and wherein the second namespace identifier may include first information to determine the first namespace identifier, and second information to identify the controller. the first information may include the first namespace identifier, and the second information may include a controller identifier for the controller. the second namespace identifier may include the first namespace identifier concatenated with the controller identifier. the controller may include at least a portion of a communication endpoint. the device may further include a second controller configured to perform the second access. the first controller may include a child controller, and the second controller may include a parent controller.
Inventor(s): Jongmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Yunsik KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungchul BAEK of Suwon-si (KR) for samsung electronics co., ltd., Suman LEE of Suwon-si (KR) for samsung electronics co., ltd., Chijoon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G06F1/16, H05K1/02, H05K1/18
Abstract: an electronic device is provided. the electronic device includes a first housing structure, a second housing structure, a hinge structure rotatably connecting the first housing structure and the second housing structure and including a first hinge plate and a second hinge plate, a hinge cover covering at least part of the hinge structure when the hinge structure is viewed from the outside, and a flexible printed circuit board crossing the hinge structure and extending from an inside of the first housing structure to an inside of the second housing structure and including a pair of fixing members to permit deformation of the flexible printed circuit board in the internal space of the hinge cover, wherein the hinge structure includes a first member attached to the first hinge plate, and a second member attached to the second hinge plate, and wherein the first member and the second member are disposed to face the flexible printed circuit board so as to prevent direct contact between the hinge structure and the printed circuit board during folding and/or unfolding of the electronic device.
Inventor(s): Jungwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Sunghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Yunsik KIM of Suwon-si (KR) for samsung electronics co., ltd., Jingook KIM of Suwon-si (KR) for samsung electronics co., ltd., Chijoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyosung LA of Suwon-si (KR) for samsung electronics co., ltd., Suman LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungwhee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G06F1/16
Abstract: a portable communication device or electronic device is provided. the communication device includes a housing including a first housing structure, a second housing structure, and a hinge cover positioned between at least a portion of the first housing structure and at least a portion of the second housing structure, a flexible display at least partially received in the housing and including a first portion corresponding to the first housing structure, a second portion corresponding to the second housing structure, and a third portion corresponding to the hinge cover, a hinge structure positioned between the third portion of the flexible display and the hinge cover and connected with the first housing structure and the second housing structure, and at least one sealing member positioned between the third portion of the flexible display and the hinge cover and contacting the hinge cover.
Inventor(s): Jungwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Sunghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Yunsik KIM of Suwon-si (KR) for samsung electronics co., ltd., Jingook KIM of Suwon-si (KR) for samsung electronics co., ltd., Chijoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyosung LA of Suwon-si (KR) for samsung electronics co., ltd., Suman LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungwhee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G06F1/16
Abstract: a portable communication device or electronic device is provided. the communication device includes a housing including a first housing structure, a second housing structure, and a hinge cover positioned between at least a portion of the first housing structure and at least a portion of the second housing structure, a flexible display at least partially received in the housing and including a first portion corresponding to the first housing structure, a second portion corresponding to the second housing structure, and a third portion corresponding to the hinge cover, a hinge structure positioned between the third portion of the flexible display and the hinge cover and connected with the first housing structure and the second housing structure, and at least one sealing member positioned between the third portion of the flexible display and the hinge cover and contacting the hinge cover.
Inventor(s): Yingen Xiong of Mountain View CA (US) for samsung electronics co., ltd., Christopher A. Peri of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): H04N13/261, G06T3/00, G06T5/00, G06T7/593, G06T7/70, G06T15/04, H04N13/271
Abstract: a method includes obtaining a 2d image captured using an imaging sensor. the 2d image is associated with an imaging sensor pose. the method also includes providing the 2d image, the imaging sensor pose, and one or more additional imaging sensor poses to at least one machine learning model that is trained to generate a texture map and a depth map for the imaging sensor pose and each additional imaging sensor pose. the method further includes generating a stereo image pair based on the texture maps and the depth maps. the stereo image pair represents a 2.5d view of the 2d image. the 2.5d view includes a pair of images each including multiple collections of pixels and, for each collection of pixels, a common depth associated with the pixels in the collection of pixels. in addition, the method includes initiating display of the stereo image pair on an xr device.
Inventor(s): SANGWOO LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongoh KIM of Suwon-si (KR) for samsung electronics co., ltd., MINHYUK LEE of Suwon-si (KR) for samsung electronics co., ltd., SONGSU KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N17/00, H04N17/02, H04N23/56
Abstract: disclosed is a test system which includes a light source device. the light source device includes a first light source configured to radiate a first light, a plurality of neutral-density (nd) filters including a first nd filter attached to the first light source and configured to adjust the first light, an aperture unit including a plurality of apertures configured to adjust the first light received from the first nd filter and a diffuser configured to diffuse the first light received from the aperture unit and to radiate the first light for testing an image sensor, wherein an illuminance of the first light is adjusted based on a transmittance of the first nd filter and an aperture ratio of each of the apertures.
