US Patent Application 18222501. ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE simplified abstract
Contents
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Kazunori Inoue of Nagaokakyo-shi (JP)
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18222501 titled 'ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE
Simplified Explanation
- The patent application describes an acoustic wave device that includes a support substrate, a piezoelectric layer, and an interdigital transducer electrode. - The support substrate has a thickness in one direction, and the piezoelectric layer extends in the same direction. - The interdigital transducer electrode consists of first and second electrode fingers that extend in a direction perpendicular to the first direction. - The second electrode fingers face corresponding first electrode fingers in a direction perpendicular to both the first and second directions. - The support substrate has a recess on the side adjacent to the piezoelectric layer, which partially overlaps the interdigital transducer electrode. - The recess is filled with a different material than the support substrate.
Original Abstract Submitted
An acoustic wave device includes a support substrate having a thickness in a first direction, a piezoelectric layer extending in the first direction of the support substrate, and an interdigital transducer electrode extending in the first direction of the piezoelectric layer and including first electrode fingers and second electrode fingers. The first electrode fingers extend in a second direction orthogonal to the first direction, and the second electrode fingers extend in the second direction and face corresponding ones of the first electrode fingers in a third direction orthogonal to the first and second directions. The support substrate has a recess on a side adjacent to the piezoelectric layer and at a position at least partially overlapping the interdigital transducer electrode in plan view in the first direction. A filling made of a material different from a material of the support substrate is included in a portion of the recess.
