18236146. APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MANUFACTURING THE SAME simplified abstract (Micron Technology, Inc.)

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APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MANUFACTURING THE SAME

Organization Name

Micron Technology, Inc.

Inventor(s)

Suresh Reddy Yarragunta of Bangalore (IN)

Deepu Narasimiah Subhash of Bangalore (IN)

APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18236146 titled 'APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MANUFACTURING THE SAME

Simplified Explanation

The patent application describes an apparatus that includes a heat sink with parallel fins, which create channels for directing the flow of air or coolant across the heat sink. The channels have varying widths, wider near the inlet and narrower near the outlet.

  • The apparatus includes a heat sink with parallel fins.
  • The fins create colinear channels for directing the flow of air or coolant.
  • The channels have wider widths closer to the inlet and narrower widths closer to the outlet.
  • The purpose is to optimize the flow of air or coolant across the heat sink.

Potential Applications

This technology could be applied in various industries and systems where efficient cooling is required, such as:

  • Electronics and computer systems
  • Automotive cooling systems
  • Industrial machinery and equipment
  • Power generation and distribution systems

Problems Solved

The innovation addresses the following problems:

  • Inefficient cooling due to uneven distribution of air or coolant flow across the heat sink.
  • Heat sink performance limitations caused by inadequate heat dissipation.
  • Overheating issues in electronic devices and systems.

Benefits

The technology offers several benefits:

  • Improved cooling efficiency by optimizing the flow of air or coolant across the heat sink.
  • Enhanced heat dissipation capabilities, leading to better performance and reliability.
  • Reduction in overheating-related problems, extending the lifespan of electronic devices and systems.


Original Abstract Submitted

An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.

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