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| − | '''Summary of the patent applications from Murata Manufacturing Co., Ltd. on November 9th, 2023'''
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| − | Murata Manufacturing Co., Ltd. has recently filed several patents related to acoustic wave devices, resonance devices, radio-frequency modules, power amplifiers, power supply systems, and radiating electrodes. These patents highlight the company's focus on developing innovative technologies in these areas.
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| − |
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| − | Summary:
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| − | - The patents describe acoustic wave devices with specific combinations of materials and layers, such as silicon carbide, lithium tantalate, and interdigital transducer electrodes.
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| − | - The resonance devices involve manufacturing methods and structures that improve the performance and efficiency of resonators, including power supply terminals, coupling wires, and inner wires.
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| − | - The radio-frequency modules feature multiple power amplifiers, filters, and switches to amplify and output signals in different frequency bands.
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| − | - The power amplifiers employ techniques like supply modulation to dynamically adjust supply voltages for maximum efficiency and adapt to variations in RF traffic.
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| − | - The power supply systems consist of microprocessor units and power conversion circuits with individual voltage feedback control loops to simultaneously supply power to a load while performing driving control.
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| − | - The radiating electrodes are covered by dielectric members, which are positioned at a distance from a ground conductor plate and overlap with the electrode.
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| − |
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| − | Notable Applications:
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| − | * Acoustic wave devices with specific material combinations and layer structures.
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| − | * Resonance devices with improved manufacturing methods and structures for enhanced performance and efficiency.
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| − | * Radio-frequency modules with multiple power amplifiers, filters, and switches for signal amplification in different frequency bands.
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| − | * Power amplifiers employing supply modulation techniques for dynamic adjustment of supply voltages and improved efficiency.
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| − | * Power supply systems with microprocessor units and power conversion circuits for simultaneous power supply and driving control.
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| − | * Radiating electrodes covered by dielectric members for improved performance and positioning.
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| − | Overall, Murata Manufacturing Co., Ltd. has been actively filing patents in various areas, showcasing their commitment to developing innovative technologies in acoustic wave devices, resonance devices, radio-frequency modules, power amplifiers, power supply systems, and radiating electrodes.
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| | ==Patent applications for Murata Manufacturing Co., Ltd. on November 9th, 2023== | | ==Patent applications for Murata Manufacturing Co., Ltd. on November 9th, 2023== |
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| | Shinichiro MATSUMOTO | | Shinichiro MATSUMOTO |
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| − | '''Brief explanation'''
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| − | The patent application describes a pressure device that includes a compression bag, a cover member, an accommodating space, a piezoelectric pump, and a casing.
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| − | * The compression bag is bag-shaped and has a first surface portion where the cover member is installed.
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| − | * The cover member and the compression bag define an accommodating space.
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| − | * The piezoelectric pump is used to flow air into the compression bag.
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| − | * The casing is designed to accommodate the piezoelectric pump.
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| − | * The compression bag has a bag opening at a second surface portion, different from the first surface portion, which connects the internal space of the bag to the outside.
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| − | * The casing has a casing opening.
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| − | * The casing is fixed to the second surface portion of the compression bag, in direct contact with it.
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| − | * The bag opening and the casing opening are directly connected to each other in an overlapping manner.
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| − |
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| − | '''Abstract'''
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| − | A pressure device includes a bag-shaped compression bag, a cover member installed at a first surface portion of the compression bag, an accommodating space defined by the cover member and the compression bag, a piezoelectric pump that flows air into the compression bag, and a casing that accommodates the piezoelectric pump. The compression bag has a bag opening formed at a second surface portion different from the first surface portion and connecting an internal space of the compression bag and an outside to each other. The casing has a casing opening. The casing () is fixed to the second surface portion of the compression bag while being in contact with the second surface portion to directly connect the bag opening and the casing opening to each other in an overlapping manner.
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| | | | |
| | ===ADSORBENT, METHOD FOR MANUFACTURING SAME, ADSORPTION SHEET, SEPARATION FILM, AND ARTIFICIAL DIALYSIS EQUIPMENT ([[US Patent Application 18348527. ADSORBENT, METHOD FOR MANUFACTURING SAME, ADSORPTION SHEET, SEPARATION FILM, AND ARTIFICIAL DIALYSIS EQUIPMENT simplified abstract|18348527]])=== | | ===ADSORBENT, METHOD FOR MANUFACTURING SAME, ADSORPTION SHEET, SEPARATION FILM, AND ARTIFICIAL DIALYSIS EQUIPMENT ([[US Patent Application 18348527. ADSORBENT, METHOD FOR MANUFACTURING SAME, ADSORPTION SHEET, SEPARATION FILM, AND ARTIFICIAL DIALYSIS EQUIPMENT simplified abstract|18348527]])=== |
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| | Yuusuke OGAWA | | Yuusuke OGAWA |
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| − | '''Brief explanation'''
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| − | The patent application describes an adsorbent material composed of layered particles and metal atoms.
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| − | * The layered particles consist of one or more layers, with each layer represented by MX.
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| − | * M represents a metal from Group 3, 4, 5, 6, or 7, while X represents a carbon atom, a nitrogen atom, or a combination of both.
