18239427. INTEGRATED BRACKET FOR ENHANCED HEAT DISSIPATION simplified abstract (Micron Technology, Inc.)
Contents
INTEGRATED BRACKET FOR ENHANCED HEAT DISSIPATION
Organization Name
Inventor(s)
Abhiash Ramamurthy Nag of Bangalore (IN)
Suresh Reddy Yarragunta of Bangalore (IN)
INTEGRATED BRACKET FOR ENHANCED HEAT DISSIPATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18239427 titled 'INTEGRATED BRACKET FOR ENHANCED HEAT DISSIPATION
Simplified Explanation
The patent application is for an input/output (IO) bracket for a solid-state drive (SSD) that includes a faceplate and at least one heat pipe coupled to the faceplate to transfer heat from the controller of the SSD.
- The IO bracket includes a faceplate and at least one heat pipe.
- The heat pipe extends horizontally from the faceplate and is coupled to the controller of the SSD.
- The heat pipe transfers heat from the controller out of the SSD.
- By coupling the controller to the heat pipe, the main heatsink can efficiently dissipate heat from the remaining components of the SSD.
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- Potential Applications
- Solid-state drives (SSDs)
- Computer hardware manufacturing
- Problems Solved
- Efficient heat dissipation in SSDs
- Heat management in computer hardware
- Benefits
- Improved thermal performance
- Increased reliability of SSDs
- Enhanced overall system performance
Original Abstract Submitted
Example embodiments are directed to an input/output (IO) bracket that may be used in a solid-state drive (SSD), the IO bracket comprises a faceplate and at least one heat pipe coupled to the faceplate that extends horizontally from a surface of the faceplate. The at least one heat pipe is configured to be coupled to a controller of the SSD in order to transfer heat from the controller out of the SSD. By coupling the controller to the heat pipe instead of a main heatsink, the main heatsink can efficiently dissipate heat from remaining components of the SSD.