Inventor(s): Minsoo Park of Suwon-si (KR) for samsung electronics co., ltd., Chanyul Kim of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Seungsoo Jeong of Suwon-si (KR) for samsung electronics co., ltd., Kiho Choi of Suwon-si (KR) for samsung electronics co., ltd., Narae Choi of Suwon-si (KR) for samsung electronics co., ltd., Woongil Choi of Suwon-si (KR) for samsung electronics co., ltd., Anish Tamse of Suwon-si (KR) for samsung electronics co., ltd., Yin-ji Piao of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/119, H04N19/103, H04N19/176, H04N19/184, H04N19/186, H04N19/60
Abstract: provided is an image decoding method including: determining a first coding block and a second coding block corresponding to the first coding block; when a size of the first coding block is equal to or smaller than a preset size, obtaining first split shape mode information and second split shape mode information from a bitstream; determining a split mode of the first coding block, based on the first split shape mode information, and determining a split mode of the second coding block, based on the second split shape mode information; and decoding a coding block of a first color component which is determined based on the split mode of the first coding block and a coding block of a second color component which is determined based on the split mode of the second coding block.
Inventor(s): Seung-soo JEONG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/139, H04N19/105, H04N19/176, H04N19/577
Abstract: a method of decoding motion information according to an embodiment includes: determining a base motion vector of a current block; determining a primary differential motion vector for the current block based on information obtained from a bitstream from among one or more primary differential motion vector candidates classified according to a disparity distance and a disparity direction; and determining a motion vector of the current block by applying the primary differential motion vector to the base motion vector.
Inventor(s): Elena ALSHINA of Seoul (KR) for samsung electronics co., ltd., Alexander ALSHIN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/159, H04N19/105, H04N19/176, H04N19/573
Abstract: provided is a video decoding method including: obtaining a first motion vector indicating a first reference block of a current block in a first reference picture and a second motion vector indicating a second reference block of the current block in a second reference picture; obtaining a parameter related to pixel group unit motion compensation of the current block, based on at least one of information of the parameter related to the pixel group unit motion compensation and a parameter related to an image including the current picture; generating a prediction block by performing, with respect to the current block, block unit motion compensation based on the first motion vector and the second motion vector and performing the pixel group unit motion compensation based on the parameter related to the pixel group unit motion compensation; and reconstructing the current block. here, a pixel group may include at least one pixel.
Inventor(s): Quockhanh DINH of Suwon-si (KR) for samsung electronics co., ltd., Kyungah KIM of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Kwangpyo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/85, H04N19/176
Abstract: an artificial intelligence (ai)-based image decoding method and an apparatus performing the ai-based image decoding method are provided. according to the ai-based image decoding method, a transform block for a residual block of a current block is obtained from a bitstream, a transform kernel for the transform block is generated by applying, to a neural network, a prediction block for the current block, neighboring pixels of the current block, and coding context information, the residual block is obtained by applying the generated transform kernel to the transform block, and the current block is reconstructed by using the residual block and the prediction block.
Inventor(s): Jiyeon HONG of Suwon-si (KR) for samsung electronics co., ltd., Hyeonmok Ko of Suwon-si (KR) for samsung electronics co., ltd., Sungja Choi of Suwon-si (KR) for samsung electronics co., ltd., Changho Paeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/258, H04N21/236, H04N21/24, H04N21/262
Abstract: a method, performed by a hub device, of storing a voice assistant model for controlling a device includes receiving information about a first device connected to the hub device, requesting a voice assistant server to update a device determination model stored in the hub device; receiving the updated device determination model from the voice assistant server and storing the received updated device determination model; requesting, from the voice assistant server, information about a function determination model corresponding to the first device; receiving the information about the function determination model corresponding to the first device from the voice assistant server, and determining whether to store the function determination model in the hub device based on the received information; and based on the function determination model being determined to be stored in the hub device, storing, in the hub device, the function determination model corresponding to the first device.
Inventor(s): Daeyeon YUN of Suwon-si (KR) for samsung electronics co., ltd., Kunsok KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyeyun NA of Suwon-si (KR) for samsung electronics co., ltd., Byungseok SOH of Suwon-si (KR) for samsung electronics co., ltd., Eungsik YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/422
Abstract: an electronic device for controlling devices includes: a communication module configured to communicate with the devices; a memory configured to store computer-executable instructions; and at least one processor. the at least one processor when executing the instructions by accessing the memory is configured to: determine a target device of which an envelope is to be registered among the devices, determine a first control area for the target device based on (i) first coordinates of a location of the electronic device in a preset coordinate system, (ii) a first direction from the first coordinates to the target device, and (iii) a field of view (fov) for the target device, determine a second control area for the target device, and register an overlap area as the envelope for the target device, the overlap area being where the first control area and the second control area overlap.
Inventor(s): Jaeho HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N21/485, H04N21/426, H04N21/431, H04N21/437, H04N21/466
Abstract: an electronic apparatus comprises a memory configured to store identification information of a content providing apparatus; a display; and at least one processor configured to: control the display to display a first content received from the content providing apparatus, based on a determination that a predetermined event has occurred, transmit the identification information of the content providing apparatus to the server, receive, from the server, user interface (ui) location information corresponding to the identification information, based on reception of a user instruction for changing the displayed first content to a second content, control the display to display the second content, and acquire content information corresponding to the second content based on the received ui location information, wherein the ui location information is acquired from a combined image that includes a plurality of images overlapped and merged into the combined image.