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| − | * The number of layers (n) can range from 1 to 4, and the total number of layers (m) is more than n but not exceeding 5.
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| − | * The surface of the layer body has a modifier or terminal T, which can be a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom.
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| − | * The M in the layer body is bonded to at least one of a chlorine atom, a phosphorus atom, an iodine atom, or a sulfur atom.
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| − |
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| − | This innovation introduces an adsorbent material with specific properties that can be useful in various applications.
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| − |
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| − | '''Abstract'''
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| − | An adsorbent that includes: particles of a layered material including one or plural layers; and one or more metal atoms selected from Al, Mg, Ca, Ba, Fe, Zn, Mn, or Cu. The one or plural layers include a layer body represented by: MXwherein M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n and 5 or less. A modifier or terminal T exists on a surface of the layer body, T is at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom, and the M of the layer body is bonded to at least one of a chlorine atom, a phosphorus atom, an iodine atom, or a sulfur atom.
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| | ===CONTAINER INCLUDING RFID MODULE ([[US Patent Application 18355868. CONTAINER INCLUDING RFID MODULE simplified abstract|18355868]])=== | | ===CONTAINER INCLUDING RFID MODULE ([[US Patent Application 18355868. CONTAINER INCLUDING RFID MODULE simplified abstract|18355868]])=== |
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| | Noboru KATO | | Noboru KATO |
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| − | '''Brief explanation'''
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| − | The patent application describes a container with insulating properties and a metal film on its surface.
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| − | * The container has a first slit in the metal film, separating it into two regions.
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| − | * An RFID module is included in the container, consisting of an RFIC element, a filter circuit, and two electrodes.
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| − | * The first electrode is connected to the first metal region, and the second electrode is connected to the second metal region.
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| − | * The first metal region is continuous with the metal film on the first surface of the container.
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| − | * The second metal region is capacitively coupled to the metal film on the second surface of the container.
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| − |
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| − | '''Abstract'''
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| − | A container is provided includes a base material having insulating properties that form an outer shape, a metal film on the base material, and a first slit in the metal film. The base material includes a first surface, a second surface, and a first flap continuous with the first surface. The first slit separates the metal film on the first flap into first and second metal regions. An RFID module includes an RFIC element, a filter circuit, and first and second electrodes connected to the filter circuit. The first electrode and the first metal region are electrically connected to each other. The second electrode and the second metal region are electrically connected to each other. The first metal region is continuous with the metal film on the first surface and the second metal region is capacitively coupled to the metal film on the second surface.
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| | ===ELECTRONIC COMPONENT ([[US Patent Application 18355821. ELECTRONIC COMPONENT simplified abstract|18355821]])=== | | ===ELECTRONIC COMPONENT ([[US Patent Application 18355821. ELECTRONIC COMPONENT simplified abstract|18355821]])=== |
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| | Yuuta HOSHINO | | Yuuta HOSHINO |
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| − | '''Brief explanation'''
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| − | The patent application describes an electronic component with a ceramic base, an outer electrode, and a Cu segregate.
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| − | * The electronic component includes a ceramic base that contains a Cu element.
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| − | * The outer electrode partially covers the surface of the base.
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| − | * The outer electrode has an underlying electrode layer on the base.
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| − | * The underlying electrode layer consists of a conductor portion and a glass portion.
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| − | * The conductor portion contains a conductor, while the glass portion contains glass.
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| − | * The Cu segregate, which also contains a Cu element, is in contact with the base and the glass portion.
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| − | * The contact between the Cu segregate and the base occurs at the interface between the base and the glass portion.
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| − |
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| − | '''Abstract'''
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| − | An electronic component includes a ceramic base containing a Cu element, an outer electrode partially covering a surface of the base, and a Cu segregate containing a Cu element. The outer electrode has an underlying electrode layer on the base, the underlying electrode layer has a conductor portion containing a conductor and a glass portion containing glass, and the Cu segregate is in contact with the base and the glass portion at an interface between the base and the glass portion.
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| | ===WINDING ARRANGEMENT FOR ELECTRICAL TRANSFORMER ([[US Patent Application 18140270. WINDING ARRANGEMENT FOR ELECTRICAL TRANSFORMER simplified abstract|18140270]])=== | | ===WINDING ARRANGEMENT FOR ELECTRICAL TRANSFORMER ([[US Patent Application 18140270. WINDING ARRANGEMENT FOR ELECTRICAL TRANSFORMER simplified abstract|18140270]])=== |
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| | Kapila WARNAKULASURIYA | | Kapila WARNAKULASURIYA |
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| − | '''Brief explanation'''
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| − | The abstract describes a transformer design with primary and secondary coils that have multiple sections and sets of turns.
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| − |
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| − | * The primary coil has two sections, each with two sets of turns.
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| − | * The second set of turns in each section is positioned within the first set of turns of the other section.
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| − | * The same arrangement is applied to the secondary coil as well.
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| − | * The turns of the primary and secondary coils are interleaved, meaning they are arranged in an alternating pattern.
