18374421. UNIFIED SOLID-STATE DRIVE ENCLOSURE DESIGN simplified abstract (Micron Technology, Inc.)
Contents
- 1 UNIFIED SOLID-STATE DRIVE ENCLOSURE DESIGN
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 UNIFIED SOLID-STATE DRIVE ENCLOSURE DESIGN - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
UNIFIED SOLID-STATE DRIVE ENCLOSURE DESIGN
Organization Name
Inventor(s)
Suresh Reddy Yarragunta of Bangalore (IN)
Koneri Sathyanarayana Guptha Amith of Banaswadi (IN)
Deepu Narasimiah Subhash of Yeshwanthpu (IN)
UNIFIED SOLID-STATE DRIVE ENCLOSURE DESIGN - A simplified explanation of the abstract
This abstract first appeared for US patent application 18374421 titled 'UNIFIED SOLID-STATE DRIVE ENCLOSURE DESIGN
Simplified Explanation
The abstract describes a patent application for a solid-state drive (SSD) enclosure design that is adaptable for different printed circuit board assemblies (PCBA). The design includes a three-piece construction with a top enclosure, bottom enclosure, and an intermediate structure containing heatsinks for heat transfer.
- Three-piece SSD enclosure design
- Adaptable for different PCBA
- Includes heatsinks for heat transfer
- Top enclosure with vents for airflow
Potential Applications
The technology can be applied in various industries such as data storage, computer hardware, and electronics manufacturing.
Problems Solved
- Heat dissipation in SSDs - Adaptability for different PCBA configurations
Benefits
- Improved thermal management - Easy customization for different PCBA - Enhanced reliability and performance of SSDs
Potential Commercial Applications
"Adaptable SSD Enclosure Design for Improved Thermal Management"
Possible Prior Art
There may be prior art related to SSD enclosure designs with heat dissipation features, but specific examples are not provided in the abstract.
Unanswered Questions
How does the three-piece construction impact the overall durability of the SSD enclosure design?
The durability of the SSD enclosure design may be influenced by the materials used for the top and bottom enclosures, as well as the structural integrity of the intermediate heatsink structure.
Are there any limitations to the adaptability of the design for different PCBA configurations?
The abstract mentions that the heatsinks can be changed for different PCBA without altering the top or bottom enclosures, but it is unclear if there are any restrictions or compatibility issues with certain PCBA configurations.
Original Abstract Submitted
Example embodiments are directed to a solid-state drive (SSD) enclosure design that is adaptable for different printed circuit board assemblies (PCBA). The SSD enclosure design comprises a three-piece construction that includes a top enclosure, a bottom enclosure, and an intermediate structure. The bottom enclosure is coupled to the top enclosure to form a housing for a PCBA having NOT AND (NAND) devices and a controller. The intermediate structure is coupled to the PCBA and positioned between the top enclosure and the bottom enclosure within the housing. The intermediate structure comprises a plurality of heatsinks to transfer heat from the NAND devices and a controller heatsink to transfer heat from the controller, whereby the type and location of the heatsinks can be changed for a different PCBA without having to change the top enclosure or bottom enclosure. The top enclosure can include vents that allow air to flow through.