Inventor(s): Jeongkil SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Dongok CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Min HEU of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/55, G02B9/60, G02B9/62, H04N23/57, H04N23/67, H04N23/68
Abstract: in certain embodiments, an electronic device comprises: a housing; and a camera at least partially disposed in the housing, wherein the camera includes: a casing; a first one or more lenses at least partially disposed inside a first part of the casing that is at least partially exposed to outside of the housing, the first one or more lenses having positive refractive power, wherein the first one or more lenses forms a first optical axis; a second one or more lenses disposed inside a second part of the casing that is disposed inside the housing forming a second optical axis substantially perpendicular to the first optical axis; a reflective member disposed inside the second part of the casing and substantially aligned with the first optical axis and the second optical axis, the reflective member being configured to rotate about one or more rotational axes perpendicular or parallel to the first optical axis in response to disturbance; and an image sensor disposed on the second optical axis, the image sensor being configured to receive an optical signal passing through the second one or more lenses and generate an electrical signal based on the optical signal.
Inventor(s): Kwangseok BYON of Suwon-si (KR) for samsung electronics co., ltd., Kihuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Min HEU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/55, G03B5/08, H04N23/57
Abstract: according to various embodiments, a camera module and/or an electronic device comprising same may comprise: a first guide unit comprising a first magnet having the shape of an arc around a first axis of rotation; a first rotating unit comprising a rotation base disposed on the first guide unit and configured to rotate around the first axis of rotation; a support bearing disposed between the first guide unit and the first rotating unit and configured to rotatably support the first rotating unit with regard to the first guide unit; a first coil disposed on the first rotating unit and configured to generate an electromagnetic force together with the first magnet in response to an electric signal applied thereto, thereby providing a driving force for rotating the first rotating unit; a fixed magnet disposed on one of the first guide unit and the first rotating unit; and a first yoke disposed on an other of the first guide unit and the first rotating unit. the first rotating unit may be configured to rotate while remaining forced against the support bearing by a magnetic force generated between the fixed magnet and the first yoke. the first coil may be configured to move along an arc trajectory on the first magnet as the first rotating unit rotates.
Inventor(s): Sunggeun YIM of Suwon-si (KR) for samsung electronics co., ltd., Ahron YANG of Suwon-si (KR) for samsung electronics co., ltd., Minkeun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/80, H04N23/45, H04N23/60, H04N23/63, H04N23/65, H04N23/69
Abstract: an electronic device includes: a plurality of image sensors including a first image sensor and a second image sensor; a processor; a display connected to the processor; and memory storing instructions being executable by the processor, which cause the electronic device to at least: execute a camera application; activate all of the plurality of image sensors, based on at least one of a specified event executed through the camera application, determine a first image sensor among the plurality of image sensors as an image sensor outputting image data to be displayed on the display, set a resolution of first image data acquired through the first image sensor as a first resolution, and in response to the determination, set a resolution of second image data acquired through a second image sensor among the plurality of image sensors as a second resolution lower than the first resolution.
20240129649.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myeongeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Eun Sub Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/77
Abstract: an example embodiment provides an image sensor including: a pixel array including a first floating diffusion and a second floating diffusion, the first floating diffusion and the second floating diffusion configured to store charges generated by a first phase detecting pixel and a second phase detecting pixel adjacent to each other in a first direction and covered with one micro lens, and the pixel array is configured to output a first signal based on a charge that is generated by the first phase detecting pixel to be accumulated in the first floating diffusion and the second floating diffusion; and a row driver configured to apply a boosting control signal to the second floating diffusion to transfer charges stored in the second floating diffusion to the first floating diffusion, after the pixel array outputs the first signal.
Inventor(s): Faisal KHAN of Dhaka (BD) for samsung electronics co., ltd., Md. Mahmud Muntakim KHAN of Dhaka (BD) for samsung electronics co., ltd.
IPC Code(s): H04W4/70, G06F3/0488, H01Q5/25
Abstract: an electronic device for executing a service and an application suitable for a nearby internet-of-things (iot) device paired with the electronic device by using a short-range communication method, based on the performance and state of the iot device, and a method of operating the electronic device are provided. the first electronic device includes receiving, from a second electronic device, information about the second electronic device including identification information of the second electronic device, information about a communication protocol available in the second electronic device, and information about a wireless communication method available in the second electronic device, and based on the information about the second electronic device, determining at least one application executable by the second electronic device.
Inventor(s): Haewook OH of Gyeonggi-do (KR) for samsung electronics co., ltd., Doosuk KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Yongju KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngmin YOO of Gyeonggi-do (KR) for samsung electronics co., ltd., Seongjun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Buseop JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd., Kunyoung CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/00, G06F3/01, G06F3/041, G06F3/0482, H04L69/18, H04W4/80
Abstract: an electronic device is provided, which receives a user input from a peripheral device, transmits a request associated with a share function for the peripheral device to at least one external electronic device near the electronic device, receives a response to the request from the at least one external electronic device, determines whether the at least one external electronic device is registered to a same user account, determines whether the share function for the peripheral device is allowed at the at least one external electronic device, and if the at least one external electronic device is registered to the same user account and the share function is allowed at the at least one external electronic device, and based on a determination that the user input corresponds to a location of a cursor being out of the display screen, transmits input information associated with the user input from the peripheral device to the at least one external electronic device, such that the cursor is displayed at the at least one external electronic device.
Inventor(s): Jonghoe KOO of Suwon-si (KR) for samsung electronics co., ltd., Kangjin YOON of Suwon-si (KR) for samsung electronics co., ltd., Duckey LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyewon LEE of Suwon-si (KR) for samsung electronics co., ltd., Taehyung LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/06, H04L67/55, H04W4/50, H04W12/71
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. the disclosure provides a method and an apparatus for efficient event management using a secure element and a bundle installed therein.