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| − |
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| − | '''Abstract'''
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| − | A transformer includes primary and secondary coils that each include first and second sections that each include first and second sets of turns. In the parallel-connected first and second sections of the primary coil, the second set of turns of the second section is positioned within the first set of turns of the first section, and the second set of turns of the first section is positioned within the first set of turns of the second section. In the parallel-connected first and second sections of the secondary coil, the second set of turns of the second section is positioned within the first set of turns of the first section, and the second set of turns of the first section is positioned within the first set of turns of the second section, when viewed along a common winding axis. The turns of the primary and secondary coils are interleaved.
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| | | | |
| | ===MULTILAYER CERAMIC CAPACITOR ([[US Patent Application 18220896. MULTILAYER CERAMIC CAPACITOR simplified abstract|18220896]])=== | | ===MULTILAYER CERAMIC CAPACITOR ([[US Patent Application 18220896. MULTILAYER CERAMIC CAPACITOR simplified abstract|18220896]])=== |
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| | Yukihiro FUJITA | | Yukihiro FUJITA |
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| − | '''Brief explanation'''
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| − | The patent application describes a multilayer ceramic capacitor with several components and features. Here is a simplified explanation of the abstract:
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| − | * The multilayer ceramic capacitor consists of a capacitor body, via-conductors, extended electrode portions, outer electrodes, and an insulative resin.
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| − | * The capacitor body contains inner electrodes, and the via-conductors are located inside the capacitor body and connected to the inner electrodes.
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| − | * The extended electrode portions are connected to the via-conductors and are positioned on the outer surface of the capacitor body.
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| − | * The extended electrode portions extend to different locations on the capacitor body than where they are connected to the via-conductors.
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| − | * The outer electrodes are connected to the extended electrode portions.
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| − |
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| − | Bullet points explaining the patent/innovation:
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| − |
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| − | * The multilayer ceramic capacitor design allows for efficient electrical connections between the inner electrodes and the outer electrodes.
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| − | * The use of via-conductors inside the capacitor body helps to optimize the electrical performance of the capacitor.
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| − | * The extended electrode portions being located on the outer surface of the capacitor body provide flexibility in positioning and connecting the capacitor in various electronic devices.
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| − | * The extended electrode portions extending to different locations on the capacitor body allow for improved electrical performance and reduced interference.
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| − | * The use of an insulative resin helps to protect and insulate the various components of the capacitor.
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| − |
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| − | '''Abstract'''
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| − | A multilayer ceramic capacitor includes a capacitor body, first and second via-conductors, first and second extended electrode portions, first and second outer electrodes, and an insulative resin. The capacitor body includes first and second inner electrodes. The first and second via-conductors are inside the capacitor body, and are respectively electrically connected to the first and second inner electrodes. The first and second extended electrode portions are respectively electrically connected to the first and second via-conductors. The first and second extended electrode portions are located on an outer surface of the capacitor body so as to extend to locations different from locations at which the first and second extended electrode portions are connected to the first and second via-conductors. The first and second outer electrodes are respectively electrically connected to the first and second extended electrode portions.
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| | ===MULTILAYER CERAMIC CAPACITOR ([[US Patent Application 18218303. MULTILAYER CERAMIC CAPACITOR simplified abstract|18218303]])=== | | ===MULTILAYER CERAMIC CAPACITOR ([[US Patent Application 18218303. MULTILAYER CERAMIC CAPACITOR simplified abstract|18218303]])=== |
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| | Keita KITAHARA | | Keita KITAHARA |
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| − |
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| − | '''Brief explanation'''
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| − | The patent application describes a multilayer ceramic capacitor with specific electrode layer configurations.
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| − |
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| − | * The capacitor has a multilayer body with alternating dielectric and internal electrode layers.
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| − | * External electrode layers are provided on both end surfaces of the multilayer body.
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| − | * The external electrode layers are connected to the internal electrode layers.
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| − | * The external electrode layers have a base electrode layer divided into three regions.
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| − | * The first region contains a higher amount of metal found in the internal electrode layers.
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| − | * The second region contains a higher amount of glass.
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| − | * The third region contains a higher amount of copper.
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| − |
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| − | '''Abstract'''
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| − | A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers, the external electrode layers each further including a base electrode layer including a first region, a second region, and a third region divided therein, in order from the multilayer body. The first region includes a metal included in the internal electrode layers in a higher amount than the second region and the third region, the second region includes glass in a higher amount than the first region and the third region, and the third region includes copper in a higher amount than the first region and the second region.
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| | ===MULTILAYER CERAMIC CAPACITOR ([[US Patent Application 18222513. MULTILAYER CERAMIC CAPACITOR simplified abstract|18222513]])=== | | ===MULTILAYER CERAMIC CAPACITOR ([[US Patent Application 18222513. MULTILAYER CERAMIC CAPACITOR simplified abstract|18222513]])=== |
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| | Satoshi YOKOMIZO | | Satoshi YOKOMIZO |
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| − |
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| − | '''Brief explanation'''
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| − | - The patent application describes a multilayer ceramic capacitor with a capacitor main body consisting of alternating dielectric layers and internal electrode layers.
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| − | - The capacitor main body has external electrodes connected to the internal electrode layers at its two end surfaces.
