Samsung electronics co., ltd. (20240091968). BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME simplified abstract
Contents
- 1 BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME
Organization Name
Inventor(s)
Younhwan Shin of Suwon-si (KR)
BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240091968 titled 'BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME
Simplified Explanation
The abstract describes a blade for sawing a panel that includes two blade portions, one for sawing along a first direction and the other for sawing along a second direction perpendicular to the first direction.
- The blade has a first blade portion for sawing the panel along a first direction.
- The panel contains panel level packages (PLPs) arranged in both the first and second directions.
- The blade also has a second blade portion on the upper surface of the first blade portion for sawing along the second direction.
- The width of the second blade portion is greater than the width of the first blade portion.
Potential Applications
This technology could be used in industries that require precise cutting of panels with PLPs arranged in multiple directions, such as electronics manufacturing or woodworking.
Problems Solved
This blade design solves the problem of efficiently cutting panels with PLPs arranged in different directions without the need for multiple cutting tools or processes.
Benefits
- Increased efficiency in cutting panels with complex arrangements of PLPs. - Simplified cutting process by using a single blade with multiple cutting directions.
Potential Commercial Applications
"Blade for Sawing Panels with Multiple Directions" could find applications in industries like electronics manufacturing, furniture making, and construction for cutting panels with precision and speed.
Possible Prior Art
There may be prior art related to blades designed for cutting panels with complex arrangements, but specific information on similar technologies is not provided in the abstract.
Unanswered Questions
How does this blade design compare to existing cutting tools in terms of efficiency and precision?
This article does not provide a direct comparison between this blade design and existing cutting tools in terms of efficiency and precision.
What materials are recommended for manufacturing this blade to ensure durability and longevity?
The abstract does not mention the recommended materials for manufacturing this blade to ensure durability and longevity.
Original Abstract Submitted
a blade for sawing a panel, including a first blade portion configured to saw the panel along a first direction, wherein the panel includes a plurality of panel level packages (plps) arranged in the first direction and a second direction which is substantially perpendicular to the first direction; and a second blade portion arranged on an upper surface of the first blade portion, and configured to saw the panel along the second direction, wherein a width of the second blade portion is greater than a width of the first blade portion.