Inventor(s): Aneesh DESHMUKH of Bangalore (IN) for samsung electronics co., ltd., Neha SHARMA of Bangalore (IN) for samsung electronics co., ltd., Anshuman NIGAM of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W12/088
Abstract: the disclosure relates to a fifth generation (5g) communication system or a sixth generation (6g) communication system for supporting higher data rates beyond a fourth generation (4g) communication system such as long term evolution (lte). a method performed by a core network entity for selecting a selective security mode for applying selective security is provided. the method receives first information block from ran . the first information block includes ue capability to support selective security and preferred selective security mode. further, core network entity may determine if ran and core network entity are capable of supporting the preferred selective security mode. finally, the core network entity applies the preferred selective security on the one or more incoming data packets based on the encryption status of the incoming data packets, when at least one of ran and core network entity supports the preferred selective security mode.
Inventor(s): Rajavelsamy RAJADURAI of Bangalore (IN) for samsung electronics co., ltd., Kundan TIWARI of Bangalore (IN) for samsung electronics co., ltd., Varini GUPTA of Bangalore (IN) for samsung electronics co., ltd., Anikethan Ramakrishna Vijaya KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W12/106, H04W12/033, H04W12/069
Abstract: disclosed herein are a communication technique for merging, with an iot technology, a 5g communication system for supporting a data transmission rate higher than that of a 4g system; and a system therefor.
Inventor(s): Rajavelsamy RAJADURAI of Bangalore (IN) for samsung electronics co., ltd., Kundan TIWARI of Bangalore (IN) for samsung electronics co., ltd., Varini GUPTA of Bangalore (IN) for samsung electronics co., ltd., Anikethan Ramakrishna Vijaya KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W12/106, H04W12/033, H04W12/069
Abstract: embodiments herein disclose a method of protecting sensitive user plane traffic in an user equipment (ue) (), the method comprising: transmitting, to a network (), by the ue () a first nas message comprising an indicator indicating that the ue () supports of a secure channel for domain name system (dns); receiving, from the network (), by the ue () a second nas message including dns server security information in response to transmitting the first nas message; and transmitting, to the network (), by the ue () the dns over the secure channel based on the dns server security information.
Inventor(s): Yuntae PARK of Suwon-si (KR) for samsung electronics co., ltd., Junhwa OH of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk WI of Suwon-si (KR) for samsung electronics co., ltd., Jungi JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W16/28, H01Q3/46
Abstract: the disclosure relates to a 5g or 6g communication system to support a higher data transmission rate. the disclosure relates to a reconfigurable intelligent surface (ris) enabling a low phase error at various incidence angles/reflection angles and an apparatus including the same. the ris comprises a unit cell pattern formed in a direction corresponding to a polarization direction, the unit cell configured to adjust a reflection phase; a switch operably connected to the unit cell pattern, the switch configured to adjust the reflection phase; and a dummy pattern positioned between unit cell patterns in case that a plurality of unit cells is arranged.
Inventor(s): Eric YIP of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunkoo YANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04L41/16
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. methods and apparatuses in provided in which a session description protocol (sdp) offer including a list of artificial intelligence (ai) models is received from a media resource function (mrf) entity. at least one ai model is identified from the list for outputting at least one result using first media data, based on a type of the first media data and a media service in which the at least one result is used. an sdp response is transmitted to the mrf entity, requesting the at least one ai model as a response to the sdp offer, and the first media data is processed based on the at least one ai model received from the mrf entity.
Inventor(s): Hamid SABER of San Jose CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04W72/0446, H04W72/0453, H04W72/23, H04W72/51
Abstract: a method and a user equipment (ue) are provided for monitoring physical downlink control channel (pdcch) candidates. a first reference control resource set (coreset) is identified having a first coreset pool index value associated with a first transmission and reception point (trp). a second reference coreset is identified that is associated with a second trp. the pdcch candidates are monitored in the first reference coreset, the second reference coreset, and one or more coresets that overlap one of the first reference coreset or the second reference coreset in a time domain and are associated with a same trp as the one of the first reference coreset or the second reference coreset. the pdcch candidates are received.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/06, H04L69/04, H04L69/22, H04W12/037
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. an embodiment of the present invention relates to a method and a device for processing a ciphered udc header in a next-generation mobile communication system.
Inventor(s): Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/06, H04W48/16, H04W80/02
Abstract: the disclosure relates to a method and apparatus for controlling packet duplication transmission in a wireless communication system. according to an embodiment of the disclosure, a method, performed by a user equipment (ue), of controlling packet duplication transmission in a wireless communication system includes: receiving a packet duplication configuration for a radio bearer, through a radio resource control (rrc) message, from a base station; determining whether each of a plurality of radio link control (rlc) entities is configured to be used for uplink packet duplication transmission; and performing, when packet duplication transmission is activated, packet duplication transmission by using a rlc entity set to be used for uplink packet duplication transmission.
Inventor(s): Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W28/14
Abstract: a first node in a communication system is provided. the first node includes a transceiver, and a controller configured to receive, from a second node via an adaptation layer associated with an integrated access and backhaul (iab), indication information related to a radio link, wherein the indication information related to the radio link is a radio link failure (rlf) indication or an rlf recovery indication, wherein, in case that the indication information related to the radio link is the rlf indication, the controller is configured to initiate a connection re-establishment procedure, and wherein, in case that the indication information related to the radio link is the rlf recovery indication, the controller is configured to consider the radio link to be available again.