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| − | - Two interposers are placed on a surface of the capacitor main body, parallel to the lamination direction, and spaced apart from each other in the length direction.
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| − | - Each interposer has a first recess portion on one end surface, facing the other interposer, in the middle area of the interposer in the width direction.
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| − | - The first recess portion is surrounded by second recess portions on both sides in the width direction.
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| − | - The thickness of each interposer is approximately ±10% of half the thickness of the interposer.
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| − | - The purpose of this innovation is not explicitly mentioned in the abstract.
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| − |
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| − | '''Abstract'''
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| − | A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.
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| | ===ELECTRONIC COMPONENT WITH ALIGNED DIE ([[US Patent Application 18311451. ELECTRONIC COMPONENT WITH ALIGNED DIE simplified abstract|18311451]])=== | | ===ELECTRONIC COMPONENT WITH ALIGNED DIE ([[US Patent Application 18311451. ELECTRONIC COMPONENT WITH ALIGNED DIE simplified abstract|18311451]])=== |
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| | Sami NURMI | | Sami NURMI |
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| − | '''Brief explanation'''
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| − | The abstract describes an electronic component with a first die, a support, and a die-aligning element.
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| − | * The component includes a first die, a support, and a die-aligning element.
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| − | * The die-aligning element has a first die-alignment wall.
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| − | * The first die is horizontally fixed to the first die-alignment wall using a die-attach material.
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| − | * The opposite side of the first die is horizontally unfixed.
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| − |
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| − | '''Abstract'''
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| − | An electronic component is provided that includes a first die, a support with a die-attachment surface and a die-aligning element that is adjacent to the die-attachment surface. The die aligning element includes a first die-alignment wall. Moreover, a first side of the first die is horizontally fixed to the first die-alignment wall with a die-attach material. The side of the first die that is opposite to the first side of the first die is horizontally unfixed.
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| | | | |
| | ===MODULE ([[US Patent Application 18351550. MODULE simplified abstract|18351550]])=== | | ===MODULE ([[US Patent Application 18351550. MODULE simplified abstract|18351550]])=== |
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| | Shota HAYASHI | | Shota HAYASHI |
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| − |
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| − | '''Brief explanation'''
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| − | The patent application describes a module with a substrate and a metal member.
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| − | * The module has a substrate with an upper and lower main surface.
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| − | * The metal member is plate-shaped and is placed on the upper main surface of the substrate.
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| − | * The plate-shaped portion of the metal member has a front, back, and lower end surface.
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| − | * The lower end surface of the plate-shaped portion has a straight portion and one or more protruding portions.
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| − | * The straight portion extends in the left-right direction, while the protruding portions stick out in the forward or backward direction.
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| − | * When viewed from above, the straight portion and protruding portions are visually noticeable.
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| − |
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| − | '''Abstract'''
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| − | A module includes a substrate having an upper main surface and a lower main surface arranged in an up-down direction, and a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface, a back main surface, and a lower end surface arranged in the front-back direction when viewed in the up-down direction. The lower end surface of the plate-shaped portion includes a straight portion extending in the left-right direction and one or more protruding portions protruding in the forward direction or the backward direction with respect to the straight portion, and the straight portion and the one or more protruding portions are visually recognized when viewed in the upward direction.
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| | ===MODULE ([[US Patent Application 18351733. MODULE simplified abstract|18351733]])=== | | ===MODULE ([[US Patent Application 18351733. MODULE simplified abstract|18351733]])=== |
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| | Shota HAYASHI | | Shota HAYASHI |
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| − |
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| − | '''Brief explanation'''
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| − | The abstract describes a metal member in a module that includes a right support portion.
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| − | * The right support portion has a right support foremost portion located at the front and in front of a plate-shaped portion.
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| − | * When the right support portion has the right support foremost portion, it bends forward from the right boundary.
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| − | * When the right support portion has the right support foremost portion, it also bends backward and to the right from the right support foremost portion.
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| − | * The right support portion is equipped with a first lower notch that extends upward from the lower side and overlaps the right support foremost portion when viewed from top to bottom.
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| − |
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| − | '''Abstract'''
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| − | In a module, a metal member includes a right support portion, the right support portion has a right support foremost portion located at a foremost in the right support portion and located in front of the plate-shaped portion, the right support portion bends in a forward direction from a right boundary when the right support portion has the right support foremost portion, the right support portion bends in a backward direction and a right direction from the right support foremost portion when the right support portion has the right support foremost portion, and the right support portion is provided with a first lower notch extending in an upward direction from a lower side and overlapping the right support foremost portion when viewed in the up-down direction.
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| | ===SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE ([[US Patent Application 18352632. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE simplified abstract|18352632]])=== | | ===SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE ([[US Patent Application 18352632. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE simplified abstract|18352632]])=== |
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| | Fuminori MORISAWA | | Fuminori MORISAWA |
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| − |
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| − | '''Brief explanation'''
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| − | The patent application describes a semiconductor device and module that improve heat dissipation in a semiconductor device with a heat generating element.
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| − |
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| − | * The semiconductor device includes a P-type semiconductor substrate with a main surface and an opposing main surface.
