Category:B26D1/06

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Pages in category "B26D1/06"

The following 4 pages are in this category, out of 4 total.

1

18132169. BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

S

Samsung electronics co., ltd. (20240091968). BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME simplified abstract
Samsung Electronics Co., Ltd. patent applications on March 21st, 2024

U

US Patent Application 18325414. CUTTING DEVICE INCLUDING FIRST BLADE EDGE PORTION, AND SECOND BLADE EDGE PORTION IN WHICH SHEARING ANGLE AT CENTER PORTION IS LARGER THAN SHEARING ANGLE AT END PORTIONS simplified abstract

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