Inventor(s): Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd., Qi LI of Beijing (CN) for samsung electronics co., ltd., Xiaowan KE of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W36/32, H04W8/08, H04W24/10, H04W48/18, H04W68/00, H04W68/04
Abstract: a communication method and system for controlling and paging a user equipment (ue) are provided. the method includes receiving mobility level information of a ue, and performing at least one of handover control, measurement control, or paging for the ue according to mobility level information of the ue.
Inventor(s): Donggu KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Woojae JEONG of Gyeonggi-do (KR) for samsung electronics co., ltd., Seunghyun LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungsoo JUNG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04B7/06, H04J13/00
Abstract: methods and apparatuses are provided in which a slot is generated including a symbol and a synchronization signal, which is transmitted through the symbol. the slot is transmitted to a reconfigurable intelligent surface (ris) and a user equipment (ue). the symbol is used to determine an operation to be performed by the ue during a predetermined time period including the slot. the slot is transmitted to the ue through beams formed according to a first ris pattern. a result of measuring each beam based on the beams is received from the ue. a second ris pattern is determined for transmitting data based on the result of measuring each beam. a signal for controlling the first ris pattern based on the second ris pattern is transmitted to the ris. a data signal is transmitted to the ue through the ris. the second ris pattern is applied to the ris.
Inventor(s): Mythri HUNUKUMBURE of Chertsey (GB) for samsung electronics co., ltd., David Gutierrez ESTEVEZ of Chertsey (GB) for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W64/00
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. disclosed is a method of performing localisation of a user equipment, ue, in a non-public network, npn, wherein the npn, utilises an at least partially coextensive public land mobile network, plmn, with which the ue is registered, to perform the localisation.
Inventor(s): Ramkumar Thirumalli Sureshsah of Bangalore (IN) for samsung electronics co., ltd., Mohanraja Balasubramaniam of Bangalore (IN) for samsung electronics co., ltd., Debabrata Das of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W8/18
Abstract: the present disclosure discloses methods and systems for providing communication between a multiple subscriber identity module (sim) user equipment (ue) and multiple networks. the method may comprise notifying at least one second sim to hold decoding of paging data associated with a paging channel monitoring request, the at least one second sim registered with at least one second network of the plurality of networks. the method may comprise receiving an indication associated with the paging channel monitoring request from the at least one second network. the method may comprise transmitting the indication associated with paging channel monitoring request, to a first sim registered with a first network of the plurality of networks, the indication associated with the paging channel monitoring request meant for at least one second sim and allowing the first sim to instruct the at least one second sim to resume decoding of the paging data.
Inventor(s): Wonjun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyungsik MIN of Suwon-si (KR) for samsung electronics co., ltd., Jongho OH of Suwon-si (KR) for samsung electronics co., ltd., Hyoungjin LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/12, H04B7/0452
Abstract: a radio unit (ru) is provided. the ru includes memory storing instructions, one or more transceivers configured to transmit signals or receive signals on a fronthaul interface, and one or more processors. wherein the instructions cause, when executed by the one or more processors, the ru to receive, from a distributed unit (du), a control plane (c-plane) message including section information for user equipment (ue) scheduling information and section extension information for a group configuration of multiple ports, wherein the section information including information on a resource region of a section description and a ue identifier, and the section extension information including information on a beam group type, information on the number of one or more ports indicated by the section extension information, and a ue identifier per port, and, in case that a ue identifier of a specified port is set to 0x7fff in the c-plane message, identify that the resource region is not allocated for the specified port.
Inventor(s): Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04W72/0446, H04W72/0453, H04W72/23, H04W72/50, H04W74/0833
Abstract: methods and apparatuses for coverage enhancement of msg3. a method for operating a user equipment includes receiving a system information block (sib) that provides information mapping physical random access channel (prach) resources to enable or disable repetitions for a physical uplink shared channel (pusch) transmission in a random access procedure and a first time domain resource allocation (tdra) table. an entry of the first tdra table indicates a number of repetitions of a pusch transmission. the method further includes determining a prach resource for transmission of a prach, determining, based on the prach resource, a tdra table from between the first tdra table or a predetermined second tdra table. no entry of the second tdra table indicates a number of repetitions for a pusch transmission. the method further includes receiving a first grant scheduling transmission of a first pusch and transmitting the first pusch.
Inventor(s): Sangkyu BAEK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jaehyuk JANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L1/1812, H04W72/56
Abstract: the present disclosure relates to a communication technique for merging iot technology with a 5g communication system for supporting a data transmission rate higher than that of a 4g system, and a system therefor. the present disclosure may be applied to intelligence services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security and safety related services, etc.) based on a 5g communication technology and an iot-related technology. the present invention provides a method and a device for performing cg automatic transmission and automatic retransmission.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W56/00
Abstract: a communication method and system for converging a fifth generation (5g) communication system for supporting higher data rates beyond a fourth generation (4g) system with a technology for internet of things (iot) are provided. the communication method and system may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method for performing a random access procedure in a wireless communication system is provided.