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| − | * An N-type N well is provided on the main surface side of the semiconductor substrate.
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| − | * A unit field effect transistor is located within the N well.
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| − | * A P-type heat dissipation guard ring region is positioned on the main surface side of the semiconductor substrate, outside of the N well.
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| − | * Wiring is provided on the heat dissipation guard ring region.
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| − | * Bump placement portions and bumps are also included in the device.
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| − |
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| − | '''Abstract'''
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| − | To provide a semiconductor device and a semiconductor module that are capable of improving a heat dissipation property in the semiconductor device including a heat generating element. A semiconductor device includes: a P-type semiconductor substrate, which has a main surface and a main surface opposed to the main surface; an N-type N well, which is provided on the main surface side of the semiconductor substrate; a unit field effect transistor, which is provided in the N well; a P-type heat dissipation guard ring region, which is provided on the main surface side of the semiconductor substrate on the outside of the N well in plan view of the semiconductor substrate; wiring, which is provided on the heat dissipation guard ring region; bump placement portions; and bumps.
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| | | | |
| | ===DIRECTIONAL COUPLER ([[US Patent Application 18353409. DIRECTIONAL COUPLER simplified abstract|18353409]])=== | | ===DIRECTIONAL COUPLER ([[US Patent Application 18353409. DIRECTIONAL COUPLER simplified abstract|18353409]])=== |
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| | Ikuo TAMARU | | Ikuo TAMARU |
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| − |
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| − | '''Brief explanation'''
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| − | The abstract describes a directional coupler that splits an input signal into four output signals using couplers and phase shifters.
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| − | * The coupler is connected to the input terminal and splits the input signal into two output signals.
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| − | * The coupler also splits a signal from the terminal into two output signals.
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| − | * The phase shifter, located between the terminal and the coupler, adjusts the phase of the signal from the terminal.
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| − | * The phase shifter can either advance or delay the phase of the signal.
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| − | * The phase difference between the output signals of the phase shifters is approximately 180°±10°.
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| − |
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| − | '''Abstract'''
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| − | A directional coupler splits an input signal received by an input terminal into four signals to be output to output terminals. The directional coupler includes couplers and phase shifters. The coupler is connected to the input terminal and splits the input signal into two signals to be output to terminals. The coupler splits a signal from the terminal into two signals to be output to the output terminals. The coupler splits a signal from the terminal into two signals to be output to the output terminals. The phase shifter is connected between the terminal and the coupler and advances the phase of the signal from the terminal. The phase shifter is connected between the terminal and the coupler and delays the phase of the signal from the terminal. The phase difference between output signals of the phase shifters is 180°±10°.
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| | | | |
| | ===ANTENNA MODULE AND ARRAY ANTENNA ([[US Patent Application 18353897. ANTENNA MODULE AND ARRAY ANTENNA simplified abstract|18353897]])=== | | ===ANTENNA MODULE AND ARRAY ANTENNA ([[US Patent Application 18353897. ANTENNA MODULE AND ARRAY ANTENNA simplified abstract|18353897]])=== |
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| | Ryo KOMURA | | Ryo KOMURA |
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| − |
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| − | '''Brief explanation'''
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| − | The patent application describes an array antenna made up of multiple antenna modules.
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| − | * Each antenna module consists of a dielectric substrate, a ground electrode, and a sub-array.
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| − | * The sub-array is composed of radiating elements that face the ground electrode.
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| − | * The radiating elements are arranged in a matrix and have multiple feeding points.
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| − | * The sub-array is located at the end of the dielectric substrate, with its center shifted towards the end.
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| − | * The end of one antenna module faces the end of another antenna module in a specific direction.
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| − |
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| − | '''Abstract'''
| |
| − | An array antenna is formed of a plurality of antenna modules disposed adjacent to each other and including a plurality of antenna modules. Each of the antenna modules includes a dielectric substrate, a ground electrode, and a sub-array. The sub-array is formed of a plurality of radiating elements facing the ground electrode. In the sub-array, the plurality of radiating elements are arranged in a matrix, and each includes multiple feeding points. The sub-array is disposed along an end portion of the dielectric substrate. The sub-array has a center deviated from a center of the dielectric substrate toward the end portion. An end portion of a first antenna module faces an end portion of a second antenna module in a first direction that is defined as a direction from the first antenna module toward the second antenna module.
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| | | | |
| | ===ANTENNA DEVICE, RADAR MODULE, AND COMMUNICATION MODULE ([[US Patent Application 18355829. ANTENNA DEVICE, RADAR MODULE, AND COMMUNICATION MODULE simplified abstract|18355829]])=== | | ===ANTENNA DEVICE, RADAR MODULE, AND COMMUNICATION MODULE ([[US Patent Application 18355829. ANTENNA DEVICE, RADAR MODULE, AND COMMUNICATION MODULE simplified abstract|18355829]])=== |
| Line 320: |
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| | Hiroshi NISHIDA | | Hiroshi NISHIDA |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The patent application describes a radiating electrode that is positioned at a distance from a ground conductor plate in a substrate.
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| − | * The radiating electrode is covered by a dielectric member, which consists of two separate dielectric block portions.
