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Category:H01L23/24
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Pages in category "H01L23/24"
The following 7 pages are in this category, out of 7 total.
1
- 17823189. DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER simplified abstract (Micron Technology, Inc.)
- 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
- 18496920. MULTI-CHIP PACKAGE HAVING STRESS RELIEF STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