Inventor(s): Ebrahim MolavianJazi of San Jose CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Emad N. Farag of Flanders NJ (US) for samsung electronics co., ltd., Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd., Joonyoung Cho of Portland OR (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/08, H04W24/08, H04W72/0446, H04W74/00
Abstract: apparatuses and methods for random access procedures with multiple transmission reception points or cells in a wireless communication system. a method for performing random access (ra) procedures by a user equipment includes receiving a first configuration for ra. the method further includes initiating a first ra procedure with a first transmission-reception point (trp) based on the first configuration and initiating a second ra procedure with a second trp prior to completion of the first ra procedure. a method for operating a base station includes transmitting a first configuration for ra corresponding to a first trp and transmitting a second configuration for ra corresponding to a second trp. the first trp and the second trp are associated with a same cell.
Inventor(s): Jusik YUN of Suwon-si (KR) for samsung electronics co., ltd., Taeyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungbin MIN of Suwon-si (KR) for samsung electronics co., ltd., Hyunkee MIN of Suwon-si (KR) for samsung electronics co., ltd., Junyeop JUNG of Suwon-si (KR) for samsung electronics co., ltd., Junsu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyeonu CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04W24/08, H04W76/20
Abstract: disclosed herein are electronic devices and methods for operating the electronic devices according to various embodiments. such electronic devices may include: a communication circuit configured to perform short-range wireless communication through one link or multiple links generated between an external electronic device and the electronic devices and a processor operatively connected to the communication circuit. the processor may identify the state of multiple links, based on information transmitted by the external electronic device, select one mode from a first mode in which data is divided and transmitted through the multiple links and a second mode in which identical data is transmitted through the multiple links, based on the state of the multiple links, and control the communication circuit so as to transmit the data to the external electronic device through the selected mode. various other embodiments are possible.
[[20240129991.METHOD AND APPARATUS FOR HANDLING A PROTOCOL SUPPORTING SUSPENSION AND RESUMPTION OF SECONDARY CELL GROUP (SCG) IN DUAL CONNECTIVITY TECHNOLOGY SUPPORTED BY NEXT-GENERATION MOBILE COMMUNICATION SYSTEM_simplified_abstract_(samsung electronics co., ltd.)]]
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04L1/1867, H04W24/08, H04W28/06, H04W72/0453, H04W74/00, H04W74/0833, H04W76/15, H04W76/19, H04W80/02
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. a method performed by a terminal in a wireless communication system is provided. the method comprises receiving, from a first base station associated with a master cell group (mcg), a first radio resource control (rrc) message including a second rrc message generated by a second base station associated with a secondary cell group (scg), identifying first information indicating a deactivation of the scg included in the second rrc message, and determining to deactivate the scg based on the first information indicating the deactivation of the scg.
Inventor(s): Sungyeon RYU of Chuncheon-si (KR) for samsung electronics co., ltd., Eunjung KIM of Daegu (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: disclosed are a semiconductor device and a method of fabricating the same. in the semiconductor device, a supporting pattern may be used to fix upper portions of active patterns, when a gap-filling process is performed to fill a region between active patterns, and thus, it may be possible to prevent or reduce the likelihood of the active patterns from being bent or fallen. thus, it may be possible to reduce failure of the semiconductor device and/or to improve reliability of the semiconductor device.
20240130108.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Euichul JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sang-Woon LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangho LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor memory device includes a substrate, a bit line on the substrate, word lines provided on the bit line and spaced apart in a first direction parallel to a top surface of the substrate, a back gate electrode provide between a pair of adjacent word lines among the word lines, active patterns provided between the back gate electrode and the pair of adjacent word lines, contact patterns respectively provided on the active patterns, a first back gate insulating pattern provided between the bit line and the back gate electrode, and a second back gate insulating pattern and a third back gate insulating pattern which are provided on the back gate electrode, where the back gate upper insulating pattern includes a material having a first dielectric constant and the back gate lower insulating pattern includes a material having a second dielectric constant that is greater than the first dielectric constant.
20240130110.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngwoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a substrate, an isolation layer defining an active region in the substrate, a word line extending in a first horizontal direction in a first area of the substrate, a bit line extending in a second horizontal direction perpendicular to the first horizontal direction, on the substrate, and a plurality of first dummy word lines provided in a second area of the substrate adjacent in the second horizontal direction to a first end portion of the first area in the first horizontal direction, the plurality of first dummy word lines extending in the first horizontal direction, wherein a length of each of the plurality of first dummy word lines in the first horizontal direction is less than a length of the word line in the first horizontal direction.
Inventor(s): Yoon Young CHOI of Seoul (KR) for samsung electronics co., ltd., Seung Jin KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Byung-Hyun LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Sang Jae PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, G11C5/10, G11C11/402
Abstract: a semiconductor device may comprise: a plurality of lower electrodes which are on a substrate; a first electrode support which is between adjacent lower electrodes and comprises a metallic material; a dielectric layer which is on the lower electrodes and the first electrode support to extend along profiles of the first electrode support and each of the lower electrodes; and an upper electrode which is on the dielectric layer.
20240130112.INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taejin PARK of Suwon-si (KR) for samsung electronics co., ltd., Bongsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Huijung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: provided is an integrated circuit device including a substrate that has an active region defined by a plurality of device separation regions, a word line on the substrate and arranged in a word line trench that extends in a first horizontal direction, a bit line on the word line and extending in a second horizontal direction orthogonal to the first horizontal direction, a pad on the active region and having a horizontal width that is larger than the active region, and a bit line contact electrically connecting the bit line to the active region, wherein a level of a lowermost surface of the additional pad is at a same vertical level as a level of a lowermost surface of the bit line contact.