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| − | * These two block portions are placed at a distance from each other in the direction of the radiating electrode.
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| − | * In plan view, the two dielectric block portions are positioned across the center of the radiating electrode.
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| − | * Part of each dielectric block overlaps with the radiating electrode, while the remaining portion is located outside of the electrode.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A radiating electrode is disposed with a space from a ground conductor plate included in a substrate, in a thickness direction of the substrate. A dielectric member is loaded on the radiating electrode. The dielectric member includes two dielectric block portions disposed with a distance in an excitation direction of the radiating electrode. The two dielectric block portions are disposed across a geometric center of the radiating electrode in plan view, and, in plan view, a portion of each of the two dielectric block portions overlaps a portion of the radiating electrode and a remaining portion of each of the two dielectric block portions is disposed outside the radiating electrode.
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| | | | |
| | ===POWER SUPPLY SYSTEM APPARATUS ([[US Patent Application 18353369. POWER SUPPLY SYSTEM APPARATUS simplified abstract|18353369]])=== | | ===POWER SUPPLY SYSTEM APPARATUS ([[US Patent Application 18353369. POWER SUPPLY SYSTEM APPARATUS simplified abstract|18353369]])=== |
| Line 338: |
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| | Tatsuya HOSOTANI | | Tatsuya HOSOTANI |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The patent application describes a power supply system apparatus that includes multiple power conversion circuits and a microprocessor unit (MPU).
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| − | * The MPU sends oscillation control signals to the power conversion circuits.
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| − | * Each power conversion circuit has an analog electronic circuit called a pulse width modulation control circuit.
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| − | * The power conversion circuit uses a feedback signal from the output voltage to drive switching elements.
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| − | * The integrated system controller includes the MPU and multiple power conversion circuits.
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| − | * The system controller has individual voltage feedback control loops for each power conversion circuit.
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| − | * The control loops use feedback signals to individually control the power conversion circuits.
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| − | * The power supply system supplies power to a load while the power conversion circuits perform driving control simultaneously.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A power supply system apparatus includes a plurality of power conversion circuits and an MPU. The MPU outputs oscillation control signals to the plurality of power conversion circuits. Each of the plurality of power conversion circuits includes a pulse width modulation control circuit formed of an analog electronic circuit. For example, the power conversion circuit drives switching elements on the basis of a feedback signal obtained by detecting an output voltage of a common output terminal. An integrated system controller including the MPU and the plurality of power conversion circuits includes a plurality of individual voltage feedback control loops for individually controlling the plurality of power conversion circuits on the basis of feedback signals and supplies power to a load, while the plurality of power conversion circuits performing driving control using the individual voltage feedback control loops at the same time.
| |
| | | | |
| | ===RF POWER AMPLIFIER SYSTEM WITH MULTIPLE SUPPLY MODULATORS ([[US Patent Application 18353337. RF POWER AMPLIFIER SYSTEM WITH MULTIPLE SUPPLY MODULATORS simplified abstract|18353337]])=== | | ===RF POWER AMPLIFIER SYSTEM WITH MULTIPLE SUPPLY MODULATORS ([[US Patent Application 18353337. RF POWER AMPLIFIER SYSTEM WITH MULTIPLE SUPPLY MODULATORS simplified abstract|18353337]])=== |
| Line 359: |
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| | James Garrett | | James Garrett |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The patent application describes circuits and techniques to improve the efficiency of radio-frequency amplifiers, specifically power amplifiers.
| |
| − | * The technique used is called "supply modulation" or "drain modulation" or "collector modulation".
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| − | * Supply voltages provided to the amplifiers are adjusted dynamically based on the RF signal being synthesized.
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| − | * The supply voltage can be adjusted among discrete voltage levels or continuously on a short time scale for maximum efficiency improvements.
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| − | * The supply voltages can also be adapted to accommodate longer-term changes in the desired RF envelope, such as adjusting transmitter output strength to minimize errors in data transfer.
| |
| − | * This innovation aims to optimize the efficiency of RF amplifiers and adapt to variations in RF traffic.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | Described are circuits and techniques to increase the efficiency of radio-frequency (rf) amplifiers including rf power amplifiers (PAs) through “supply modulation” (also referred to as “drain modulation” or “collector modulation”), in which supply voltages provided to rf amplifiers is adjusted dynamically (“modulated”) over time depending upon the rf signal being synthesized. For the largest efficiency improvements, a supply voltage can be adjusted among discrete voltage levels or continuously on a short time scale. The supply voltages (or voltage levels) provided to an rf amplifier may also be adapted to accommodate longer-term changes in desired rf envelope such as associated with adapting transmitter output strength to minimize errors in data transfer, for rf “traffic” variations.
| |
| | | | |
| | ===RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE ([[US Patent Application 18349997. RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE simplified abstract|18349997]])=== | | ===RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE ([[US Patent Application 18349997. RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE simplified abstract|18349997]])=== |
| Line 378: |
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| | Morio TAKEUCHI | | Morio TAKEUCHI |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The patent application describes a radio-frequency module with multiple power amplifiers and filters.
| |
| − | * The module includes a first power amplifier and a second power amplifier.
| |
| − | * The first power amplifier amplifies signals in a first frequency band and outputs them.
