18536073. WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
Contents
- 1 WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS
Organization Name
Inventor(s)
Vladimir Odnoblyudov of Eagle ID (US)
WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18536073 titled 'WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS
Simplified Explanation
The abstract describes a method for wafer-level packaging of solid-state transducers (SSTs) by forming a transducer structure with separators to demarcate individual SSTs, a support substrate on one surface, and discrete optical elements on the other surface. The method also includes dicing the SSTs along the separators.
- The method involves forming a transducer structure with separators to define individual SSTs.
- A support substrate is formed on one surface of the transducer structure.
- Discrete optical elements are formed on the other surface of the transducer structure.
- The separators act as barriers between the discrete optical elements.
- The SSTs are diced along the separators to separate them.
Potential Applications
The technology can be applied in various fields such as medical imaging, industrial sensing, and consumer electronics.
Problems Solved
This technology solves the problem of efficiently packaging and separating solid-state transducers in a wafer-level process.
Benefits
The benefits of this technology include improved manufacturing efficiency, precise demarcation of individual transducers, and enhanced performance of SST devices.
Potential Commercial Applications
Potential commercial applications of this technology include ultrasound imaging devices, industrial sensors, and optical communication systems.
Possible Prior Art
One possible prior art could be the use of traditional packaging methods for solid-state transducers, which may not be as efficient or precise as the wafer-level packaging method described in this patent application.
Unanswered Questions
How does this technology compare to existing packaging methods in terms of cost and performance?
The article does not provide a direct comparison between this wafer-level packaging method and traditional packaging methods in terms of cost-effectiveness and performance.
Are there any limitations or challenges in implementing this wafer-level packaging method on a larger scale?
The article does not address any potential limitations or challenges that may arise when implementing this technology on a larger scale, such as scalability or production yield issues.
Original Abstract Submitted
Wafer-level packaging of solid-state transducers (“SSTs”) is disclosed herein. A method in accordance with a particular embodiment includes forming a transducer structure having a first surface and a second surface opposite the first surface, and forming a plurality of separators that extend from at least the first surface of the transducer structure to beyond the second surface. The separators can demarcate lateral dimensions of individual SSTs. The method can further include forming a support substrate on the first surface of the transducer structure, and forming a plurality of discrete optical elements on the second surface of the transducer structure. The separators can form barriers between the discrete optical elements. The method can still further include dicing the SSTs along the separators. Associated SST devices and systems are also disclosed herein.