Inventor(s): Hoju Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: an integrated circuit (ic) device is provided. the ic device includes: a substrate having active regions; word lines extending in a first horizontal direction across the active regions; conductive expanded pads on the substrate and connected to the active regions; pad isolation structures located between the conductive expanded pads; direct contacts connected to the active regions; bit lines extending in a second horizontal direction perpendicular to the first horizontal direction, on the direct contacts and the pad isolation structures, and connected to the direct contacts; conductive plugs extending in a vertical direction on the conductive expanded pads and connected to the conductive expanded pads; and separation fences passing through the conductive expanded pads and the conductive plugs, and having sidewalls extending linearly in the vertical direction.
20240130116.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junhyeok AHN of Suwon-si (KR) for samsung electronics co., ltd., Sohyun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a substrate having an active region; a bit line structure on the substrate and extending in one direction; a bit line contact electrically connecting a first impurity region of the active region and the bit line structure; and a storage node contact disposed on a sidewall of the bit line structure and electrically connected to a second impurity region of the active region, wherein the storage node contact includes a vertical extension portion extending in a vertical direction, perpendicular to an upper surface of the substrate, and a horizontal extension portion integrally connected to the vertical extension portion and extending in a horizontal direction, parallel to the upper surface of the substrate.
20240130118.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Chansic YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor memory device is provided. the semiconductor memory device includes: a substrate including a plurality of active regions in a memory cell region and at least one logic active region in a peripheral circuit region; a word line extending in a first horizontal direction on the plurality of active regions; a bit line structure extending in a second horizontal direction orthogonal to the first horizontal direction, on the plurality of active regions, and including a bit line, a cover insulating structure on a side surface of an end of the bit line, and an insulating capping structure on the bit line and the cover insulating structure; and a gate line on the at least one logic active region
Inventor(s): Seungmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Daeyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunyi LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/522, H01L23/528, H01L25/065, H10B43/10, H10B43/35, H10B43/40, H10B80/00
Abstract: a three-dimensional semiconductor memory device may include a substrate, a stack including interlayer insulating layers and gate electrodes alternatingly stacked on the substrate, a dummy pad on a pad portion of each gate electrode, a source structure between the substrate and the stack, and first vertical channel structures that penetrate the stack and the source structure. the pad portions may include a first pad portion vertically overlapped with the dummy pad and a second pad portion horizontally overlapped with the dummy pad. the first and second pad portions may be spaced apart from the dummy pad, and one of the interlayer insulating layers may be interposed between the first pad portion and the dummy pad. the one of the interlayer insulating layers may extend continuously from a first portion to a second portion via a connection portion.
Inventor(s): Yejin PARK of Suwon-si (KR) for samsung electronics co., ltd., Seung Yoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Heesuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Sehee JANG of Suwon-si (KR) for samsung electronics co., ltd., Minsoo SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seungjun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sanghun CHUN of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd., Jae-Hwang SIM of Suwon-si (KR) for samsung electronics co., ltd., Jongseon AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/522, H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/35, H10B80/00
Abstract: disclosed are semiconductor devices, electronic systems including the same, and methods of fabricating the same. the semiconductor device comprises a first gate stack structure including a first dielectric pattern and a first conductive pattern that are alternately stacked with each other, a memory channel structure including a first memory portion that penetrates the first gate stack structure, a through contact including a first through portion at a level the same as a level of the first memory portion, and a connection contact including a first connection portion at a level the same as the level of the first memory portion and the level of the first through portion. a minimum width of the first memory portion is less than a minimum width of the first through portion and a minimum width of the first connection portion.
Inventor(s): Yeong Dong MUN of Suwon-si (KR) for samsung electronics co., ltd., Seong Hun PARK of Suwon-si (KR) for samsung electronics co., ltd., Hauk HAN of Suwon-si (KR) for samsung electronics co., ltd., Seong Jin KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/35
Abstract: a non-volatile memory device including a substrate including a first area and a second area, a mold structure on the substrate, the mold structure including gate electrodes and mold insulating films alternately stacked on each other in a stepwise manner, an interlayer insulating film covering the mold structure, a channel structure on the first area, the channel structure extending through the mold structure and connected to the gate electrodes, and a through-contact on the second area and extending through the interlayer insulating film, the through-contact including a first portion in a first trench and a second portion in a second trench, the first portion including a liner film along a sidewall and a bottom surface of the first trench and a filling film on the liner film, wherein the filling film being a multi-grain conductive material, and the second portion being a single grain conductive material, may be provided.
Inventor(s): Beyong Hyun KOH of Suwon-si (KR) for samsung electronics co., ltd., Ho Jin KIM of Suwon-si (KR) for samsung electronics co., ltd., Geun Won LIM of Suwon-si (KR) for samsung electronics co., ltd., Jung Ho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyun Gun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, G11C5/06, G11C16/04, H01L23/528, H01L29/08, H10B43/10, H10B43/35
Abstract: a semiconductor memory device comprises a substrate; a mold structure on the substrate; a plurality of channel structures extending in the mold structure; a source layer and a source sacrificial layer between the substrate and the mold structure, wherein the source sacrificial layer is spaced apart from the source layer; and a source support layer on the source layer and the source sacrificial layer, wherein the source support layer is between the source layer and the source sacrificial layer, wherein an upper surface of the source support layer includes first and second portions extending parallel to the substrate, and a third portion that connects the first and second portions, wherein a vertical distance from an upper surface of the source layer to the first portion is smaller than a vertical distance from an upper surface of the substrate to the second portion.