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| − | * The second power amplifier amplifies signals in a second frequency band and outputs them.
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| − | * The module also includes a switch and multiple first filters.
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| − | * The first filters have pass bands within the first frequency band.
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| − | * The switch can connect the first power amplifier to the first filters.
| |
| − | * The module also includes a second filter with a pass band within the second frequency band.
| |
| − | * The second power amplifier is connected directly to the second filter without the switch.
| |
| − | * The second power amplifier has a higher output power level than the first power amplifier.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.
| |
| | | | |
| | ===RESONANCE DEVICE, COLLECTIVE BOARD, AND MANUFACTURING METHOD FOR RESONANCE DEVICE ([[US Patent Application 18354952. RESONANCE DEVICE, COLLECTIVE BOARD, AND MANUFACTURING METHOD FOR RESONANCE DEVICE simplified abstract|18354952]])=== | | ===RESONANCE DEVICE, COLLECTIVE BOARD, AND MANUFACTURING METHOD FOR RESONANCE DEVICE ([[US Patent Application 18354952. RESONANCE DEVICE, COLLECTIVE BOARD, AND MANUFACTURING METHOD FOR RESONANCE DEVICE simplified abstract|18354952]])=== |
| Line 401: |
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| | Yoshiyuki HIGUCHI | | Yoshiyuki HIGUCHI |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a resonance device that consists of two substrates bonded together.
| |
| − | * The first substrate contains a resonator.
| |
| − | * The second substrate has a power supply terminal connected to the upper electrode of the resonator and a ground terminal connected to the lower electrode.
| |
| − | * The first substrate has an inner wire that connects the upper electrode to the power supply terminal.
| |
| − | * The first substrate also has a coupling wire connected to the inner wire, with an end portion located at the outer edge of the substrate.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A resonance device is provided that includes a first substrate including a resonator; and a second substrate bonded to the first substrate. The second substrate includes a first power supply terminal electrically connected to an upper electrode of the resonator, and a ground terminal electrically connected to a lower electrode of the resonator. The first substrate includes a first inner wire that electrically connects the upper electrode to the first power supply terminal, and a first coupling wire connected to the first inner wire and having an end portion located at an outer edge of the first substrate.
| |
| | | | |
| | ===RESONANCE DEVICE AND MANUFACTURING METHOD FOR THE SAME ([[US Patent Application 18353442. RESONANCE DEVICE AND MANUFACTURING METHOD FOR THE SAME simplified abstract|18353442]])=== | | ===RESONANCE DEVICE AND MANUFACTURING METHOD FOR THE SAME ([[US Patent Application 18353442. RESONANCE DEVICE AND MANUFACTURING METHOD FOR THE SAME simplified abstract|18353442]])=== |
| Line 419: |
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| | Masakazu FUKUMITSU | | Masakazu FUKUMITSU |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The patent application describes a manufacturing method for a resonance device.
| |
| − | * The method involves preparing a collective board with power supply terminals and a coupling wire.
| |
| − | * The power supply terminals are connected to upper electrodes of multiple resonators.
| |
| − | * The first power supply terminals have two metal layers, with the second layer covering the first layer.
| |
| − | * The first coupling wire includes a portion of the first metal layer that extends from the region covered by the second metal layer.
| |
| − | * Before dividing the collective board into multiple resonance devices, the portion of the first metal layer extending from the region covered by the second metal layer is removed.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A manufacturing method is provided for a resonance device that includes preparing a collective board including first power supply terminals electrically connected to upper electrodes of a plurality of resonators, and a first coupling wire that electrically connects two or more of the first power supply terminals. The method includes dividing the collective board into a plurality of resonance devices. Moreover, the first power supply terminals include a first metal layer and a second metal layer covering the first metal layer. The first coupling wire includes a portion of the first metal layer that extends from a region covered with the second metal layer. The method further includes removing the portion of the first metal layer extending from the region covered with the second metal layer before the dividing the collective board into the plurality of resonance devices.
| |
| | | | |
| | ===ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE ([[US Patent Application 18222501. ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE simplified abstract|18222501]])=== | | ===ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE ([[US Patent Application 18222501. ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE simplified abstract|18222501]])=== |
| Line 438: |
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| | Kazunori INOUE | | Kazunori INOUE |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | - The patent application describes an acoustic wave device that includes a support substrate, a piezoelectric layer, and an interdigital transducer electrode.
| |
| − | - The support substrate has a thickness in one direction, and the piezoelectric layer extends in the same direction.
| |
| − | - The interdigital transducer electrode consists of first and second electrode fingers that extend in a direction perpendicular to the first direction.
| |
| − | - The second electrode fingers face corresponding first electrode fingers in a direction perpendicular to both the first and second directions.
| |
| − | - The support substrate has a recess on the side adjacent to the piezoelectric layer, which partially overlaps the interdigital transducer electrode.
