18452695. SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
Contents
SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS
Organization Name
Inventor(s)
Kyle K. Kirby of Eagle ID (US)
SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18452695 titled 'SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS
Simplified Explanation
The patent application describes a semiconductor memory stack connected to a processing unit, along with associated methods and systems. The memory stack includes memory dies attached to a memory controller die, and the processing unit is attached to the memory controller die without an interposer. The memory stack and processing unit can be attached to a package substrate without an interposer as well.
- The semiconductor memory stack includes memory dies attached to a memory controller die.
- The processing unit is attached to the memory controller die without an interposer.
- The memory stack and processing unit can be attached to a package substrate without an interposer.
Potential Applications
This technology can be applied in various fields, including:
- Data centers
- High-performance computing
- Artificial intelligence and machine learning systems
- Gaming consoles
- Mobile devices
Problems Solved
This technology addresses several challenges in semiconductor memory systems, such as:
- Signal travel distance and latency between the memory stack and processing unit
- Complex interposer designs and manufacturing processes
- Cost and complexity associated with interposer integration
Benefits
The use of this technology offers several advantages, including:
- Shortest possible route for signals between the memory stack and processing unit
- Simplified design and manufacturing processes without the need for interposers
- Improved performance and reduced latency in memory systems
- Cost savings in production and integration of memory stacks and processing units
Original Abstract Submitted
A semiconductor memory stack connected to a processing unit, and associated methods and systems are disclosed. In some embodiments, the semiconductor memory stack may include one or more memory dies attached to and carried by a memory controller die—e.g., high-bandwidth memory. Further, a processing unit (e.g., a processor) may be attached to the memory controller die without an interposer to provide the shortest possible route for signals traveling between the semiconductor memory stack and the processing unit. In addition, the semiconductor memory stack and the processing unit can be attached to a package substrate without an interposer.