20240130131.VERTICAL MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeawon JEONG of Suwon-Si (KR) for samsung electronics co., ltd., Dongha SHIN of Suwon-Si (KR) for samsung electronics co., ltd., Bongsoon LIM of Suwon-Si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/35, G11C16/04, H01L23/522, H01L23/528, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/27
Abstract: a memory device may include word line patterns stacked on a substrate and spaced from each other in a vertical direction, a channel structure extending in the vertical direction, and first contact plugs and second contact plugs extending in the vertical direction. the substrate may include a cell area, a cell wiring area, and a through-hole wiring area. the word line patterns may be on the cell area and the cell wiring area and may extend to the cell wiring area in a direction parallel to an upper surface of the substrate. the first contact plugs may be on the cell wiring area and each may be electrically connected with a corresponding one of the word line patterns and insulated from remaining word line patterns other than the corresponding one of the word line patterns. the second contact plugs may be on the through-hole wiring area.
Inventor(s): Sohyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seongpil CHANG of Suwon-si (KR) for samsung electronics co., ltd., Sea Hoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk LEE of Seongnam-si (KR) for samsung electronics co., ltd., Tackhwi LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H01L23/528, H10B41/27, H10B41/40, H10B43/27
Abstract: a vertical nonvolatile memory device may include a peripheral circuit portion including a memory cell driving circuit and connection wiring; a first hydrogen diffusion barrier layer above the peripheral circuit portion; a first insulating layer above the first hydrogen diffusion barrier layer; a common source line layer above the first insulating layer; a second hydrogen diffusion barrier layer above the first insulating layer; and a memory cell stack structure above the common source line layer and the second hydrogen diffusion barrier layer.
Inventor(s): Yukio HAYAKAWA of SUWON-SI (KR) for samsung electronics co., ltd., Yong Seok KIM of SUWON-SI (KR) for samsung electronics co., ltd., Bong Yong LEE of SUWON-SI (KR) for samsung electronics co., ltd., Si Yeon CHO of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H10B51/30, H10B51/20, H10B51/40
Abstract: a semiconductor memory device includes a cell substrate, a plurality of gate electrodes sequentially stacked on the cell substrate and extending in a first direction, first and second channel structures extending in a second direction different from the first direction and penetrating the plurality of gate electrodes, and a bit line disposed on the plurality of gate electrodes. the first and second channel structures each include a ferroelectric layer, a channel layer, a gate insulating layer and a back gate electrode, which are sequentially disposed on side walls of the plurality of gate electrodes. the first channel structure and the second channel structure are adjacent to each other in the first direction and share a bit line.
Inventor(s): Dong Joo CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L23/498, H01L23/538, H01L25/10
Abstract: a semiconductor package includes: a first redistribution layer including a first insulating layer and a first conductive pattern disposed in the first insulating layer; a first connection terminal disposed on a first surface of the first redistribution layer; a stacked memory module disposed on second surface of the first redistribution layer; a second redistribution layer disposed on the stacked memory module, and including a second insulating layer and a second conductive pattern disposed in the second insulating layer; a first bump disposed on a first surface of the second redistribution layer, and in contact with the stacked memory module; a first semiconductor chip disposed on second surface of the second redistribution layer; and a dummy structure disposed between the first redistribution layer and the second redistribution layer and spaced apart from the stacked memory module.
Inventor(s): Inoue NAOKI of Suwon-si (KR) for samsung electronics co., ltd., Tsunehiro NISHI of Suwon-si (KR) for samsung electronics co., ltd., Yonghoon MOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K71/20
Abstract: a method of manufacturing a semiconductor device, including forming a plurality of first organic patterns spaced apart from one another in one direction on a supporting layer, wherein the plurality of first organic patterns include ion-implanted patterns, forming a plurality of inorganic patterns on the supporting layer that are in contact with the plurality of first organic patterns and spaced apart from one other in the one direction, wherein the inorganic patterns include ion-implanted patterns, forming a plurality of second organic patterns arranged between the plurality of inorganic patterns on the supporting layer, wherein the second organic patterns include ion-implanted patterns, and selectively etching the ion-implanted inorganic patterns to form a plurality of space patterns that are arranged between the ion-implanted first organic patterns and the ion-implanted second organic patterns.
Inventor(s): Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Sungmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Youngki Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/12, H10K59/35
Abstract: a light-emitting device including a first electrode, a second electrode opposing the first electrode, and an interlayer located between the first electrode and the second electrode, wherein the interlayer includes an emission layer, wherein the emission layer includes m1 dopants and m2 hosts, and m1 and m2 are each 1 or greater, when m1 is 2 or greater, then two or more of the dopants are different from each other, when m2 is 2 or greater, then two or more of the hosts are different from each other, and the light-emitting device satisfies condition 1:
Inventor(s): Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Sungmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Youngki Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/12, H10K59/35
Abstract:
0 debye�≤dm�()≤3.41 debye� condition 1
Inventor(s): Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Sungmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghun Lee of Suwon-si (KR) for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd., Youngki Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K50/12, H10K59/35
Abstract: wherein condition 1 may be understood by referring to the description provided herein.
Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- Samsung Electronics Co., Ltd.
- A45C11/00
- G06F1/16
- Samsung electronics co., ltd.
- A45D20/50
- A47L5/28
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