| |
| − | - The recess is filled with a different material than the support substrate.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | An acoustic wave device includes a support substrate having a thickness in a first direction, a piezoelectric layer extending in the first direction of the support substrate, and an interdigital transducer electrode extending in the first direction of the piezoelectric layer and including first electrode fingers and second electrode fingers. The first electrode fingers extend in a second direction orthogonal to the first direction, and the second electrode fingers extend in the second direction and face corresponding ones of the first electrode fingers in a third direction orthogonal to the first and second directions. The support substrate has a recess on a side adjacent to the piezoelectric layer and at a position at least partially overlapping the interdigital transducer electrode in plan view in the first direction. A filling made of a material different from a material of the support substrate is included in a portion of the recess.
| |
| | | | |
| | ===ACOUSTIC WAVE DEVICE ([[US Patent Application 18355739. ACOUSTIC WAVE DEVICE simplified abstract|18355739]])=== | | ===ACOUSTIC WAVE DEVICE ([[US Patent Application 18355739. ACOUSTIC WAVE DEVICE simplified abstract|18355739]])=== |
| Line 457: |
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| | Tetsuya KIMURA | | Tetsuya KIMURA |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | - The patent application describes an acoustic wave device that includes a support substrate, a piezoelectric layer, and an interdigital transducer electrode.
| |
| − | - The ratio of the thickness of the piezoelectric layer to the distance between adjacent electrode fingers is less than or equal to 0.5.
| |
| − | - The interdigital transducer electrode has an intersection region where adjacent electrode fingers overlap.
| |
| − | - Two gap regions are located between the intersection region and the busbars of the electrode.
| |
| − | - The I-B gap, which is the dimension in which the multiple electrode fingers extend, is less than or equal to 1.1 times the distance between centers of adjacent electrode fingers in at least one of the two gap regions.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | An acoustic wave device is provided that includes a support substrate, a piezoelectric layer on the support substrate, and an interdigital transducer electrode. A ratio d/p is less than or equal to approximately 0.5, where d is a thickness of the piezoelectric layer and p is a distance between centers of adjacent electrode fingers of the multiple electrode fingers. The interdigital transducer electrode includes an intersection region in which the adjacent electrode fingers overlap when viewed in a direction in which multiple electrode fingers face each other. Moreover, two gap regions are located between the intersection region and a corresponding one of the two busbars and includes an I-B gap that is a dimension in a direction in which the multiple electrode fingers extend. The I-B gap of at least one of the two gap regions is less than or equal to about 1.1p.
| |
| | | | |
| | ===ACOUSTIC WAVE DEVICE, FILTER DEVICE, AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE ([[US Patent Application 18341775. ACOUSTIC WAVE DEVICE, FILTER DEVICE, AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE simplified abstract|18341775]])=== | | ===ACOUSTIC WAVE DEVICE, FILTER DEVICE, AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE ([[US Patent Application 18341775. ACOUSTIC WAVE DEVICE, FILTER DEVICE, AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE simplified abstract|18341775]])=== |
| Line 475: |
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| | Yutaka KISHIMOTO | | Yutaka KISHIMOTO |
| | | | |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The patent application describes an acoustic wave device with a piezoelectric substrate and electrodes.
| |
| − | * The device includes a piezoelectric layer and a hollow portion.
| |
| − | * The piezoelectric layer has three regions in plan view: a first region that overlaps the electrodes and the hollow portion, a second region that surrounds the first region, and a third region that overlaps the hollow portion and is located between the first and second regions.
| |
| − | * The border between the first and third regions in the cross-sectional shape of the device has a curved-surface shape.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | An acoustic wave device that includes a piezoelectric substrate that has a piezoelectric layer and a hollow portion, and first and second electrodes and. The piezoelectric layer has a first region that overlaps the first and second electrodes and the hollow portion in plan view, a second region that does not overlap the hollow portion and surrounds the first region in plan view, and a third region that overlaps the hollow portion and is located between the first region and the second region in plan view. A portion including the border between the first region and the third region of a cross-sectional shape in a lamination direction of the piezoelectric substrate includes a curved-surface shape.
| |
| | | | |
| | ===ACOUSTIC WAVE DEVICE ([[US Patent Application 18220854. ACOUSTIC WAVE DEVICE simplified abstract|18220854]])=== | | ===ACOUSTIC WAVE DEVICE ([[US Patent Application 18220854. ACOUSTIC WAVE DEVICE simplified abstract|18220854]])=== |
| Line 491: |
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| | | | |
| | Kentaro NAKAMURA | | Kentaro NAKAMURA |
| − |
| |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The patent application describes an acoustic wave device that consists of several layers and electrodes.
| |
| − |
| |
| − | * The device includes a crystal substrate, which serves as a base.
| |
| − | * A layer of silicon carbide is deposited on top of the crystal substrate.
| |
| − | * On top of the silicon carbide layer, there is a layer of lithium tantalate.
| |
| − | * Finally, an interdigital transducer electrode is placed on the lithium tantalate layer, which consists of multiple first and second electrode fingers.
| |
| − |
| |
| − | The innovation in this patent application lies in the specific combination of materials and layers used in the acoustic wave device.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | An acoustic wave device includes a crystal substrate, a silicon carbide layer on the crystal substrate, a lithium tantalate layer on the silicon carbide layer, and an interdigital transducer electrode on the lithium tantalate layer and including multiple first and second electrode fingers.
| |
